Patent Application
20220025538
This application claims priority to Chinese patent application number 202010722631.X, filed Jul. 24, 2020. Chinese patent application 202010722631.X is incorporated herein by reference.
The present disclosure relates to a method for metallizing plastic, and in particular relates to a method for metallizing plastic by pre-plating for electroplating.
The purpose of plastic metallization is to deposit a conductive metal film layer on a surface of a non-conductive plastic workpiece. Plastic metal coating technology comprises spraying, physical vapor deposition (PVD), electroplating, etc. Existing methods of spraying in combination with physical vapor deposition are used to obtain workpieces having chromium-plated appearances. This process is suitable for flat workpieces with relatively simple workpiece shapes. For more complex workpiece shapes, there is a disadvantage of an uneven thickness of paint film and PVD film. The process also produces volatile organic compounds (VOCs) and other organic emissions, which is not green and environmentally friendly. The electroplating brings to a product to have advantages of high-quality appearance and high durability that other technologies cannot have. However, the electroplating can only be directly used on limited kinds of plastic surfaces, and a preprocessing of the electroplating has serious environmental pollution. Therefore pre-treating is needed.
Optional pre-treating for electroplating comprise PVD, etc. The principle of the PVD process is to generate instantaneous high temperature on the surface of the target material through argon ion bombardment to evaporate the material, and part of the material will be deposited on the surface of the workpiece in the form of aggregated metal particle clusters (large particles). The subsequent electroplating process enlarges the particle clusters, resulting in a large number of visible particles appearing on the surface of the workpiece, which cannot match the high-quality appearance standard of traditional electroplating.
The objective of the present disclosure is to provide a method for metallizing plastic by pre-plating for electroplating to solve the deficiencies of the existing techniques.
In order to achieve the aforementioned objective, a technical solution of the present disclosure is as follows.
A method for metallizing plastic by pre-plating for electroplating comprises the following steps.
1) cleaning a plastic workpiece by an ion source;
2) forming a metal bonding layer on a surface of the plastic workpiece using electro arc ion plating or magnetron sputtering;
3) forming a metal transition layer on a surface of the metal bonding layer using the electro arc ion plating or the magnetron sputtering; and
4) forming a metal conductive layer on the metal transition layer using the electro arc ion plating;
wherein in steps 2)-4), at least step 4) comprises: disposing a magnetic filter device between a metal target and a vacuum chamber in which the plastic workpiece is placed, so that positively charged metal ions generated by the metal target are deflected by the magnetic filter device and then enter the vacuum chamber to be deposited on the surface of the plastic workpiece.
In an embodiment, a material of the metal bonding layer comprises at least one of chromium, zirconium, or titanium, and a thickness of the metal bonding layer is 40-150 nm.
In an embodiment, forming the metal transition layer by co-depositing comprises co-depositing a first metal target and a second metal target to form a mixed metal plating layer with a thickness of 40-150 nm, the first metal target comprises a same material as the metal bonding layer, and the second metal target comprises a same material as the metal conductive layer.
In an embodiment, step 3) comprises at least disposing the magnetic filter device between the second metal target and the vacuum chamber.
In an embodiment, a material of the metal conductive layer comprises at least one of copper, nickel, or aluminum, and a thickness of the metal conductive layer is 100-1000 nm.
In an embodiment, step 1) comprises putting the plastic workpiece into the vacuum chamber, turning on a rotating rack disposed in the vacuum chamber, drawing a vacuum pressure of the vacuum chamber to less than 0.005 Pa, then introducing argon gas to enable the vacuum pressure of the vacuum chamber to increase to 0.1-2 Pa, setting a voltage of the ion source to 1000-3000 V, cleaning the plastic workpiece for 200-600 seconds, restoring the vacuum pressure of the vacuum chamber to less than 0.005 Pa, and cooling the plastic workpiece at the same time.
In an embodiment, the magnetic filter device comprises an elbow tube and a magnetic generator, the metal target is disposed on an inlet of the elbow tube, the vacuum chamber is disposed on an outlet of the elbow tube, a normal of the inlet and a normal of the outlet are perpendicular to each other, and the magnetic generator adjusts a current of a coil to enable magnetic field lines to be parallel to the elbow tube.
In an embodiment, the method further comprises applying a positive bias voltage of 100-500 V to the elbow tube.
In an embodiment, a material of the plastic workpiece comprises at least one of acrylonitrile butadiene styrene (ABS), propylene carbonate (PC), polymethyl methacrylate (PMMA), or polyethylene terephthalate (PET).
In an embodiment, electroplating after step 4), wherein the electroplating comprises electroplating pyrophosphate copper, then acid copper, then semi bright nickel, then bright nickel, then bright chromium on the plastic workpiece; or the electroplating comprises electroplating pyrophosphate copper, then acid copper, then bright nickel, then bright chromium on the plastic workpiece, wherein the bright chromium is trivalent chromium or hexavalent chromium.
Compared with the existing techniques, the technical solution has the following advantages.
Electro arc ion plating or magnetron sputtering technologies are used to evaporate the metal target. The evaporated particles pass through the magnetic filter device with electromagnetic field deflection. Neutral particle clusters cannot be deposited on the surface of the workpiece. The positively charged metal ions deflect under the Lorentz force, enter the vacuum chamber, and deposit on the surface of the workpiece to form the metal film layer. Since the film layer is almost all deposited by metal ions, no metal particle clusters (large particles) are deposited on the surface of the film layer like in the traditional PVD process, the film is flatter, and the metalized plastic workpiece can be electroplated to obtain a high-quality mirror appearance.
The present disclosure will be further described in combination with the accompanying embodiments and drawings.
A method for metallizing plastic by pre-plating for electroplating is further described as follows.
