The present invention relates to an inductor coil structure and method for making same. The coil structure of the present invention is preferably for use in a high current low profile inductor commonly referred to by the designation IHLP. However, the particular coil structure may be used in other types of inductors.
Inductor coils have in the prior art been constructed from various shapes of materials formed into various helical shapes. However, there is a need for an improved inductor coil structure which is simple to manufacture and which provides an efficient and reliable inductance coil.
Therefore, a primary object of the present invention is the provision of an improved inductor coil structure and method for making same.
A further object of the present invention is the provision of an inductor coil structure which can be used in a high current low profile inductor having no air spaces in the inductor, and which includes a magnetic material completely surrounding the coil.
A further object of the present invention is the provision of an inductor coil structure which includes a closed magnetic system which has self-shielding capability.
A further object of the present invention is the provision of an inductor coil structure which maximizes the utilization of space needed for a given inductance performance so that the inductor can be of a minimum size.
A further object of the present invention is the provision of an improved inductor coil structure which is smaller, less expensive to manufacture, and is capable of accepting more current without saturation than previous inductor coil structures.
A further object of the present invention is the provision of an inductor coil structure which lowers the series resistance of the inductor.
The foregoing objects may be achieved by a high current low profile inductor comprising a conductor coil having first and second coil ends. A magnetic material surrounds the conductor coil to form an inductor body. The inductor coil comprises a plurality of coil turns extending around a longitudinal coil axis in an approximately helical path which progresses axially along the coil axis. The coil turns are formed from a flat plate having first and second opposite flat surfaces, at least a portion of each of the flat surfaces of the coil turns facing in a axial direction with respect to the coil axis.
The method for making the inductor includes taking an elongated plate conductor having a first end, a second end, opposite side edges, opposite flat surfaces, and a longitudinal plate axis. A plurality of slots are cut in each of the opposite side edges of the plate conductor so as to form the plate conductor into a plurality of cross segments extending transversely with respect to the plate axis and a plurality of connecting segments extending approximately axially with respect to the plate axis. The connecting segments connect the cross segments together into a continuous conductor which extends in a sine shaped path. As used herein the term “sine shaped” refers to any shape which generally conforms to a sine curve, but which is not limited to a continuous curve and may include apexes, squared off corners or other various shapes.
After cutting the slots in the opposite side edges of the plate conductor the connecting segments are bent along one or more bend axes extending transversely with respect to the plate axis so as to form the plate conductor into a plurality of accordion folds, each of which comprise one of the cross segments and a portion of one of the connecting segments. In the resulting structure, the cross segments and the connecting segments form a continuous conductor coil of approximate helical shape having first and second opposite ends.
Referring to the drawings the numeral 10 generally designates an inductor of the present invention mounted upon a circuit board 12. Inductor 10 includes an inductor body 14 having a first lead 16 and a second lead 18 extending therefrom and being folded over the opposite ends of body 14. Leads 16, 18 are soldered or otherwise electrically connected on the circuit board 12.
Referring to
Upon completion of the cutting operation, the blank 50 is transformed into an elongated sine shaped body formed from a plurality of cross segments 66 extending transversely to the longitudinal axis of plate 50 and a plurality of connecting segments 67 extending axially with respect to the longitudinal axis of plate 50. The segments 66, 67 form a continuous sine shaped configuration as shown in
In
An example of a preferred material for coil 20 is a copper flat plate made from OFHC copper 102, 99.95% pure.
The magnetic molding material of body 14 is comprised of a powdered iron, a filler, a resin, and a lubricant. The preferred powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, N.J. under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H3P04.
An epoxy resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240, Reading, Pa. under the trade designation Corvel Black, Number 10-7086.
In addition a lubricant is added to the mixture. The lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296, Huston, Tex. under the product designation Lubrazinc W.
