using bonding techniques

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H01L21/76251

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76251using bonding techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Passive cap for germanium-containing layer
- Patent number 12,327,723
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lung Yuan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit dies and methods of forming the same
- Patent number 12,328,931
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate, semiconductor device, and display device
- Patent number 12,304,857
- Issue date May 20, 2025
- AGC Inc.
- Shuhei Nomura
- G02 - OPTICS
Information Patent Grant
Method of forming protective layer utilized in silicon remove process
- Patent number 12,300,534
- Issue date May 13, 2025
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with devices having different top layer thickne...
- Patent number 12,302,637
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side type image sensors
- Patent number 12,272,720
- Issue date Apr 8, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer bonding including edge trimming
- Patent number 12,237,165
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system with sealing gasket and method for using the same
- Patent number 12,237,211
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacture by monitoring relative...
- Patent number 12,230,532
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with BioFETs
- Patent number 12,222,317
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- G01 - MEASURING TESTING
Information Patent Grant
Single crystalline silicon stack formation and bonding to a cmos wafer
- Patent number 12,224,201
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Growth structure for strained channel, and strained channel using t...
- Patent number 12,218,238
- Issue date Feb 4, 2025
- Korea Advanced Institute of Science and Technology
- Sanghyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,191,191
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator having a semiconductor layer with differ...
- Patent number 12,170,284
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
- Patent number 12,112,976
- Issue date Oct 8, 2024
- Soitec
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods of forming a semiconductor device including active patterns...
- Patent number 12,112,952
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,094,758
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Tien-Tsai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with assistant layer and method for fabricatin...
- Patent number 12,080,754
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanorod production method and nanorod produced thereby
- Patent number 12,074,247
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- B82 - NANO-TECHNOLOGY
Information Patent Grant
SLT integrated circuit capacitor structure and methods
- Patent number 12,062,669
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 12,062,539
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with assistant layer
- Patent number 12,051,718
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems and methods for electrostatic force enhanced semic...
- Patent number 12,040,211
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Shu Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 12,027,413
- Issue date Jul 2, 2024
- Vanguard International Semiconductor Corporation
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture hermetic guard ring for semiconductor on insulator devices
- Patent number 12,014,996
- Issue date Jun 18, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained semiconductor using elastic edge relaxation of a stressor...
- Patent number 11,978,800
- Issue date May 7, 2024
- ACORN SEMI, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR-ON-INSULATOR MULTILAYER STRUCTURE
- Publication number 20250191967
- Publication date Jun 12, 2025
- SOITEC
- Isabelle Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME
- Publication number 20250191968
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTALLINE SILICON STACK FORMATION AND BONDING TO A CMOS WAFER
- Publication number 20250157853
- Publication date May 15, 2025
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method of Manufacture by Monitoring Relative...
- Publication number 20250149378
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING LOW-COST THICK SOI WAFER
- Publication number 20250149377
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jaroslav PJENCAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OPERATING INTEGRATED CIRCUIT WITH BIOFETS
- Publication number 20250130198
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Tsun CHEN
- G01 - MEASURING TESTING
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING VIBRATION POWER GENERATION DEVICE AND VIBR...
- Publication number 20250088124
- Publication date Mar 13, 2025
- SEIKO EPSON CORPORATION
- Katsuya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PREPARING SILICON-ON-INSULATOR STRUCTURES USING EPITAXIA...
- Publication number 20250069945
- Publication date Feb 27, 2025
- GLOBALWAFERS CO., LTD.
- Qingmin Liu
- C30 - CRYSTAL GROWTH
Information Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING NITRIDE SE...
- Publication number 20250059676
- Publication date Feb 20, 2025
- Shin-Etsu Handotai Co., Ltd.
- Ippei KUBONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER BONDING
- Publication number 20250046650
- Publication date Feb 6, 2025
- WAFER WORKS CORPORATION
- Wei-Jing CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...
- Publication number 20250022747
- Publication date Jan 16, 2025
- SOITEC
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Application
TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...
- Publication number 20250022882
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Martin W. Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING NITRID...
- Publication number 20250015085
- Publication date Jan 9, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kazunori HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...
- Publication number 20250014942
- Publication date Jan 9, 2025
- Nexthin Technology
- Tzu-wei CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20240429057
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical Systems (MEMS) Fabrication Process Including...
- Publication number 20240395540
- Publication date Nov 28, 2024
- StethX Microsystems
- Farrokh Ayazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SUPPORT SUBSTRATE PROVIDED WITH A CHARGE-TRA...
- Publication number 20240387243
- Publication date Nov 21, 2024
- SOITEC
- Youngpil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...
- Publication number 20240371882
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR ELECTROSTATIC FORCE ENHANCED SEMIC...
- Publication number 20240363384
- Publication date Oct 31, 2024
- Micron Technology, Inc.
- Shu Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20240355618
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN ELECTROLESS DEPOSITION
- Publication number 20240355676
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Marvin L. Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240321626
- Publication date Sep 26, 2024
- Vanguard International Semiconductor Corporation
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20240297069
- Publication date Sep 5, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR-ON-INSULATOR WAFERS HAVING C...
- Publication number 20240258155
- Publication date Aug 1, 2024
- GLOBALWAFERS CO., LTD.
- Charles R. Lottes
- H01 - BASIC ELECTRIC ELEMENTS

using bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Passive cap for germanium-containing layer

Hybrid integrated circuit dies and methods of forming the same

Glass substrate, semiconductor device, and display device

Method of forming protective layer utilized in silicon remove process

Semiconductor wafer with devices having different top layer thickne...

Front-side type image sensors

Method for wafer bonding including edge trimming

Bonding system with sealing gasket and method for using the same

Semiconductor device, method of manufacture by monitoring relative...

Integrated circuit with BioFETs

Single crystalline silicon stack formation and bonding to a cmos wafer

Growth structure for strained channel, and strained channel using t...

Semiconductor structure and manufacturing method thereof

Semiconductor on insulator having a semiconductor layer with differ...

Method of mechanical separation for a double layer transfer

Silicon carbide composite wafer and manufacturing method thereof

Semiconductor device package and manufacturing method thereof

Pseudo-substrate with improved efficiency of usage of single crysta...

Methods of forming a semiconductor device including active patterns...

Method for forming a crack in an edge region of a donor substrate

Semiconductor structure and method for manufacturing the same

Semiconductor device with assistant layer and method for fabricatin...

Nanorod production method and nanorod produced thereby

SLT integrated circuit capacitor structure and methods

Semiconductor-on-insulator (SOI) substrate and method for forming

Method for fabricating semiconductor device with assistant layer

Devices, systems and methods for electrostatic force enhanced semic...

Semiconductor structure and method of fabricating the same

Moisture hermetic guard ring for semiconductor on insulator devices

Strained semiconductor using elastic edge relaxation of a stressor...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A SEMICONDUCTOR-ON-INSULATOR MULTILAYER STRUCTURE

BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

SINGLE CRYSTALLINE SILICON STACK FORMATION AND BONDING TO A CMOS WAFER

Semiconductor Device, Method of Manufacture by Monitoring Relative...

Selective Dielectric Capping for Hybrid Bonding

STRUCTURE AND METHOD OF FORMING LOW-COST THICK SOI WAFER

METHOD FOR OPERATING INTEGRATED CIRCUIT WITH BIOFETS

HIGH-PRECISION HETEROGENEOUS INTEGRATION

METHOD FOR MANUFACTURING VIBRATION POWER GENERATION DEVICE AND VIBR...

METHODS OF PREPARING SILICON-ON-INSULATOR STRUCTURES USING EPITAXIA...

NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING NITRIDE SE...

METHOD OF WAFER BONDING

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...

NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING NITRID...

METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

Microelectromechanical Systems (MEMS) Fabrication Process Including...

METHOD FOR PREPARING A SUPPORT SUBSTRATE PROVIDED WITH A CHARGE-TRA...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID INTEGRATED CIRCUIT DIES

SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...

DEVICES, SYSTEMS AND METHODS FOR ELECTROSTATIC FORCE ENHANCED SEMIC...

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

PROCESS FOR THIN ELECTROLESS DEPOSITION

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...

METHODS OF MANUFACTURING SEMICONDUCTOR-ON-INSULATOR WAFERS HAVING C...