electrically connecting two or more layers of a stacked or rolled capacitor

Industry

CPC
H01G4/232

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/232electrically connecting two or more layers of a stacked or rolled capacitor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component
- Patent number 12,293,874
- Issue date May 6, 2025
- TDK Corporation
- Yuichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metacapacitors and power-electronic converters for power-electronic...
- Patent number 12,289,056
- Issue date Apr 29, 2025
- 10644137 CANADA INC.
- Majid Pahlevaninezhad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component with a multilayer external...
- Patent number 12,283,432
- Issue date Apr 22, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Duk Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device having a copper-containing baked electrod...
- Patent number 12,283,430
- Issue date Apr 22, 2025
- TDK Corporation
- Toshihiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,283,431
- Issue date Apr 22, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Yun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip ceramic electronic component and method for manufacturing the...
- Patent number 12,278,050
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Kota Zenzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,278,056
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- So Jung An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor, a method of manufacturing the same an...
- Patent number 12,278,049
- Issue date Apr 15, 2025
- Taiyo Yuden Co., Ltd.
- Yusuke Kowase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 12,278,053
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,278,059
- Issue date Apr 15, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,272,498
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Hiroyasu Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and method of manufacturing...
- Patent number 12,272,499
- Issue date Apr 8, 2025
- Taiyo Yuden Co., Ltd.
- Chizuru Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component including external electrod...
- Patent number 12,272,500
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor for multiple replacement applications
- Patent number 12,272,501
- Issue date Apr 8, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,272,497
- Issue date Apr 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee Jung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,272,503
- Issue date Apr 8, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component
- Patent number 12,266,473
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and mounting structure of multilayer c...
- Patent number 12,266,477
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Kazuhiro Nishibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,266,478
- Issue date Apr 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kangha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 12,266,476
- Issue date Apr 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyo Yeol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,266,480
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,260,998
- Issue date Mar 25, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,260,997
- Issue date Mar 25, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component with electrode using epoxy
- Patent number 12,260,994
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Moon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,255,019
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Bok Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 12,255,020
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Han Seong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component having insulating layer which inclu...
- Patent number 12,255,022
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Yeun Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,255,025
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- YoonA Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer ceramic electronic component and...
- Patent number 12,255,023
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Du Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,249,467
- Issue date Mar 11, 2025
- TDK Corporation
- Shinya Onodera
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT THAT SUPPRESSES MIGRATION IN EXTERNAL ELECTODES
- Publication number 20250149248
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriyuki OOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR AND METHOD FOR PRODUCING FILM CAPACITOR
- Publication number 20250149251
- Publication date May 8, 2025
- SHIZUKI ELECTRIC CO., INC.
- Taishi MORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF ELECTRONIC COMPONENT
- Publication number 20250149250
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriyuki OOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC CAPACITOR
- Publication number 20250149247
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Junghwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250140479
- Publication date May 1, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jaehoon Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES WITH ENHANCED FORM FACTOR
- Publication number 20250140483
- Publication date May 1, 2025
- SARAS MICRO DEVICES, INC.
- Bartlet H. Deprospo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250140476
- Publication date May 1, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jaehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...
- Publication number 20250140480
- Publication date May 1, 2025
- Taiyo Yuden Co., Ltd.
- Shunya FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250132094
- Publication date Apr 24, 2025
- TDK Corporation
- Natsumi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250132095
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Myungwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250132092
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Geon Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250132093
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jong Hoon YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250125094
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sungsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
- Publication number 20250125090
- Publication date Apr 17, 2025
- Taiyo Yuden Co., Ltd.
- Ayumi SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250125093
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ki Hun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250125095
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Ah Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250125096
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250118491
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyu Tae Byeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250118492
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
- Publication number 20250118498
- Publication date Apr 10, 2025
- Taiyo Yuden Co., Ltd.
- Ayumi SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250118497
- Publication date Apr 10, 2025
- Murata Manufacturing Co., Ltd.
- Kazuhiro NISHIBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250118495
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyu Ho YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Multilayer Ceramic Capacitor
- Publication number 20250111993
- Publication date Apr 3, 2025
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250111995
- Publication date Apr 3, 2025
- Murata Manufacturing Co., Ltd.
- Yasuhiro MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250104921
- Publication date Mar 27, 2025
- Murata Manufacturing Co., Ltd.
- Ken TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250104919
- Publication date Mar 27, 2025
- AMOTECH CO., LTD.
- Byungguk LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250104920
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hee Jung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CAPACITOR
- Publication number 20250104916
- Publication date Mar 27, 2025
- AMOTECH CO., LTD.
- Byungguk LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20250104924
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250095920
- Publication date Mar 20, 2025
- TDK Corporation
- Yugo KANAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

electrically connecting two or more layers of a stacked or rolled capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component

Metacapacitors and power-electronic converters for power-electronic...

Multilayer ceramic electronic component with a multilayer external...

Ceramic electronic device having a copper-containing baked electrod...

Multilayer electronic component

Chip ceramic electronic component and method for manufacturing the...

Multilayer electronic component

Multilayer ceramic capacitor, a method of manufacturing the same an...

Ceramic electronic component

Capacitor with multiple elements for multiple replacement applications

Multilayer ceramic capacitor

Multilayer ceramic electronic component and method of manufacturing...

Multilayer ceramic electronic component including external electrod...

Capacitor for multiple replacement applications

Multilayer electronic component

Capacitor with multiple elements for multiple replacement applications

Chip electronic component

Multilayer ceramic capacitor and mounting structure of multilayer c...

Multilayer electronic component

Multilayer ceramic electronic component

Multilayer ceramic capacitor

Capacitor with multiple elements for multiple replacement applications

Capacitor with multiple elements for multiple replacement applications

Composite electronic component with electrode using epoxy

Multilayer electronic component

Ceramic electronic component

Multilayer electronic component having insulating layer which inclu...

Multilayer electronic component

Method of manufacturing multilayer ceramic electronic component and...

Electronic component

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT THAT SUPPRESSES MIGRATION IN EXTERNAL ELECTODES

FILM CAPACITOR AND METHOD FOR PRODUCING FILM CAPACITOR

ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

MULTI-LAYERED CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF

INTEGRATED PASSIVE DEVICES WITH ENHANCED FORM FACTOR

CAPACITOR AND MANUFACTURING METHOD THEREOF

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...

ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD

MULTILAYER CERAMIC CAPACITOR

MULTILAYER ELECTRONIC COMPONENT

Surface Mount Multilayer Ceramic Capacitor

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

CERAMIC CAPACITOR

MULTILAYER CAPACITOR

ELECTRONIC COMPONENT