Patent Application
20130071792
The present disclosure relates to methods for fabricating liquid crystal display devices in which a pair of substrates are layered, with a predetermined space interposed therebetween, and liquid crystal is sealed in the gap between the pair of substrates.
Liquid crystal display devices, which are a type of display device, are thin and light, and thus widely used as mobile devises, such as laptop computers and mobile phones, and AV devices, such as liquid crystal television.
In general, liquid crystal display devices include a pair of substrates arranged to face each other (i.e., a thin film transistor (TFT) substrate and a color filter (CF) substrate), and a liquid crystal layer interposed between the pair of substrates. The liquid crystal display devices further include a frame-like sealing material for having the pair of substrates adhere to each other and sealing liquid crystal between the substrates, and a plurality of spacers for regulating a thickness (i.e., a cell gap) of the liquid crystal layer.
Examples of the liquid crystal display device include an active matrix type liquid crystal display device in which an active element such as a TFT is provided to correspond to each of pixel regions, and a wiring provided on an insulating substrate such as a glass substrate is connected, via the active element, to a pixel electrode provided to correspond to each of the pixel regions.
In this active matrix type liquid crystal display device, the active element is provided between the wiring and the pixel electrode so as to be connected to the wiring and the pixel electrode, and the active element controls a potential applied to the pixel electrode from the wiring.
With an increase in amount of information, the liquid crystal display devices are requested to display more information, and there is an increasing demand from the market for higher contrast and wider viewing angle.
Thus, in recent years, a vertically-aligned mode using a vertically-aligned liquid crystal layer is receiving attention as a display mode of a transflective type liquid crystal display device capable of higher contrast and wider viewing angle. In general, the vertically-aligned liquid crystal layer is made of an alignment film containing vertically-aligned liquid crystal molecules, and a liquid crystal material with negative dielectric anisotropy.
Here, liquid crystal display devices having a protrusion which protrudes toward the liquid crystal layer to achieve a stable alignment state of the liquid crystal have been suggested. More specifically, for example, a liquid crystal display device having, on at least one of electrodes provided on opposing surfaces of the pair of substrates, a protrusion for regulating the alignment of the liquid crystal is disclosed (see, e.g., Patent Document 1).
However, in the above conventional liquid crystal display device, it is necessary to perform another step for forming the protrusion for regulating the alignment of the liquid crystal. Thus, the number of steps and the costs are increased.
The present disclosure was made in view of the above problems, and it is an objective of the invention to provide a method for fabricating a liquid crystal display device in which a protrusion can be formed without increasing the number of fabrication steps.
To achieve the above objective, a method for fabricating a liquid crystal display device of the present disclosure includes a first substrate; a second substrate located to face the first substrate; a liquid crystal layer provided between the first substrate and the second substrate; a plurality of photo spacers provided between the first substrate and the second substrate to regulate a thickness of the liquid crystal layer; and a protrusion provided between the first substrate and the second substrate to regulate alignment of liquid crystal molecules included in the liquid crystal layer, and in which a display region that displays an image is comprised of a plurality of pixels, the method at least including: preparing an insulating substrate as the first substrate or the second substrate, providing a photosensitive resin onto the insulating substrate, performing an exposure treatment by controlling an amount of exposure of the photosensitive resin using a photomask, and developing the photosensitive resin subjected to the exposure treatment, thereby forming the protrusion and the photo spacers at the same time.
In this structure, the protrusion and the photo spacers can be formed at the same time using the same material (i.e., a photosensitive resin). Accordingly, it is not necessary to provide another step for forming the protrusion which regulates the alignment of the liquid crystal molecules comprising the liquid crystal layer. As a result, the protrusion can be obtained without increasing the number of fabrication steps, which can prevent an increase in costs.
According to the method for fabricating the liquid crystal display device of the present disclosure, the photomask is preferably a gray-tone mask or a half-tone mask.
In this structure, the exposure treatment with different amounts of exposure can be easily performed on the photosensitive resin. As a result, the amount of exposure of the photosensitive resin can be easily controlled.
According to the method for fabricating the liquid crystal display device of the present disclosure, it is preferable that each of the pixels includes a transmissive region which transmits light to display an image and a reflection region which reflects light to display an image, and the protrusion is provided in at least one of the transmissive region or the reflection region.
In this structure, it is possible to regulate the alignment of the liquid crystal molecules comprising the liquid crystal layer in at least one of the transmissive region or the reflection region.
According to the method for fabricating the liquid crystal display device of the present disclosure, the protrusion is provided preferably at a center portion of the transmissive region.
