Claims
- 1. A method for providing support to a printed circuit board, the method comprising the steps of:positioning a printed circuit board over a flexible pin support, the flexible pin support comprising a plurality of elongate support members, a component which assists in profiling the plurality of elongate support members, and a mechanism to maintain the plurality of elongate support members in a profiled position while applying a force onto the printed circuit board; positioning a planarity maintaining support member and the printed circuit board whereby the planarity maintaining support member provides a planar force to the printed circuit board that opposes a profiling force applied to the printed circuit board by the plurality of elongate support members, and holding the plurality of elongate support members in a profiled position.
- 2. The method of claim 1, wherein the planarity maintaining support member used to provide a planar force is a solder stencil.
- 3. The method of claim 2, wherein a backing object is placed onto the solder stencil to assist in applying a planar force.
- 4. The method of claim 3, wherein the backing object comprises at least one solder application apparatus.
- 5. The method of claim 4, wherein the at least one solder application apparatus comprises at least one solder squeegee.
- 6. The method of claim 1, wherein the flexible pin support further comprises at least one of fluid, springs and a resistive member to provide a means for profiling the plurality of elongate support members.
- 7. The method of claim 1, wherein the method further comprises the step of coupling a planarity maintaining support member to the printed circuit board.
- 8. A method of reinforcing a printed circuit board during a profiling process of a flexible, self-conforming workpiece support apparatus, the method comprising the steps of:positioning a printed circuit board and a reinforcing member proximate each other; profiling a plurality of elongate support members of a flexible self-conforming workpiece support apparatus; and holding the plurality of elongate support members to a profiled position.
- 9. The method of claim 8, wherein the method further comprises the step of coupling the reinforcing member to the printed circuit board.
- 10. The method of claim 8, wherein the method further comprises the step of holding the printed circuit board using a clamping mechanism coupled to a conveyor.
- 11. A method for providing support to a printed circuit board, the method comprising the steps of:positioning a printed circuit board over a flexible pin support, the flexible pin support comprising a plurality of elongate support members, a component which assists in profiling the plurality of elongate support members, and a mechanism to maintain the plurality of elongate support members in a profiled position while applying a force onto the printed circuit board; positioning a planarity maintaining support member and the printed circuit board whereby the planarity maintaining support member provides a planar force to the printed circuit board that opposes a profiling force applied to the printed circuit board by the plurality of elongate support members; and, holding the plurality of elongate support members in a profiled position; and at least one of the following assembly processes: 1) applying solder paste to the printed circuit board, 2) applying adhesive to the printed circuit board, and 3) placing components onto the printed circuit board.
- 12. The method of claim 11, wherein the assembly process is at least one of applying solder paste to the printed circuit board and applying adhesive to the printed circuit board, and the planarity maintaining support member used to provide a planar force is a solder stencil.
- 13. The method of claim 12, wherein a backing object is placed onto the solder stencil to assist in applying a planar force.
- 14. The method of claim 13, wherein the backing object comprises at least one solder application apparatus.
- 15. The method of claim 14, wherein the at least one solder application apparatus comprises at least one solder squeegee.
- 16. The method of claim 11, wherein the flexible pin support further comprises at least one of fluid, springs and a resistive member to provide a means for profiling the plurality of elongate support members.
- 17. The method of claim 11, wherein the method further comprises the step of coupling a planarity maintaining support member to the printed circuit board.
Parent Case Info
This is a divisional application of Ser. No. 09/597,905 filed Jun. 19, 2000 as a CIP of Ser. No. 09/253,238 filed Feb. 19, 1999, (Now U.S. Pat. No. 6,264,187 Issued Jul. 24, 2001) which is a CIP of Ser. No. 09/170,016 filed Oct. 13, 1998, (Now U.S. Pat. No. 6,029,966, Issued Feb. 29, 2000).
US Referenced Citations (15)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
09/253238 |
Feb 1999 |
US |
Child |
09/597905 |
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US |
Parent |
09/170016 |
Oct 1998 |
US |
Child |
09/253238 |
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US |