The present invention relates to inductor coil structures and methods for making same.
The coil structure of the present invention is preferably for use in a high current low profile inductor commonly referred to by the designation IHLP. However, the particular coil structure may be used in other types of inductors.
Inductor coils have in the prior art been constructed from various shapes of materials formed into various helical shapes. However, there is a need for an improved inductor coil structure which is simple to manufacture and which provides an efficient and reliable inductance coil.
Most prior art inductive components are comprised of a magnetic core having a C-shape, and E-shape, a toroidal shape, or other shapes and configurations. Conductive wire coils are then wound around the magnetic core components to create the inductor. These types of prior art inductors require numerous separate parts, including the core, the winding, and some sort of structure to hold the parts together. Also, these inductive coils often have a shell surrounding them. As a result there are many air spaces in the inductor which affect its operation and which prevents the maximization of space.
Therefore, a primary object of the present invention is the provision of an improved inductor coil structure and method for making same.
A further object of the present invention is the provision of an inductor coil structure which can be used in a high current low profile inductor having no air spaces in the inductor, and which includes a magnetic material completely surrounding the coil.
A further object of the present invention is the provision of an inductor coil structure which includes a closed magnetic system which has self-shielding capability.
A further object of the present invention is the provision of an inductor coil structure which maximizes the utilization of space needed for a given inductance performance so that the inductor can be of a minimum size.
A further object of the present invention is the provision of an improved inductor coil structure which is smaller, less expensive to manufacture, and is capable of accepting more current without saturation than previous inductor coil structures.
A further object of the present invention is the provision of an inductor coil structure which lowers the series resistance of the inductor.
A further object of the present invention is the provision of a high current, low profile inductor which requires fewer turns of wire in the coil to achieve the same inductance achieved with larger prior art inductors, thus lowering the series resistance of the inductor.
An electrical component is disclosed. The electrical component includes a current conducting coil having inside and outside surface and terminal ends that are configured for connection to an electrical circuit. According to an embodiment, the electrical component may include compressed iron particles that form a body which completely contacts the inside and outside surfaces of the coil for magnetically shielding the coil and leaving the terminal ends exposed for connection to the electrical circuit. According to an embodiment, the electrical component may include compressed iron particles that form a body which completely contacts the inside and outside surfaces of the coil that magnetically shields the coil and leaves the terminal ends exposed outside the body. According to an embodiment, the electrical component may include compressed iron particles that form a body which completely contacts the inside and outside surfaces of the coil, whereby the terminal ends are exposed outside of the body and the coil is magnetically shielded. According to an embodiment, the electrical component may include compressed iron particles that form a body which completely contacts the inside and outside surfaces of the coil and enhances induction and efficiency of the coil.
Referring to the drawings the numeral 10 generally designates an inductor of the present invention which may be mounted upon a circuit board 12. Inductor 10 includes an inductor body 14 having a first lead 16 and a second lead 18 extending therefrom and being folded over the opposite ends of body 14. Leads 16, 18 are soldered or otherwise electrically connected on the circuit board 12.
Referring to
Upon completion of the cutting operation, the blank 50 is transformed into an elongated sine shaped body formed from a plurality of cross segments 66 extending transversely to the longitudinal axis of plate 50 and a plurality of connecting segments 67 extending axially with respect to the longitudinal axis of plate 50. The segments 66, 67 form a continuous sine shaped configuration as shown in
In
An example of a preferred material for coil 20 is a copper flat plate made from OFHC copper 102, 99.95% pure.
The magnetic molding material of body 14 is comprised of a powdered iron, a filler, a resin, and a lubricant. The. preferred powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, N.J. under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H3PO4.
An epoxy resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240, Reading, Pa. under the trade designation Corvel Black, Number 10-7086.
In addition a lubricant is added to the mixture. The lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296, Houston Tex. under the product designation Lubrazinc W.
Various combinations of the above ingredients may be mixed together, but the preferred mixture is as follows:
1,000 grams of the powdered iron.
3.3% by weight of the resin.
0.3% by weight of the lubricant.