In this structure, the liquid crystal molecules can be radially arranged in a well-balanced manner across the transmissive region, with the center portion of the transmissive region serving as a center of the alignment.
According to the method for fabricating the liquid crystal display device of the present disclosure, the protrusion is provided preferably at a center portion of the reflection region.
In this structure, the liquid crystal molecules can be radially arranged in a in a well-balanced manner across the reflection region, with the center portion of the reflection region serving as a center of the alignment.
According to the method for fabricating the liquid crystal display device of the present disclosure, a thickness of the protrusion and a thickness of at least one of the photo spacers are preferably the same.
In this structure, it is possible to increase the number of structures for regulating the thickness of the liquid crystal layer without decreasing a transmittance or a reflectance. Thus, it is possible to effectively reduce distortion of an image, etc., which occurs when the display surface is pressed.
According to the method for fabricating the liquid crystal display device of the present disclosure, the photosensitive resin may be an acrylic photosensitive resin.
According to the present disclosure, it is possible to form the protrusion without increasing the number of fabrication steps, and thus possible to reduce an increase in costs.
A structure of a liquid crystal display device according to an embodiment of the present disclosure, and a method for fabricating the liquid crystal display device will be described in detail below based on the drawings. The present disclosure is not limited to the embodiment described below.
As shown in
The sealing material 7 is formed to surround the liquid crystal layer 8. The TFT substrate 5 and the CF substrate 6 are bonded together with this sealing material 7. Further, as shown in
As shown in
Further, in the liquid crystal display device 1, a display region D which displays an image is defined by a region where the TFT substrate 5 and the CF substrate 6 overlap one another. The display region D is comprised of a plurality of pixels 48, i.e., smallest units of an image (see
The sealing material 7 is in a rectangular frame-like shape which surrounds the entire circumference of the display region D, as shown in
The TFT substrate 5 includes a plurality of switching elements arranged in a matrix. More specifically, as shown in
The rectangular region defined by the gate lines 11 and the source lines 14 is a region of each pixel 48. Each of the pixel electrodes 19 is made of a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).
As shown in
The source electrode 18 is a portion of a corresponding one of the source lines 14 which protrudes laterally. The drain electrode 20 is connected to a corresponding one of the pixel electrodes 19 via a contact hole 30 formed in the interlayer insulating film 15, as shown in
The semiconductor layer 13 includes, as shown in
Each of the pixel electrodes 19 is formed on a flat surface of the interlayer insulating film 15, using a material such as ITO, and forms a transparent electrode. As shown in
In a display portion of each of the pixels 48 of the liquid crystal display panel 2, a reflection region R is defined by a reflection electrode 32 as shown in
The reflection region R is a region which reflects light entering from a display surface side (that is, light entering from the CF substrate 6) to display an image. The transmissive region T is a region which transmits light of the backlight unit 40 entering from a back surface side (that is, light entering from the TFT substrate 5) to display an image.
Examples of the materials for the interlayer insulating film 15 may include, but not specifically limited to, silicon oxide (SiO2), silicon nitride (SiNx (x is a positive number)), etc. A thickness of the interlayer insulating film 15 is preferably 600 nm or more and 1000 nm or less. This is because if the thickness of the interlayer insulating film 15 is less than 600 nm, it may be difficult to planarize the interlayer insulating film 15, and if the thickness is more than 1000 nm, it may be difficult to form the contact hole 30 by etching.
As shown in
The color filter layer 47 includes a color layer 38 (a red color layer R, a green color layer G, and a blue color layer B) provided for each pixel, and a black matrix 37 as a light shielding film. The black matrix 37 is located between adjacent color layers 38 to partition the plurality of color layers 38 from one another. Examples of the pixel patterns may include complementary colors of cyan, magenta, and yellow, other than the combination of RGB.
As shown in
As shown in
The photo spacers 35 are made of a photosensitive resin (e.g., an acrylic photosensitive resin) and formed by photolithography.
According to the present embodiment, similar to the photo spacers 35, the protrusions 25 are made of a photosensitive resin (e.g., an acrylic photosensitive resin) and formed by photolithography.
Further, the protrusion 25 has a truncated cone shape which protrudes toward the TFT substrate 5 facing the protrusion 25, and there is a gap between the top of the protrusion 25 and the TFT substrate 5. The shape of the protrusion 25 is not limited, and may be in a cone shape, a pyramid shape, or a truncated pyramid shape, etc.
