Claims
- 1. A process for the production of thin layers of a composition of a metal M from Group IV B of the periodic system, nitrogen and oxygen, having a formula of MN.sub.x O.sub.y wherein .sub.x and .sub.y each ranges from about 0.1 to about 1.7, by means of reactive vacuum deposition or activated reactive vacuum deposition, wherein, during the deposition of the metal from Group IV B of the periodic system, maintaining a gas atmosphere comprising N.sub.2 and O.sub.2 gas, and controlling deposition of evaporated metal particles onto a heatable substrate via total gas pressure p.sub.tot, evaporation rate r, substrate temperature T.sub.sub and distance 1 between a metal evaporation source and a substrate, in which case these parameters lie in the ranges
- T.sub.sub =20.degree. to 400.degree. C.,
- 1=0.01 to 1.5 m,
- the partial pressure ratio of the gases N.sub.2 and O.sub.2 ; (p.sub.N2 /p.sub.O2)=1 to 2,000,
- p.sub.tot =2.times.10.sup.-5 hPa-4.times.10.sup.-2 hPa,
- r=0.01 to 60 nm/s,
- so that layers with a volume share of voids of from 2 to 45% arises, whose size lies in the range from (0.5 nm).sup.3 to (100 nm).sup.3.
- 2. Process according to claim 1, wherein the layer is applied to a metallic substrate selected from the group consisting of molybdenum, silver, gold, copper, aluminum, tungsten, nickel, chromium, zirconium, titanium, hafnium, tantalum, niobium, vanadium, iron and their alloys.
- 3. Process according to claim 1, wherein the layer thickness is from 30 to 120 nm.
- 4. Process according to claim 2, wherein the layer thickness is from 30 to 120 nm.
- 5. Process according to claim 1, wherein the gas atmosphere comprises H.sub.2 O and volatile compounds of carbon.
- 6. Process according to claim 2, wherein the gas atmosphere comprises H.sub.2 O and volatile compounds of carbon.
- 7. A process according to claim 1, wherein the gas atmosphere further comprises at least one gas selected from the group consisting of CH.sub.4 and noble gases.
- 8. A process for the production of thin layers on a substrate of material comprising chemical compounds of one or more metals (M) of group IV B of the periodic system, nitrogen (N) and oxygen (O), said process comprising:
- depositing metal from Group IV B of the periodic system;
- maintaining a gas atmosphere during said depositing wherein the atmosphere comprises at least one gas selected from the group consisting of N.sub.2, O.sub.2, CH.sub.4, and noble gases,
- controlling the total gas pressure p.sub.tot between about 2.times.10.sup.-5 h Pa and about 4.times.10.sup.-2 h Pa,
- controlling the evaporation rate r between about 0.01 and about 60 nm/s,
- controlling the substrate temperature T.sub.sub between about 20.degree. and about 400.degree. C.,
- controlling the distance 1 between a metal evaporation source and the substrate between about 0.01 and about 1.5 m, wherein the layers comprise a volume share of voids of from about 2 to about 45%, wherein the size of the voids range from about (0.5 nm).sup.3 to about (100 nm).sup.3.
- 9. A process according to claim 8, wherein said substrate comprises a material selected from the group consisting of molybdenum, silver, gold, copper, aluminum, tungsten, nickel, chromium, zirconium, titanium, hafnium, tantalum, niobium, vanadium, iron and alloys of these materials.
- 10. A process according to claim 8, wherein the thickness of said layer is from about 30 nm to about 120 nm.
- 11. A process according to claim 8, wherein the gas atmosphere in said maintaining step further comprises H.sub.2 O and volatile compounds of carbon.
- 12. A process according to claim 8, wherein said depositing comprises reactive vacuum deposition.
- 13. A process according to claim 8, wherein said depositing comprises activated reactive vacuum deposition.
- 14. A process as in claim 8, further comprising coating the layers with at least one additional layer of oxide.
- 15. A process as in claim 14, wherein the additional layer of said coating the layers comprises an oxide selected from the group consisting of SiO.sub.2, ZrO.sub.2, HfO.sub.2, Al.sub.2 O.sub.3, and Y.sub.2 O.sub.3.
Priority Claims (1)
Number |
Date |
Country |
Kind |
43 44 258.7 |
Dec 1993 |
DEX |
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CONTINUATION STATEMENT
The present application is a division of patent application Ser. No. 08/276,026, filed 15 Jul. 1994, now U.S. Pat. No. 5,670,248.
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4098956 |
Blickensderfer et al. |
Jul 1978 |
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4861669 |
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5336565 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
276026 |
Jul 1994 |
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