Claims
- 1. An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate, said method comprising:
(a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing said covered non-metallic substrate obtained in step (a) to a reducing solution comprising a reducing agent for reducing the metal ions that cover the substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state.
- 2. The article of manufacture of claim 1, said article being selected from the group of: ULSI device, PCB, IC and LCD.
- 3. The article of manufacture of claim 1, wherein said method further comprises, after step (a) and before step (b), the steps of:
(a1) exposing said covered non-metallic substrate obtained in step (a) to a solution that imparts water insolubility to said layer of non-precious metal ions covering the substrate; and (a2) rinsing with water.
- 4. The article of manufacture of claim 1, wherein said reducing solution further comprises at least one of a metal and a metal compound, said metal being selected from the group of: group Ib, group VIII and the Lanthanides.
- 5. The article of manufacture of claim 1, wherein said non-precious metal ions in step (a) comprises copper ions.
- 6. The article of manufacture of claim 1, wherein the non-metallic substrate comprises organic polymers and a silicon comprising material.
- 7. The article of manufacture of claim 1, wherein said reducing agent is a borane reducing agent.
- 8. The article of manufacture of claim 1, wherein said reducing agent is dimethylamino borane (DMAB).
- 9. The article of manufacture of claim 4, wherein said at least one of a metal and a metal compound used in said reducing solution is selected from the group of: silver, a silver compound, copper and a copper compound.
- 10. The article of manufacture of claim 4 wherein said reducing solution reacts with said at least one of a metal and a metal compound to produce a metal hydride.
- 11. The article of manufacture of claim 1 wherein said method further comprises the step of:
(c) contacting the covered substrate obtained in step (b) with an electroless copper plating bath.
- 12. The article of manufacture of claim 1 wherein said method further comprises the step of:
(c) electroplating the covered substrate obtained in step (b) with copper.
- 13. An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate, comprising:
(a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; (b) exposing said covered non-metallic substrate obtained in step (a) to a solution that imparts water-rinse insolubility to said layer of non-precious metal ions covering the substrate; (c) rinsing with water; and (d) exposing said covered non-metallic substrate obtained in step (c) to a reducing solution comprising a reducing agent for reducing the metal ions that cover the substrate from their oxidation state in step (c) to a lower oxidation state, preferably to zero valence state.
- 14. An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate, comprising:
(a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing said covered non-metallic substrate obtained in step (a) to a reducing solution comprising: a reducing agent for reducing the metal ions that cover said substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state; and at least one of a metal and a metal compound, said metal being selected from the group of: group Ib, group VIII and the Lanthanides.
- 15. An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate, comprising:
(a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; (b) exposing said covered non-metallic substrate obtained in step (a) to a solution that imparts water-rinse insolubility to said layer of non-precious metal ions covering the substrate; (c) rinsing with water; and (d) exposing said covered non-metallic substrate obtained in step (c) to a reducing solution comprising: a reducing agent for reducing the metal ions that cover the substrate from their oxidation state in step (c) to a lower oxidation state, preferably to zero valence state; and at least one of a metal and a metal compound, said metal being selected from the group of: group Ib, group VIII and the Lanthanides.
- 16. A workpiece comprising a nonmetallic substrate covered with a layer of copper hydride according to the method of claim 1.
- 17. A workpiece comprising a nonmetallic substrate having a surface covered with a black film according to the method of claim 1.
- 18. A composition comprising a reducing agent and at least one of a metal and a metal compound, said metal being selected from the group of: group Ib, group VIII and the Lanthanides.
- 19. A composition according to claim 18 for use in a method for plating a metallic layer on the surface of a non-metallic substrate.
Priority Claims (3)
Number |
Date |
Country |
Kind |
150364 |
Jun 2002 |
IL |
|
150577 |
Jul 2002 |
IL |
|
150940 |
Jul 2002 |
IL |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a divisional application of U.S. patent application Ser. No. 10/307,510, filed Dec. 2, 2002.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10307510 |
Dec 2002 |
US |
Child |
10805527 |
Mar 2004 |
US |