The above materials (other than the lubricant) are mixed together and then acetone is added to wet the material to a mud-like consistency. The material is then permitted to dry and is screened to a particle size of −50 mesh. The lubricant is then added to complete the material 82. The material 82 is then ready for pressure molding.
The next step in the process involves compressing the material completely around the coil 20 so that it has a density produced by exposure to pressure of from 15 to 25 tons per square inch. This causes the powdered material 82 to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in
At this stage of the production the molded assembly is in the form which is shown in
When compared to other inductive components the IHLP inductor of the present invention has several unique attributes. The conductive coil, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting. The construction allows for maximum utilization of available space for magnetic performance and is magnetically self-shielding.
The unique configuration of the coil 20 reduces its cost of manufacture. Coil 20 may be used in various inductor configurations other than IHLP inductors.
According to a second embodiment, inductor 10 is configured as shown in
Referring to
Coil 24 includes a plurality of turns 31 and also includes an inner end 27 and an outer end 29.
A lead frame 33 formed of phosphor bronze, 510 alloy, which is one half hardened, includes first lead 16 which has one end 35 welded to the inner end 27 of coil 24. Lead frame 33 also includes a second lead 18 which has one end 38 welded to the outer end 29 of coil 24. Leads 16 and 18 include free ends 37, 40 which are shown to be attached to the lead frame 33 in
Referring to
The lead frame and coil assembly shown in
Referring to
The magnetic molding material is comprised of a first powdered iron, a second powdered iron, a filler, a resin, and a lubricant. The first and second powdered irons have differing electrical characteristics that allow the device to have a high inductance yet low core losses so as to maximize its efficiency. Examples of preferred powdered irons to use in this mixture are as follows: a powdered iron manufactured by Hoeganaes Company, River Road and Taylors Lane, Riverton, N.J., under the trade designation Ancorsteel 1000C. This 1000 C material is insulated with 0.48% mass fraction with 75% H3PO4. The second powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, N.J. under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H3PO4.
The powdered magnetic material also includes a filler, and the preferred filler is manufactured by Cyprus Industrial Minerals Company, Box 3299, Ingelwood, Calif. 80155 under the trade designation Snowflake PE. This is a calcium carbonate powder.
A polyester resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240, Reading, Pa. under the trade designation Corvel Flat Black, Number 21-7001.
In addition a lubricant is added to the mixture. The lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296, Huston, Tex. under the product designation Lubrazinc W.
Various combinations of the above ingredients may be mixed together, but the preferred mixture is as follows: 1,000 grams of the first powdered iron. 1,000 grams of the second powdered iron. 36 grams of the filler. 74 grams of the resin. 0.3% by weight of the lubricant.
The above materials (other than the lubricant) are mixed together and then acetone is added to wet the material to a mud-like consistency. The material is then permitted to dry and is screened to a particle size of −50 mesh. The lubricant is then added to complete the material 82. The material 82 is then added to the die 72 as shown in
The next step in the process involves the forcing of a movable ram 87 downwardly onto the removable punch 84 so as to force the punch 84 into the die 72. The force exerted by the removable punch 84 should be approximately 15 tons per square inch to 20 tons per square inch. This causes the powdered material 82 to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in
Referring to
The next step in the manufacturing process is to severe the lead frame 33 from the leads 16, 18 along the cut lines 42, 44. The leads 16, 18 are then bent downwardly and inwardly so as to be folded against the bottom surface of the inductor body 14.
The various steps for forming the inductor are shown in block diagram in
Next, at step 152 the powdered magnetic material is mixed together adding ingredients 154, 156, 158, 160, and 162.
The pressure molding step 64 involves the application of pressure as shown in
Finally after the curing is complete the bending and cutting step involves cutting off the lead frame 25 and folding the leads 16, 18 against the bottom surface of the inductor body 14.
Then compared to other inductive components the IHLP inductor of the present invention has several unique attributes. The conductive winding, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting. The construction allows for maximum utilization of available space for magnetic performance and is magnetically self shielding.
The unitary construction eliminates the need for two core halves as was the case with prior art E cores or other core shapes, and also eliminates the associated assembly labor.
The unique conductor winding of the present invention allows for high current operation and also optimizes magnetic parameters within the inductor's footprint.