The black matrix 37 is made of a metal material such as tantalum (Ta), chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), copper (Cu), aluminum (Al), a resin material in which a black pigment such as carbon is dispersed, or a resin material in which optically transparent color layers of a plurality of colors are layered, etc.
The liquid crystal layer 8 is located between the TFT substrate 5 and the CF substrate 6. The liquid crystal layer 8 contains a nematic liquid crystal material with negative dielectric anisotropy, and further contains a chiral material depending on need. When no voltage is applied to the liquid crystal layer 8, the liquid crystal molecules 8a (i.e., a liquid crystal material of the liquid crystal layer 8) are aligned approximately perpendicular to the TFT substrate 5 and the CF substrate 6 due to the effect of alignment regulation of the alignment films 9, 16.
When a voltage is applied to the liquid crystal layer 8, an oblique electric field is generated in a region around the pixel electrode 19 and near the cutout 39. Due to the alignment regulation of this oblique electric field, a liquid crystal domain which provides radially-tilted alignment is formed in each of the plurality of pixel patterns, and a direction to which the liquid crystal molecules 8a are tilted due to the electric field is determined. As shown in
The transflective type liquid crystal display device 1 having the above structure is configured such that light entering from the CF substrate 6 is reflected on the reflection electrode 32 in the reflection region R, and light of the backlight unit 40 entering from the TFT substrate 5 is transmitted through the transmissive region T.
In the liquid crystal display device 1, each of the pixel electrodes 19 forms one pixel. When a gate signal is sent to each of the pixels from the gate line 11 to turn on the TFT 21, a source signal is sent from the source line 14 to generate a predetermined electric charge in the pixel electrode 19 through the source electrode 18 and the drain electrode 20. As a result, a potential difference occurs between the pixel electrode 19 and the common electrode 34, and a predetermined voltage is applied to the liquid crystal layer 8. The liquid crystal display device 1 is configured to display an image by adjusting a transmittance of light from the backlight unit 40, based on the phenomenon that the alignment state of the liquid crystal molecules 8a changes according to the magnitude of the applied voltage.
Now, an example method for fabricating the liquid crystal display device of the present embodiment will be described.
<TFT Substrate Formation Step>
First, a metal film is formed on the entire insulating substrate 10 by sputtering (for example, a titanium film, an aluminum film, and a titanium film are sequentially formed), and thereafter, patterning is performed by photolithography to obtain the gate lines 11 and the gate electrode 17 with a thickness of about 4000 Å.
Next, a silicon nitride film, for example, is formed on the entire substrate on which the gate lines 11 and the gate electrode 17 are formed, by plasma chemical vapor deposition (CVD) to obtain the gate insulating film 12 with a thickness of about 4000 Å.
Next, an intrinsic amorphous silicon film (having a thickness of about 2000 Å) and an n+ amorphous silicon film (having a thickness of about 500 Å) doped with phosphorus, for example, are sequentially formed by plasma CVD on the entire substrate on which gate insulating film 12 is formed, and thereafter, patterning is performed to obtain on the gate electrode 17 an island-shaped semiconductor formation layer in which the intrinsic amorphous silicon layer and the n+ amorphous silicon layer are layered.
Next, an aluminum film and a titanium film, for example, are sequentially formed on the entire substrate on which the semiconductor formation layer is formed, by sputtering, and thereafter, patterning is performed by photolithography to obtain the source lines 14, the source electrode 18, and the drain electrode 20 with a thickness of about 2000 Å.
Next, the n+ amorphous silicon layer of the semiconductor formation layer is etched using the source electrode 18 and the drain electrode 20 as a mask, thereby patterning the channel region and obtaining the semiconductor layer 13 and the TFT 21 including the semiconductor layer 13.
Next, a silicon nitride film, for example, is formed by plasma CVD on the entire substrate on which the TFT 21 is formed, to obtain the interlayer insulating film 15 with a thickness of about 4000 Å. The interlayer insulating film 15 is etched thereafter to form the contact hole 30.
Next, a transparent conductive film made of an ITO film, etc., is formed by sputtering on the entire substrate on the interlayer insulating film 15, and thereafter, patterning is performed by photolithography to form, on the insulating substrate 10, the transparent electrode 31 with a thickness of about 1000 Å. The above-described cutout 39 is formed at a predetermined position of the transparent electrode 31 at this time.
Next, a molybdenum film (having a thickness of about 750 Å) and an aluminum film (having a thickness of about 1000 Å) are sequentially formed by sputtering on the entire substrate on which the transparent electrode 31 is formed, and thereafter, patterning is performed by photolithography to form the reflection electrode 32 on a surface of the transparent electrode 31 in the reflection region R. As a result, the pixel electrode 19 including the transparent electrode 31 and the reflection electrode 32 is formed.