Various combinations of the above ingredients may be mixed together, but the preferred mixture is as follows:
The next step in the process involves compressing the material completely around the coil 20 so that it has a density produced by exposure to pressure of from 15 to 25 tons per square inch. This causes the powdered material 82 to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in
At this stage of the production the molded assembly is in the form which is shown in
When compared to other inductive components the IHLP inductor of the present invention has several unique attributes. The conductive coil, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting. The construction allows for maximum utilization of available space for magnetic performance and is magnetically self-shielding.
The unitary construction eliminates the need for two core halves as was the case with prior art E cores or other core shapes, and also eliminates the associated assembly labor.
The unique conductor winding of the present invention allows for high current operation and also optimizes magnetic parameters within the inductor's footprint.
The manufacturing process of the present invention provides a low cost, high performance package without the dependence on expensive, tight tolerance core materials and special winding techniques.
The magnetic core material has high resistivity (exceeding 3 mega ohms) that enables the inductor as it is manufactured to perform without a conductive path between the surface mount leads. The magnetic material also allows efficient operation up to 1 MHz. The inductor package performance yields a low DC resistance to inductance ratio of two milliOhms per microHenry. A ratio of 5 or below is considered very good.
The unique configuration of the coil 20 reduces its cost of manufacture. Coil 20 may be used in various inductor configurations other than IHLP inductors.
In the drawings and specification there has been set forth a preferred embodiment of the invention, and although specific terms are employed these are used in a generic and descriptive sense only and not for purposes of limitation. Changes in the form and the proportion of parts as well as in the substitution of equivalents are contemplated as circumstances may suggest or render expedient without departing from the spirit or scope of the invention as further defined in the following claims.
This application is a divisional application of application Ser. No. 11/609,165 filed Dec. 11, 2006 now U.S. Pat. No. 7,263,761, which is a divisional application of application Ser. No. 11/409,651 filed Apr. 24, 2006 now U.S. Pat. No. 7,221,249; which is a divisional application of application Ser. No. 10/244,777, filed Sep. 16, 2002, now U.S. Pat. No. 6,946,944; which is a continuation of Ser. No. 09/546,859 filed Apr. 10, 2000, now U.S. Pat. No. 6,449,829; which is a divisional of application Ser. No. 09/271,748, filed on Mar. 18, 1999, now U.S. Pat. No. 6,135,375 This application is also a divisional application of application Ser. No. 11/609,165 filed Dec. 11, 2006 now U.S. Pat. No. 7,263,761, which is a divisional application of application Ser. No. 11/409,651 filed Apr. 24, 2006 now U.S. Pat. No. 7,221,249; which is a divisional of application Ser. No. 10/244,777 filed Sep. 16, 2002, now U.S. Pat. No. 6,946,944; which is a continuation of application Ser. No. 09/547,155, filed Apr. 11, 2000, now U.S. Pat. No. 6,460,244; which is a divisional of application Ser. No. 08/963,224 filed Nov. 3, 1997, now U.S. Pat. No. 6,204,744; which is a continuation of application Ser. No. 08/503,655 filed Jul. 18, 1995, now abandoned. The Specification and Drawings of application Ser. No. 09/547,155, now U.S. Pat. No. 6,460,244, are hereby incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