Step 1): A plastic workpiece is cleaned by an ion source to increase an activity of a surface of the plastic workpiece and enhance a bonding force between a metal film layer and a plastic substrate of the plastic workpiece. In detail, the plastic workpiece is put into a vacuum chamber of a PVD equipment, a rotating rack is turned on, and a vacuum pressure of the vacuum chamber is drawn to less than 0.005 Pa. Argon gas is injected to increase the vacuum pressure of the vacuum chamber to 0.1-2 Pa, a voltage of the ion source is set to 1000-3000 V, the plastic workpiece is cleaned for 200-600 seconds, the vacuum pressure of the vacuum chamber is restored to vacuum, and the plastic workpiece is cooled. A material that the plastic workpiece is made of includes, but is not limited to, ABS (acrylonitrile butadiene styrene), PC (propylene carbonate), PMMA (polymethyl methacrylate), or PET (polyethylene terephthalate).
Step 2): A metal bonding layer is formed on the surface of the plastic workpiece using an electro arc ion plating method or a magnetron sputtering method. The metal bonding layer uses a metal having a high melting point, such as chromium, zirconium, titanium, etc. to enhance the bonding force between the metal film layer and the plastic substrate. A thickness of the metal bonding layer is about 40-150 nm.
Step 3): A metal transition layer is formed on the metal bonding layer using the electro arc ion plating method or the magnetron sputtering method. A material of a first metal target being the same as a material of the metal bonding layer, and a material of a second metal target being the same as a material of a metal conductive layer are co-deposited to form a mixed metal plating layer (e.g., the metal transition layer) using co-depositing. A thickness of the metal transition layer is 40-150 nm.
Step 4): The metal conductive layer is formed on the metal transition layer using the electro arc ion plating method. The metal conductive layer uses good conductive metals, such as copper, nickel, aluminum, etc. to provide high conductivity and facilitate subsequent electroplating. A thickness of the metal conductive layer is 100-1000 nm.
In the aforementioned steps 2), 3), and 4), at least the step 4) comprises: a magnetic filter device is placed between a metal target (i.e., the metal having the high melting point, the first metal target, the second metal target, and/or the good conductive metals) and the vacuum chamber in which the plastic workpiece is placed, so that positively charged metal ions generated by the metal target are deflected by the magnetic filter device and then enter the vacuum chamber to be deposited on the surface of the plastic workpiece.
Referring to
In the present disclosure, at least a preparation of the metal conductive layer uses the magnetic filter device to ensure that the entire surface of the metal film layer formed in the pre-plating has the flat, dense, and uniform appearance. In addition, part or all of the preparations of the metal bonding layer and the metal transition layer can also use the magnetic filter device according to actual needs.
After the pre-plating is complete, the electroplating is carried out. The electroplating comprises electroplating the following metal on the plastic workpiece: pyrophosphate copper-acid copper-semi bright nickel-bright nickel-bright chromium. The processes after electroplating the acid copper can be adjusted according to actual preparation needs, for example, electroplating pyrophosphate copper-acid copper-bright nickel-bright chromium, and the bright chromium can be trivalent chromium or hexavalent chromium. Traditional electroplating further comprises a series of pre-treating, such as coarsening—catalyzing—debonding—chemical nickel. Wastewater of the coarsening comprises a large amount of dichromic acid waste solution. The present disclosure skips the aforementioned pre-treating.
A method for metallizing plastic by electroplating on the surface of a plastic shower is provided.
Step 1): the plastic workpiece (i.e., the plastic shower) is cleaned and dried, and then the plastic workpiece is put in the vacuum chamber, the rotating rack is turned on, the vacuum pressure of the vacuum chamber is drawn to less than 0.005 Pa, argon gas is introduced to enable the vacuum pressure of the vacuum chamber to increase to 0.3 Pa, the voltage of the ion source is set to 1500 V, the plastic workpiece is cleaned for 300 seconds, then the vacuum pressure of the vacuum chamber is restored to vacuum (i.e., less than 0.005 Pa), and at the same time, the plastic workpiece is cooled.
Step 2): A chromium target is processed by magnetron sputtering, and the current is set to 20 A. After 180 seconds of deposition, the vacuum pressure of the vacuum chamber is restored to vacuum, and at the same time, the plastic workpiece is cooled to form a chromium layer with a thickness of about 40 nm.
Step 3): The chromium target is processed by magnetron sputtering, the current is set to 20 A, the magnetic filter device is used, a copper target is processed by arc discharge, and the current is set to 150 A. The current configured to process the chromium target by magnetron sputtering is gradually reduced to 10 A within 600 seconds, then the vacuum pressure of the vacuum chamber is restored to vacuum, and at the same time, the plastic workpiece is cooled to form a chromium-copper alloy layer with a thickness of about 50 nm.
Step 4): The magnetic filter device is used, the copper target is processed by the arc discharge, and the current is set to 150 A. The copper layer is deposited to a thickness of about 300 nm, and then the pre-plating is complete.
Step 5): A detailed electroplating is as follows: pyrophosphate copper-acid copper-semi bright nickel-bright nickel-bright chromium. Reference can be made to conventional electroplating for the aforementioned step. The plastic workpiece is electroplated to obtain a mirror chromium appearance.
The embodiment differs from Embodiment 1 in that the comparative embodiment does not use the magnetic filter device, and the rest is the same.
Referring to
The electroplated metal film layer obtained in Embodiment 1 has been tested and has mechanical properties and durability similar to the traditional electroplated metal film layer.
The aforementioned embodiments are merely used to further disclose the method for metallizing plastic by pre-plating for electroplating of the present disclosure, and the scope of the disclosure is not limited thereto. Thus, it is intended that the present disclosure cover any modifications and variations of the presently presented embodiments provided they are made without departing from the appended claims and the specification of the present disclosure.
