Number | Date | Country | Kind |
---|---|---|---|
10-156088 | Jun 1998 | JP |
Number | Name | Date | Kind |
---|---|---|---|
5232870 | Ito et al. | Aug 1993 | A |
5340435 | Ito et al. | Aug 1994 | A |
5494849 | Iyer et al. | Feb 1996 | A |
5665631 | Lee et al. | Sep 1997 | A |
5773355 | Inoue et al. | Jun 1998 | A |
5863829 | Nakayoshi et al. | Jan 1999 | A |
5918139 | Mitani et al. | Jun 1999 | A |
6004860 | Ogawa et al. | Dec 1999 | A |
6090688 | Ogawa et al. | Jul 2000 | A |
6110391 | Takei et al. | Aug 2000 | A |
Number | Date | Country |
---|---|---|
0476897 | Mar 1992 | EP |
5-46086 | Mar 1985 | JP |
60-50970 | Mar 1985 | JP |
64-89346 | Apr 1989 | JP |
5160074 | Jun 1993 | JP |
6176993 | Jun 1994 | JP |
8330553 | Dec 1996 | JP |
9-64321 | Mar 1997 | JP |
9246506 | Sep 1997 | JP |
Entry |
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Funjino et al., “Silicon Wafer Direct Bonding through the Amorphous Layer”, Jpn. J. Applied Physics, pp. 4322-4324(1995). |
Maleville et al., “Wafer Bonding and H-implantation Mechanisms Involved in the Smart-cut® Technology”, Materials Science and Engineering, pp. 14-19 (1997). |
An English Language abstract of JP 9-064321. |
An English Language abstract of JP 8-330553. |
An English Language abstract of JP 1-089346. |
An English Language abstract of JP 6-176993. |
An English Language abstract of JP 9-246506. |
Patent abstracts of Japan with JP 6-176993. Abstracts Only. |
An English Abstarct of JP 60-50970. Abstracts Only. |