Wheater, "Polymer Interlayer Adhesion Enhancements . . . ," published 10-83. |
U.S. Patent Application, S/N-746,908, filed 6/20/85, entitled "Improved Metal-Polymer Adhesion by Low Energy Bombardment", Inv.--J. G. Clabes et al. |
IBM Technical Disclosure Bulletin, vol. 25, No. 2, Jul. 1982, p. 529, "Plasma Ashing of Polyimide", F. Caruccio et al. |
N. H. Ladizesky & I. M. Ward, "A Study of the Adhesion of Drawn Polyethylene Fibre/Polymeric Resin Systems", Journal of Materials Science, 18 (1983) pp. 533-544. |
IBM Technical Disclosure Bulletin, vol. 26, No. 5, Oct. 1983, pp. 2372-2373, "Plasma Treatment to Improve Photoresist Adhesion to Various Substrates", B. Auda. |
IBM Technical Disclosure Bulletin, vol. 25, No. 12, May 1984, p. 6397, "Improved Adhesion Between Metal and Polymer Surfaces", J. J. Cuomo et al. |
IBM Technical Disclosure Bulletin vol. 22, No. 4, Sep., 1979, p. 1420 by Gow et al., "Process for Making Multilayer IC Substrate". |
IBM Technical Disclosure Bulletin vol. 26, No. 7A, Dec., 1983, p. 3104 by Cote et al., "Enhanced Adhesion to Interlevel Polyimide". |
IBM Technical Bulletin vol. 27, No. 6, Nov., 1984, pp. 3273-3274 by Nguyen et al., "Plasma Polymer Surface Adhesion Modification Method". |
IBM Technical Disclosure Bulletin vol. 25, No. 12, May, 1983, p. 6397 by Cuomo et al., "Improved Adhesion Between Metal and Polymer Surfaces". |
IBM Technical Disclosure Bulletin, vol. 26, No. 3B, Aug., 1983, p. 1748 by Collins et al., "Surface Treatment of Polyimide to Facilitate Adhesion of Metallic Surface Layers". |
Journal of Applied Polymer Science, vol. 26, pp. 2087-2096, 1981 by Wertheimer et al., "Surface Property Modification of Aromatic Polyamides by (Cold) Microwave Plasmas". |
IBM Technical Disclosure Bulletin vol. 25, No. 12, May, 1983, p. 6639 by Kraus et al. |
IBM Technical Disclosure Bulletin vol. 25, No. 2, Jul., 1982, p. 553 to Armstrong et al. |
IBM Technical Disclosure Bulletin vol. 24, No. 11B, Apr., 1982, p. 6097 by Hinkel et al. |
IBM Technical Disclosure Bulletin vol. 24, No. 6, Nov., 1981, p. 2796 by Coburn |
IBM Technical Disclosure Bulletin vol. 27, No. 1B, Jun., 1984 to Cziep et al., pp. 647-648. |
Journal of Vacuum Science Technology, vol. 19(3), Sep./Oct., 1981, pp. 743-747 by Goldstein, "Oxygen Plasma Etching of Thick Polymer Layers". |
Vossen, Thin Film Processes, Acadamic Press, N.Y., N.Y., 1978, pp. 526-527. |
Patent Abstracts of Japan, vol. 10, No. 63, (C-332) [2120] Mar. 13, 1986. |
IBM Technical Disclosure Bulletin vol. 27, No. 5, Oct., 1984, p. 3175 to Bui et al. |