Claims
- 1. A method for manufacturing a multi-layer ceramic electronic part comprising the steps of:preparing an unbaked laminated body comprising a ceramic layer and internal electrodes laminated on one another; applying and drying a conductor paste, into which is added a material common with a ceramic forming the ceramic layer of the laminated body, on edge portions of the unbaked laminated body; forming external electrodes in contact with the internal electrodes at end surfaces of the laminated body; baking the laminated body; and providing ceramic portions which are scattered in a conductor film forming the external electrodes and continuous in a direction of thickness of the conductor film.
- 2. The method of claim 1, additionally comprising the step of forming the conductor film of at least one metal selected from the group consisting of Ni, Cu, Ag, Pd and an Ag—Pd alloy.
- 3. The method of claim 1, wherein the ceramic comprises barium titanate.
- 4. The method of claim 1, wherein the conductor paste contains from 3% to 40% by weight of the common material.
- 5. A method for manufacturing a multi-layer ceramic electronic part comprising the steps of:preparing an unbaked laminated body comprising a ceramic layer and internal electrodes laminated on one another; applying and drying a conductor paste, into which is added a material common with a ceramic forming the ceramic layer of the laminated body, on edge portions of the unbaked laminated body; forming external electrodes in contact with the internal electrodes at end surfaces of the laminated body; baking the laminated body; and forming ceramic portions in the external electrodes that are continuous from an inner surface of a conductor film forming the external electrodes where the conductor film closely contacts with a surface of the laminated body, extending to an outer surface of the external electrodes.
- 6. The method of claim 5, additionally comprising the step of forming the conductor film of at least one metal selected from the group consisting of Ni, Cu, Ag, Pd and an Ag—Pd alloy.
- 7. The method of claim 5, wherein the ceramic comprises barium titanate.
- 8. The method of claim 5, wherein the conductor paste contains from 3% to 40% by weight of the common material.
Priority Claims (2)
Number |
Date |
Country |
Kind |
11-85290 |
Mar 1999 |
JP |
|
11-295001 |
Oct 1999 |
JP |
|
Parent Case Info
This is a division of Ser. No. 09/536,547, filed Mar. 28, 2000, now U.S. Pat. No. 6,349,026, issued on Feb. 19, 2002.
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
5822176 |
Sano et al. |
Oct 1998 |
A |
6331932 |
Kobayashi et al. |
Dec 2001 |
B1 |
6349026 |
Nakamura |
Feb 2002 |
B1 |
6370014 |
Yoneda |
Apr 2002 |
B1 |
6442813 |
Sakamoto et al. |
Sep 2002 |
B1 |
Foreign Referenced Citations (2)
Number |
Date |
Country |
8-130149 |
May 1996 |
JP |
2000-216046 |
Aug 2000 |
JP |