1994534 | Robinson | Mar 1935 | A |
2118291 | Bollman | May 1938 | A |
2154730 | Cox | Apr 1939 | A |
2391563 | Goldberg | Dec 1945 | A |
2457806 | Crippa | Jan 1949 | A |
2568169 | Raczynski | Sep 1951 | A |
2850707 | Wroblewski | Sep 1958 | A |
2966704 | O'Brian | Jan 1961 | A |
3201729 | Blanchi | Aug 1965 | A |
3235675 | Blume | Feb 1966 | A |
3255512 | Lochner | Jun 1966 | A |
3380004 | Hansen | Apr 1968 | A |
3554797 | Coerver, Jr. | Jan 1971 | A |
3678345 | Hvidtfeld | Jul 1972 | A |
3953251 | Butherus et al. | Apr 1976 | A |
4146854 | Ishino | Mar 1979 | A |
4177089 | Bankson | Dec 1979 | A |
4543554 | Muellenheim | Sep 1985 | A |
4601765 | Soileau | Jul 1986 | A |
4696100 | Yamamoto | Sep 1987 | A |
4776980 | Ruffini | Oct 1988 | A |
5023578 | Kaneko | Jun 1991 | A |
5034710 | Kawaguchi | Jul 1991 | A |
5160447 | Ishikawa et al. | Nov 1992 | A |
5184105 | Endo | Feb 1993 | A |
5291173 | Yerman | Mar 1994 | A |
5359311 | Kawabata | Oct 1994 | A |
5381124 | Roshen | Jan 1995 | A |
5398400 | Breen | Mar 1995 | A |
5414401 | Roshen | May 1995 | A |
5446428 | Kumeji | Aug 1995 | A |
5495213 | Ikeda | Feb 1996 | A |
5551146 | Kawabata | Sep 1996 | A |
5875541 | Kumeji et al. | Mar 1999 | A |
5884990 | Burghartz | Mar 1999 | A |
5912609 | Usui | Jun 1999 | A |
6063209 | Matsutani | May 2000 | A |
6198375 | Shafer | Mar 2001 | B1 |
6204744 | Shafer | Mar 2001 | B1 |
6305755 | Shafer | Mar 2001 | B1 |
6460244 | Shafer | Oct 2002 | B1 |
7081803 | Takaya et al. | Jul 2006 | B2 |
7265651 | Brunner | Sep 2007 | B2 |
20020017972 | Hsu | Feb 2002 | A1 |
Number | Date | Country |
---|---|---|
179 582 | Sep 1935 | CH |
364 451 | Nov 1922 | DE |
1 370 019 | Mar 1936 | DE |
1 764 087 | Apr 1971 | DE |
2132378 | Jan 1973 | DE |
28 11 227 | Sep 1978 | DE |
40 23 141 | Jan 1992 | DE |
0439389 | Jul 1991 | EP |
0469609 | May 1992 | EP |
2721431 | Dec 1995 | FR |
2303494 | Feb 1997 | GB |
55 77113 | Jun 1980 | JP |
58 188108 | Nov 1983 | JP |
185809 | Dec 1984 | JP |
60 034008 | Feb 1985 | JP |
62 013005 | Jan 1987 | JP |
63 79306 | Apr 1988 | JP |
1 266705 | Oct 1989 | JP |
1 167011 | Nov 1989 | JP |
04 15507 | Apr 1992 | JP |
04129206 | Apr 1992 | JP |
HEI-04-115507 | Apr 1992 | JP |
04196507 | Jul 1992 | JP |
04 286305 | Oct 1992 | JP |
4 373112 | Dec 1992 | JP |
5 283238 | Oct 1993 | JP |
HEI-05-291046 | Nov 1993 | JP |
6 61059 | Mar 1994 | JP |
63 278317 | Nov 1998 | JP |
92 05568 | Apr 1992 | WO |
WO 9602345 | Feb 1996 | WO |
Number | Date | Country | |
---|---|---|---|
20070262841 A1 | Nov 2007 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11609165 | Dec 2006 | US |
Child | 11782020 | US | |
Parent | 11409651 | Apr 2006 | US |
Child | 11609165 | US | |
Parent | 10244777 | Sep 2002 | US |
Child | 11409651 | US | |
Parent | 09271748 | Mar 1999 | US |
Child | 09546859 | US | |
Parent | 11609165 | Dec 2006 | US |
Child | 09271748 | US | |
Parent | 11409651 | Apr 2006 | US |
Child | 11609165 | US | |
Parent | 10244777 | Sep 2002 | US |
Child | 11409651 | US | |
Parent | 08963224 | Nov 1997 | US |
Child | 09547155 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 09546859 | Apr 2000 | US |
Child | 10244777 | US | |
Parent | 09547155 | Apr 2000 | US |
Child | 10244777 | US | |
Parent | 08503655 | Jul 1995 | US |
Child | 08963224 | US |