Claims
- 1. A method for manufacturing a metal composite strip for the production of electrical contact components, comprising the steps of applying a film of tin or a tin alloy to an initial strip of an electrically conductive base material having copper as at least a major constituent, and subsequently depositing by cathodic sputtering a silver film thereonto and heat treating the composite strip.
- 2. The method as defined in claim 1, wherein the tin or tin alloy film is applied in the molten state.
- 3. The method as defined in claim 2, wherein the tin or tin alloy film is applied at a thickness of between 0.5 μm and 10.0 μm, and the silver film is deposited at a thickness of between 0.1 μm and 3.5 μm.
- 4. The method as defined in claim 2, wherein the base material is copper or a copper alloy.
- 5. The method as defined in claim 1, wherein the tin or tin alloy film and the silver film are each applied by cathodic sputtering.
- 6. The method as defined in claim 1, wherein the heat treating is carried out by diffusion annealing.
- 7. The method as defined in claim 6, wherein the tin or tin alloy film is applied at a thickness of between 0.5 μm and 10.0 μm, and the silver film is deposited at a thickness of between 0.1 μm and 3.5 μm.
- 8. The method as defined in claim 1, wherein the tin or tin alloy film is applied at a thickness of between 0.5 μm and 10.0 μm, and the silver film is deposited at a thickness of between 0.1 μm and 3.5 μm.
- 9. The method as defined in claim 8, wherein the base material is copper or a copper alloy.
- 10. The method as defined in claim 1, wherein the base material is copper or a copper alloy.
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 52 329 |
Nov 1997 |
DE |
|
Parent Case Info
This application is a division of U.S. patent application Ser. No. 09/196,684, filed Nov. 20, 1998, now U.S. Pat. No. 6,207,035 B1.
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