The present invention relates to a method for producing a microfluidic device and to microfluidic devices.
For some years, laser welding has proven to be an attractive joining technique for microfluidic devices made of thermoplastic materials.
This involves, for example, one thermoplastic component, which has a depression acting as a microchannel, incorporating a laser absorber and being welded to another thermoplastic component by exposure to a laser beam. However, for reasons of adjustment, it is not possible to take the weld seam exactly flush along the depression opening. Moreover, the volume of the depression may be changed if the weld seam runs directly along the depression opening.
The publication US 2004/0053237 A1 describes the production of a microfluidic device by arranging a mask layer, which has apertures for forming microchannels, between two substrates and connecting the arrangement by means of laser welding, the weld seam being formed at a distance from the microchannels.
However, a weld seam formed by a conventional method at a distance from the microfluidic chambers may have the effect that capillaries form between the substrates and, if applicable, the mask layer in the region between the weld seam and the microchannels. Capillary formation along a microchannel is problematic, however, for many microfluidic applications.
The subject matter of the present invention is a method for producing a microfluidic device, in particular a microfluidic chip, for example a biochip, comprising the method steps of
When the pressing pressure is removed in method step d), the elastomer film has the tendency to expand and resume the original thickness from method step a). However, the weld has the effect that the base substrate and the cover substrate are fixed at a distance from each other that corresponds substantially to the reduced film thickness from method step b), so that the elastomer film cannot expand to its original thickness. By this effect, the elastomer film serves as a sealant, by which the forming of capillaries between the base substrate and the cover substrate can be advantageously avoided.
For the purposes of the present invention, the terms “base substrate” and “cover substrate” serve for distinguishing between the two substrates and for describing the arrangement of the substrates in relation to each other, and do not fix the alignment thereof with respect to the direction of gravity.
A microfluidic chamber may be, for example, a microchamber, for example a reagent chamber, or a microchannel, for example a fluid channel.
Within the scope of a preferred embodiment of the method according to the invention, the weld is formed at a distance from the depression opening. In this way, deforming of the wall of the depression and an accompanying change in volume can be advantageously avoided.
Within the scope of a further, preferred embodiment of the method according to the invention, the distance between the weld and the depression opening is in a ratio to the thickness of the elastomer film in the uncompressed state in a range from 2:1 to 30:1, for example from 2:1 to 10:1. This has proven to be advantageous for avoiding capillary formation.
For example, the elastomer film may in the uncompressed state have a thickness in a range from ≧10 μm to ≦300 μm, for example from ≧20 μm to ≦100 μm, further for example from ≧20 μm to ≦50 μm, and/or in the compressed state have a thickness (dk) in a range from ≧2 μm to ≦100 μm, for example from ≧10 μm to ≦30 μm, and the distance between the weld seam and the depression opening may have a value in a range from ≧10 μm to ≦500 μm, for example from ≧50 μm to ≦150 μm.
Within the scope of a further, preferred embodiment of the method according to the invention, the elastomer film can be compressed by at least 20 percent, in particular at least 50 percent, for example by at least percent, with respect to the thickness of the elastomer film in the uncompressed state. This has likewise proven to be advantageous for avoiding capillary formation.
Within the scope of a further, preferred embodiment of the method according to the invention, the pressing pressure has a value in a range from ≧5 N/mm2 to ≦500 N/mm2, for example from ≧10 N/mm2 to ≦100 N/mm2, or from ≧10 N/mm2 to ≦50 N/mm2.
The elastomer film, the base substrate and the cover substrate are preferably formed from a biocompatible material. Biocompatible means here that the material enters into interactions with biochemical analytes and specimens as little as possible, in particular not at all. The base substrate and the cover substrate are preferably formed from a material which does not deform, or not significantly, when the pressing pressure is exerted.
The elastomer film may, for example, comprise or be formed from at least one thermoplastic elastomer selected from the group comprising polyolefin elastomers (TPE-O), polyurethane elastomers (TPE-U), polyester elastomers (TPE-E), copolyester elastomers (TPC-ET), styrene elastomers (TPE-S), polyamide elastomers (TPE-A), elastomer vulcanizates (TPE-V), rubber elastomers or mixtures thereof. In particular, the elastomer film may comprise or be formed from a thermoplastic elastomer selected from the group comprising polyester urethanes, polyether urethanes and rubber blends. In particular, the polyester urethanes may be polyester urethanes that comprise diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), dimethyldiphenyl isocyanate (TODI) or mixtures thereof and polyadipate glycols, polycaprolactone glycols, polyoxy tetramethylene glycols, polycarbonate diols or mixtures thereof (as the elastic component). The polyether urethanes may be, in particular, polyether urethanes that comprise diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), dimethyldiphenyl isocyanate (TODI) or mixtures thereof and polyoxypropylene diols, polyoxytetramethylene diols or mixtures thereof. The rubber blends may be, in particular, ethylene-propylene copolymer polypropylene blends (EPM-PP), ethylene-propylene diene-polypropylene blends (EPDM-PP) or mixtures thereof.