Next, a polyimide resin is applied by a printing method to the entire substrate on which the pixel electrode 19 is formed, and thereafter, a rubbing treatment is performed to form the alignment film 16 with a thickness of about 1000 Å.
The TFT substrate 5 can be formed in this manner.
<CF Substrate Formation Step>
First, an insulating substrate 46 such as a glass substrate is prepared. A positive photosensitive resin in which, for example, a black pigment such as carbon fine particles is dispersed is applied to the entire insulating substrate 46 by spin coating. The applied photosensitive resin is exposed through a photomask, developed and heated, thereby forming the black matrix 37.
Next, for example, a red-, green-, or blue-colored acrylic photosensitive resin is applied to the substrate on which the black matrix 37 is formed. The applied photosensitive resin is exposed through a photomask, and thereafter developed to pattern the photosensitive resin, thereby forming the color layer 38 of a selected color (e.g., a red color layer R) with a thickness of about 2.0 μm. Similar steps are repeated for the other two colors to form the color layers 38 of the two colors (e.g., a green color layer G and a blue color layer B) with a thickness of about 2.0 μm. As a result, the color filter layer 47 including the red color layer R, the green color layer G, and the blue color layer B is formed as shown in
Next, an acrylic photosensitive resin is applied by spin coating to the substrate on which the color filter layer 47 is formed. The applied photosensitive resin is exposed through a photomask, and is developed thereafter, thereby forming the transparent dielectric layer 33 with a thickness of about 2 μm as shown in
An ITO film, for example, is then formed by sputtering on the entire substrate on which the transparent dielectric layer 33 is formed, and thereafter, patterning is performed by photolithography to form the common electrode 34 with a thickness of about 1500 Å as shown in
Next, the protrusion 25 and the photo spacers 35 are simultaneously formed by photolithography.
More specifically, as shown in
In the present embodiment, as shown in
That is, a half-tone mask or a gray-tone mask which has a different light transmittance depending on areas, is used as the photomask 43, and the photosensitive resin 42 is exposed through the photomask 43.
Such an exposure treatment allows the photosensitive resin 42 to be exposed by a different amount of exposure. Thus, the protrusions 25 and the photo spacers 35 can be formed at the same time using the same material as shown in
In the present embodiment, a photomask including a light transmitting portion 61 which transmits light, a light shielding portion 62 which does not transmit light at all, and a semi-light transmitting portion 63 which transmits light with an intermediate intensity is used as the photomask 43, as shown in
For example, a light shielding layer 64 (such as Cr) is formed on the entire surface of the light shielding portion 62, and a plurality of light shielding layers 64 provided in stripes are formed in the semi-light transmitting portion 63. In the semi-light transmitting portion 63, each of the light shielding layers 64 has a width, for example, of 1.0 μm or more and 2.0 μm or less, and the interval between adjacent light shielding layers 64 is, for example, 1.0 μm or more and 2.0 μm or less.
The semi-light transmitting portion 63 has a fine stripe pattern due to the light shielding layers 64 as described above. Thus, when the photosensitive resin 42 is exposed through the semi-light transmitting portion 63, the photosensitive resin 42 is not exposed in stripes, but is exposed in an even manner by a smaller exposure amount than when exposed through the light transmitting portion 61 because the exposure amount is reduced by the light shielding layers 64.
To perform an exposure treatment on the photosensitive resin 42, the photomask 43 is positioned at a predetermined location facing the photosensitive resin 42 as shown in
Next, the photosensitive resin 42 is developed. Specifically, the photosensitive resin 42 is immersed in a developing solution to dissolve and remove part of the photosensitive resin 42 to which the ultraviolet rays S are applied, and thereafter the entire substrate is cleaned.
Part of the photosensitive resin 42 which is prevented from being exposed due to the light shielding portion 62 remains, and serves as the photo spacer 35. Part of the photosensitive resin 42 which is exposed through the semi-light transmitting portion 63 remains, and serves as the protrusion 25.
Next, a polyimide resin is applied by a printing method to the entire substrate on which the protrusion 25 and the photo spacer 35 are formed, and thereafter, a rubbing treatment is performed to form the alignment film 9 with a thickness of about 1000 Å.
The CF substrate 6 can be formed in this manner.
<Bonding Step>
First, by using a dispenser, for example, the sealing material 7 made of an ultraviolet curable, thermosetting resin or the like, is applied in a frame shape to the CF substrate 6 formed by the above-described CF substrate formation step.
