Patent Application
20250205780
This application claims the priority benefit of Taiwan Application Serial No. 112150050, filed on Dec. 21, 2023. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
The disclosure relates to heat dissipation technologies, in particular, to a method for manufacturing a heat conduction structure.
Traditionally, heat dissipation manners commonly used in an electronic device are liquid cooling heat dissipation and air cooling heat dissipation. These heat dissipation manners inevitably require a heat conduction structure to carry heat away from a heat source.
An alloy material traditionally used in the electronic device, such as an aluminum alloy material, is limited by its own thermal conductivity and often cannot produce an ideal heat conduction effect. Other materials with high thermal conductivity, such as gold, silver, and graphene, often have problems such as high costs, difficulty in molding, or insufficient structural strength.
The disclosure provides a method for manufacturing a heat conduction structure, including: forming a porous metal structure by using a metal powder material; providing an electrolyte solution, where the electrolyte solution includes a high thermal conductivity nano material, and performing anodic oxidation treatment on the metal structure by using the electrolyte solution, to fill pores of the metal structure with the high thermal conductivity nano material; and performing hole sealing treatment on the metal structure.
The manufacturing method provided in the disclosure is to fill a hole of a high-porosity metal structure with the high thermal conductivity nano material, such as graphene, in an anodic oxidation manner, which can effectively improve overall heat transfer efficiency of the heat conduction structure. The heat conduction structure may be individually used to dissipate heat from a heat source, or may be applied to a water cooling system or an air cooling system to improve heat dissipation efficiency.
More detailed descriptions of specific embodiments of the disclosure are provided below with reference to the schematic diagrams. The features and advantages of the disclosure are described more clearly according to the following description and claims. It should be noted that all of the drawings use very simplified forms and imprecise proportions, and are only used for assisting in conveniently and clearly explaining the objective of the embodiments of the disclosure.
First, as described in step S120: Form a porous metal structure by using a metal powder material, where a porosity of the metal structure is greater than 30%. In an embodiment, the metal structure may be manufactured in a metal injection molding (MIM) manner. However, the disclosure is not limited thereto. A general sintering manner may also be applied in the disclosure.
The following describes a metal injection molding method. In a metal injection molding process, the metal structure may be formed by using an injection molding raw material. The injection molding raw material may include a metal powder material and a foam material. In an embodiment, the metal powder material is an aluminum alloy powder material, the foam material is a titanium hydride polymeric material, and the injection molding raw material includes 1.5 to 2.5 wt % of the foam material. However, the disclosure is not limited thereto.
In the metal injection molding process, first evacuation is performed, and then a gas is injected at the same time during injection molding to initiate a polymerization effect on the foam material to generate a foam effect, so that a high-porosity metal structure is generated. Basically, a porosity of a conventional aluminum alloy metal structure is usually around 1%, while a porosity of an aluminum alloy metal structure in the disclosure may exceed 30%. Further, in an embodiment, the gas injected during metal injection molding is oxygen. However, the disclosure is not limited thereto. Another gas, such as nitrogen or inert gases, that is not easily reacted with the metal powder material may alternatively be applied to the disclosure.
Then, as described in step S140: Provide an electrolyte solution including a high thermal conductivity nano material, and perform anodic oxidation treatment on the metal structure by using the electrolyte solution, to fill pores of the metal structure with the high thermal conductivity nano material.
In an embodiment, the high thermal conductivity nano material is a copper nano material, a silver nano material, or a graphene nano material.
Then, as described in step S160: Perform hole sealing treatment on the metal structure.
In an embodiment, in step S160, hole sealing treatment may be performed on the metal structure (such as an aluminum alloy structure) by using a rare earth material as a sealant. In the step of hole sealing, medium temperature sealing or high temperature sealing may be used.
In the hole sealing treatment in step S160, the high thermal conductivity nano material filled in the pore may be isolated from outside, and physical effects such as anti-corrosion, high wear resistance, and weather resistance are produced on a surface of a metal structure object.
Compared with the embodiment in
Step S225: Form a hook on the metal structure in a metal processing method, to facilitate subsequent process steps. The metal processing method may be a general machining process, such as CNC tool machining, and laser processing.
Step S230: Perform ceramic sandblasting on a surface of the metal structure. In a ceramic sandblasting process in step S230, surface treatment is mechanically performed on the metal structure to remove a surface defect of the metal structure. A particle size of a sand used in the ceramic sandblasting process needs to be larger than the pore of the metal structure to avoid pore blockage caused by sand filling the pore.
Step S235: Perform surface cleaning treatment on the surface of the metal structure. The surface cleaning treatment in step S235 may include a chemical cleaning step, a chemical polishing step, and a deep ultrasonic cleaning step, to thoroughly perform surface cleaning on the metal structure to prevent pore blockage caused by previous processing processes.
It is to be noted that, the foregoing step S225 to step S235 may be selected according to an actual requirement. In an embodiment, when there is no need to perform ceramic sandblasting treatment and surface cleaning treatment in a hanging manner, step S225 may be omitted. When the metal structure formed in step S220 has an ideal structural surface, step S230 may be omitted.
A manufacturing method provided in the disclosure is to fill a hole of a high-porosity metal structure with the high thermal conductivity nano material, such as graphene, in an anodic oxidation manner, which can effectively improve overall heat transfer efficiency of the heat conduction structure. The heat conduction structure may be individually used to dissipate heat from a heat source, or may be applied to a water cooling system or an air cooling system to improve heat dissipation efficiency. Secondly, since the manufacturing method of the disclosure may directly form the porous metal structure by using processes such as metal injection molding (MIM) or sintering, an increase in manufacturing costs may be avoided. In addition, various structural appearances are also easily formed according to an actual design requirement.
The above is merely exemplary embodiments of the disclosure, and does not constitute any limitation on the disclosure. Any form of equivalent replacements or modifications to the technical means and technical content disclosed in the disclosure made by a person skilled in the art without departing from the scope of the technical means of the disclosure still fall within the content of the technical means of the disclosure and the protection scope of the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 112150050 | Dec 2023 | TW | national |