The base substrate and/or the cover substrate may comprise or be formed from at least one thermoplastic material. For example, the base substrate and/or the cover substrate may comprise or be formed from at least one thermoplastic material selected from the group comprising polyolefins, in particular polypropylene (PP), polyethylene (PE) or polystyrene (PS), polycarbonates (PC), poly(meth)acrylates, in particular polymethylmethacrylate (PMMA), cyclo-olefin copolymers (COC) or cyclo-olefin polymers (COP) or mixtures thereof. In particular, the base substrate and/or the cover substrate may comprise or be formed from at least one thermoplastic material selected from the group comprising polycarbonates, polyolefins (PP, PE), cycloolefinic polymers, polystyrenes (PS), polymethylmethacrylates (PMMA) and mixtures thereof.
The base substrate and/or the cover substrate may, for example, be produced by an injection-molding or hot-embossing process. The depression(s) may in this case likewise be produced in the course of the injection-molding or hot-embossing process. However, it is similarly possible to form the depression(s) by an additive process, for example by photolithography, from a base substrate.
The base substrate and/or the cover substrate may take the form of a sheet. For example, the base substrate and/or the cover substrate may have a layer thickness of from ≧100 μm to ≦5 mm, in particular from ≧300 μm to ≦2 mm, for example from ≧700 μm to ≦1500 μm.
The depression opening or the depression openings may respectively have a surface area of less than or equal to 500 mm2. For example, a depression opening may have a surface area of from ≧0.1 mm2 to ≦400 mm2.
In principle, the elastomer film, the base substrate and/or the cover substrate may be laser-absorbent. For this purpose, the elastomer film, the base substrate and/or the cover substrate may comprise a black pigment and/or some other laser absorber. Suitable, for example, as “other laser absorbers” are substances which absorb a wavelength or a wavelength range that is used in laser welding. Such substances are, for example, “Lumogen” from the BASF company and “Clearweld” from the Clearweld company.
For example,
The elastomer film may extend partially or completely over the depression opening. The elastomer film may, however, also not extend over the depression opening. This can be achieved, for example, by the elastomer film being structured or not structured. For example, the elastomer film may be structured by an aperture or a number of apertures.
Within the scope of a further, preferred embodiment of the method according to the invention, the elastomer film has at least one aperture in the region of the depression opening. This has the advantage that a material located in the depression can be optically or spectroscopically examined better, since the material of the microfluidic device that has to be radiated through, and consequently the radiation absorption thereof, is reduced.
At the same time, the form and position of the aperture of the elastomer film may correspond to the form and position of the depression opening, in particular of the base substrate and/or the cover substrate.
Within the scope of a further, preferred embodiment of the method according to the invention, the base substrate has at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film, the cover substrate not having a depression opposite the depression opening of the base substrate. This has the advantage that a microfluidic device can be produced by the use of easily obtainable components and with little procedural effort, for example as a result of reduced adjustment requirements.
Within the scope of a further, preferred embodiment of the method according to the invention, the base substrate and the cover substrate respectively have at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film. In particular, the depression opening of the base substrate may in this case be formed opposite the depression opening of the cover substrate. In addition, the form and position of the depression opening of the base substrate may in this case correspond in particular to the form and position of the depression opening of the cover substrate and/or the form and position of the aperture of the elastomer film. If the elastomer film does not have an aperture, the arrangement may be advantageously used as a valve or as a pump. If the elastomer film has an aperture, this results in a connection between two microfluidic chambers, for example of two microchannels lying in different planes, it being possible for a material that is located in the chamber as a whole to be optically or spectroscopically examined better, since the material of the microfluidic device that has to be radiated through, and consequently the radiation absorption thereof, is reduced.
The weld may, in particular, be formed as or be a weld seam. For example, the weld may, in particular, be formed as or be a weld seam that runs partially or completely around the depression opening, in particular of the base substrate and/or the cover substrate, in particular at a distance.