Next, a liquid crystal material is dropped onto a region surrounded by the sealing material 7 on the CF substrate 6.
The CF substrate 6 on which the liquid crystal material is dropped, and the TFT substrate 5 formed in the above-described TFT substrate formation step are bonded together under reduced pressure. Then, the bonded body is released in the atmospheric pressure to apply pressure to the front surface and the back surface of the bonded body.
Next, the sealing material 7 sandwiched in the bonded body is irradiated with UV light, and thereafter the bonded body is heated to cure the sealing material 7.
As described above, the obtained TFT substrate 5 and the CF substrate 6 are positioned to face each other, with the photo spacers 35 interposed therebetween, and are bonded together with the sealing material 7. The liquid crystal layer 8 is sealed in the gap between the substrates, thereby obtaining the liquid crystal display panel 2.
Next, the polarizing plates 3, 4 are provided on both sides of the liquid crystal display panel 2 in the thickness direction of the liquid crystal display panel 2, and a drive circuit and the backlight unit 40 are attached.
The liquid crystal display device 1 shown in
According to the present embodiment described above, the following advantages can be obtained.
(1) In the present embodiment, the protrusions 25 and the photo spacers 35 are formed at the same time by using the photomask 43 which controls the amount of exposure of the photosensitive resin 42 in an exposure treatment, and developing the photosensitive resin 42 subjected to the exposure treatment. Thus, the protrusions 25 and the photo spacers 35 can be formed at the same time using the same material (i.e., the photosensitive resin 42). Accordingly, it is not necessary to provide another step for forming the protrusion 25 which regulates the alignment of the liquid crystal molecules 8a comprising the liquid crystal layer 8. As a result, the protrusion 25 can be obtained without increasing the number of fabrication steps, which can prevent an increase in costs.
(2) In the present embodiment, a gray-tone mask or a half-tone mask is used as the photomask 43. Thus, the exposure treatment with different amounts of exposure can be easily performed on the photosensitive resin 42. As a result, the amount of exposure of the photosensitive resin 42 can be easily controlled.
(3) In the present embodiment, the protrusion 25 is provided at a center portion of the transmissive region T. Accordingly, the liquid crystal molecules 8a can be radially arranged in a well-balanced manner across the transmissive region T, with the center portion of the transmissive region T serving as a center of the alignment.
(4) In the present embodiment, the protrusion 25 is provided at a center portion of the reflection region R. Accordingly, the liquid crystal molecules 8a can be radially arranged in a well-balanced manner across the reflection region R, with the center portion of the reflection region R serving as a center of the alignment.
The above embodiment can be modified as follows.
In the above embodiment, the protrusions 25 are formed in both of the transmissive region T and the reflection region R, but the protrusion 25 may be formed in at least one of the transmissive region T or the reflection region R. Thus, it is possible to regulate the alignment of the liquid crystal molecules 8a comprising the liquid crystal layer 8 in at least one of the transmissive region T or the reflection region R.
The protrusion 25 and the photo spacer 35 may have the same thickness. That is, as shown in
In this case, the amount of exposure of the photosensitive resin 42 is controlled in the exposure treatment such that the protrusion 25 and the photo spacer 35 have the same thicknesses T2 and T1, respectively, using the photomask in the step described in
Similarly, as shown in
The protrusion 25 provided in the reflection region R and the photo spacer 35 provided in the reflection region R may have the same thickness, and the protrusion 25 provided in the transmissive region T and the photo spacer 35 provided in the transmissive region T may have the same thickness.
That is, it is only necessary that at least one of the plurality of protrusions 25 has the same thickness as the thickness of one of the photo spacers 35.
According to this structure, it is possible to increase the number of structures for regulating the thickness of the liquid crystal layer 8 without decreasing a transmittance or a reflectance. Thus, it is possible to effectively reduce distortion of an image, etc., which occurs when the display surface is pushed.
In the above embodiment, the protrusions 25 are formed on the common electrode 34 comprising the CF substrate 6, but may be formed on the TFT substrate 5. More specifically, the protrusions 25 may be formed on the pixel electrode 19 comprising the TFT substrate 5.
As described above, the present disclosure is useful as a method for fabricating a liquid crystal display device in which a pair of substrates are layered, with a predetermined space interposed therebetween, and liquid crystal is sealed in the gap between the pair of substrates.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2010-120673 | May 2010 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2011/002028 | 4/5/2011 | WO | 00 | 11/23/2012 |