The manufacturing processes of the embodiments provide a low cost, high performance package without the dependence on expensive, tight tolerance core materials and special winding techniques.
The magnetic core material has high resistivity (exceeding 3 mega ohms) that enables the inductor as it is manufactured to perform without a conductive path between the surface mount leads. The magnetic material also allows efficient operation up to 1 MHz. The inductor package performance yields a low DC resistance to inductance ratio of two milliohms per microHenry. A ratio of 5 or below is considered very good.
Referring to
The method of assembly of device 90 is different from the device 10 shown in
The position of the leads 98, 100 can be varied without detracting from the invention. Also, it is possible to put more than one coil within a molded part. For example, it would be possible to put two or more coils 24 within the molded body 10 or two or more coils 90 within the molded body 89.
In the drawings and specification there has been set forth a preferred embodiment of the invention, and although specific terms are employed these are used in a generic and descriptive sense only and not for purposes of limitation. Changes in the form and the proportion of parts as well as in the substitution of equivalents are contemplated as circumstances may suggest or render expedient without departing from the spirit or scope of the invention as further defined in the following claims.
This application is a continuation of U.S. application Ser. No. 13/109,576, filed May 17, 2011, which is a continuation of U.S. application Ser. No. 12/535,757 filed Aug. 5, 2009, now U.S. Pat. No. 7,986,207; which is a divisional application of U.S. application Ser. No. 12/013,725 filed Jan. 14, 2008, now U.S. Pat. No. 7,921,546; which is a divisional application of U.S. application Ser. No. 11/782,020 filed Jul. 24, 2007, now U.S. Pat. No. 7,345,562; which is a divisional application of U.S. application Ser. No. 11/609,165 filed Dec. 11, 2006, now U.S. Pat. No. 7,263,761; which is a divisional application of U.S. application Ser. No. 11/409,651 filed Apr. 24, 2006, now U.S. Pat. No. 7,221,249; which is a divisional application of U.S. application Ser. No. 11/038,880 filed Jan. 20, 2005, now U.S. Pat. No. 7,034,645; which is a divisional application of U.S. application Ser. No. 10/244,777, filed Sep. 16, 2002, now U.S. Pat. No. 6,946,944; which is a continuation of U.S. application Ser. No. 09/546,859 filed Apr. 10, 2000, now U.S. Pat. No. 6,449,829; which is a divisional of U.S. application Ser. No. 09/271,748, filed Mar. 18, 1999, now U.S. Pat. No. 6,198,375. U.S. application Ser. No. 10/244,777, filed Sep. 16, 2002, now U.S. Pat. No. 6,946,944, is also a continuation of U.S. application Ser. No. 09/547,155, filed Apr. 11, 2000, now U.S. Pat. No. 6,460,244; which is a divisional of U.S. application Ser. No. 08/963,224, filed Nov. 3, 1997, now U.S. Pat. No. 6,204,744; which is a continuation of U.S. application Ser. No. 08/503,655 filed Jul. 18, 1995, now abandoned.
Number | Date | Country | |
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Parent | 12013725 | Jan 2008 | US |
Child | 12535757 | US | |
Parent | 11782020 | Jul 2007 | US |
Child | 12013725 | US | |
Parent | 11609165 | Dec 2006 | US |
Child | 11782020 | US | |
Parent | 11409651 | Apr 2006 | US |
Child | 11609165 | US | |
Parent | 11038880 | Jan 2005 | US |
Child | 11409651 | US | |
Parent | 10244777 | Sep 2002 | US |
Child | 11038880 | US | |
Parent | 09271748 | Mar 1999 | US |
Child | 09546859 | US | |
Parent | 08963224 | Nov 1997 | US |
Child | 09547155 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13109576 | May 2011 | US |
Child | 13720618 | US | |
Parent | 12535757 | Aug 2009 | US |
Child | 13109576 | US | |
Parent | 09546859 | Apr 2000 | US |
Child | 10244777 | US | |
Parent | 09547155 | Apr 2000 | US |
Child | 10244777 | US | |
Parent | 08503655 | Jul 1995 | US |
Child | 08963224 | US |