This application claims priority to Taiwan Application Serial Number 96139063, filed Oct. 18, 2007, which is herein incorporated by reference.
1. Field of Invention
The present invention relates to a molding coil structure. More particularly, the present invention relates to a method for fabricating a molding structure coil.
2. Description of Related Art
Inductors are important elements of electronic circuits. Inductors can be used to store and release energy. Inductors eliminate disturbance from magnetic fields therefore making them ideal for implementation in today's shrinking electronic products. Many countries are making rules to set up a standard for the inductors. The inductor has thus becomes an important element of the electronic circuits.
The conventional method for fabricating an inductor with the molding coil structure is depicted in
Accordingly, what is needed is a molding coil structure and a method for fabricating a molding coil structure to overcome the above issues. The present invention addresses such a need.
The present invention is directed to a method of fabricating a molding coil structure comprising the steps of forming at least one metal wire into a metal coil; forming a metal powder pillar with a high-pressure fabrication process; placing the metal powder pillar into the center of the metal coil; placing the metal coil and the metal pillar into a mold; and stuffing a plurality of metal powder particles with high-pressure to form a covering structure surrounding and contacting the metal powder pillar and the metal coil to form the molding coil structure.
It is another objective of the present invention to provide a molding coil structure comprising a metal coil; a metal powder pillar placed in a center of the metal coil; and a covering structure comprising a plurality of metal powder particles, wherein the covering structure covers the metal coil and the metal powder pillar.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
The invention can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Please refer to
The round iron powder pillar 21 of the molding coil structure 2 has a very high density. The high density is a result of the high-pressure process over 25 tons/square inch during the formation of the powder pillar. The high density powder pillar at the center of the molding coil structure 2 improves the overall performance of the inductor. The round iron powder pillar 21 further provides a supporting mechanism that enables the copper coil 20 to withstand pressures higher than 20 tons/square inch>, Thus the iron powder particles can increase their density as well to improve the performance of the molding coil structure 2.
Please refer to
The molding coil structure 3 in the first embodiment has a high density iron powder round pillar 31 that results from the high-pressure process in the center and enables the inductor to have an improved performance. The spaces between the iron powder sub-square pillars provide better inductor performance. The iron powder square pillar 31 further provides a supporting mechanism to make the copper coil 30 able to withstand pressures higher than 20 tons/square inch., Thus the iron powder particles can increase their density as well improve the performance of the molding coil structure 3.
The third embodiment of the present invention is a method for fabricating a molding coil structure. First, in step 401 at least one metal wire is formed into a metal coil; in step 402 metal powder pillar is formed with a high-pressure fabrication process; then, in step 403 the metal powder pillar is placed into the center of the metal coil; then, in step 404 the metal coil and the metal pillar are placed into a mold; and in step 405 a plurality of metal powder particles are exposed to high-pressure treatment to form a covering structure surrounding and contacting the metal powder pillar and the metal coil to form the molding coil structure. Two ends of the metal coil are exposed out of the covering structure and are electrically connected to an external circuit.
The fourth embodiment of the present invention is a method for fabricating a molding coil structure. In the first, step 501 at least one metal wire is formed into a metal coil; then, in step 502 a plurality of metal powder sub-pillars are formed with a high-pressure fabrication process. Then, in step 503 a metal powder pillar is formed with a plurality of metal powder sub-pillars; then, in step 504 the metal powder pillar is placed into the center of the metal coil; then, in step 505 the metal coil and the metal pillar are placed into a mold; and in step 506 a plurality of metal powder particles are exposed to a high-pressure to form a covering structure surrounding and contacting the metal powder pillar and the metal coil to form the molding coil structure. Two ends of the metal coil are exposed out of the covering structure and are electrically connected to an external circuit.
The above embodiments show that the metal powder pillar made by a high-pressure process of over 25 tons/square inch has a high density structure and provides a supporting mechanism while stuffing the metal powder particles under high-pressure without breaking the metal coil, further increase the performance of the molding coil structure. Also, the metal powder pillar comprising a plurality of metal powder sub-pillars can improve the performance due to the space between each of the metal powder sub-pillars.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims.
Number | Date | Country | Kind |
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96139063 | Oct 2007 | TW | national |