A further subject matter of the present invention is a microfluidic device, in particular a microfluidic chip, for example a biochip, produced by a method according to the invention, which comprises a thermoplastic elastomer film, a base substrate and a cover substrate.
In this case, at least one of the substrates, that is to say the base substrate and/or the cover substrate, has at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film. The elastomer film is in this case arranged, in particular in a sandwich-like manner, between the base substrate and the cover substrate. The thermoplastic elastomer film, the base substrate and the cover substrate are in this case connected to one another by at least one weld, in particular a laser weld.
The elastomer film preferably has at least one aperture in the region of the depression opening. In this case, the form and position of the aperture of the elastomer film may correspond to the form and position of the depression opening, in particular of the base substrate and/or the cover substrate.
For example, the base substrate may have at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film, the cover substrate not having a depression opposite the depression opening of the base substrate.
However, it is similarly possible that both the base substrate and the cover substrate respectively have at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film. In particular, the depression opening of the base substrate may in this case be formed opposite the depression opening of the cover substrate. In addition, the form and position of the depression opening of the base substrate may in this case correspond to the form and position of the depression opening of the cover substrate and/or the form and position of the aperture of the elastomer film.
With regard to further features and advantages of this microfluidic device according to the invention, reference is hereby made explicitly to the features and advantages described in conjunction with the method according to the invention.
In addition, a subject matter of the present invention is a microfluidic device, in particular a microfluidic chip, for example a biochip, produced for example by a method according to the invention, which comprises a thermoplastic elastomer film, a base substrate and a cover substrate. In this case, at least one of the substrates, that is to say the base substrate and/or the cover substrate, has at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film. The elastomer film is in this case arranged, in particular in a sandwich-like manner, between the base substrate and the cover substrate. The thermoplastic elastomer film, the base substrate and the cover substrate are in this case connected to one another by at least one weld, in particular a laser weld. At the same time, the elastomer film has at least one aperture in the region of the depression opening. This has the advantage that a material located in the depression can be optically or spectroscopically examined better, since the material of the microfluidic device that has to be radiated through, and consequently the radiation absorption thereof, is reduced.
In this case, the form and position of the aperture of the elastomer film may correspond to the form and position of the depression opening, in particular of the base substrate and/or the cover substrate.
For example, the base substrate may have at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film, the cover substrate not having a depression opposite the depression opening of the base substrate.
However, it is similarly possible that both the base substrate and the cover substrate respectively have at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film. In particular, the depression opening of the base substrate may in this case be formed opposite the depression opening of the cover substrate. In addition, the form and position of the depression opening of the base substrate may in this case correspond to the form and position of the depression opening of the cover substrate and/or the form and position of the aperture of the elastomer film.
With regard to further features and advantages of this microfluidic device according to the invention, reference is hereby made explicitly to the features and advantages described in conjunction with the method according to the invention.
Furthermore, a subject matter of the present invention is a microfluidic device, in particular a microfluidic chip, for example a biochip, produced for example by a method according to the invention, which comprises a thermoplastic elastomer film, a base substrate and a cover substrate. At the same time, the base substrate has at least one depression for forming a microfluidic chamber, with a depression opening formed on the side of the substrate that is facing the elastomer film. In this case, the cover substrate does not have a depression opposite the depression opening of the base substrate. The elastomer film is in this case arranged, in particular in a sandwich-like manner, between the base substrate and the cover substrate. The thermoplastic elastomer film, the base substrate and the cover substrate are in this case connected to one another by at least one weld, in particular a laser weld. This has the advantage that a microfluidic device can be produced by the use of easily obtainable components and with little procedural effort, for example as a result of reduced adjustment requirements.
The elastomer film preferably has at least one aperture in the region of the depression opening. In this case, the form and position of the aperture of the elastomer film may correspond to the form and position of the depression opening of the base substrate.
With regard to further features and advantages of this microfluidic device according to the invention, reference is hereby made explicitly to the features and advantages described in conjunction with the method according to the invention.
Further advantages and advantageous refinements of the subjects according to the invention are illustrated by the drawings and are explained in the description which follows. In this, it should be noted that the drawings are only of a descriptive character and are not intended to restrict the invention in any form. In the drawings:
a shows a schematic cross section to illustrate method step a);
b shows a schematic cross section to illustrate method step b);
c shows a schematic cross section to illustrate method steps c) and d) and a first embodiment of a microfluidic device according to the invention;
d shows a schematic cross section to illustrate a second embodiment of a microfluidic device according to the invention;
a shows a schematic cross section to illustrate a third embodiment of a microfluidic device according to the invention; and
b shows a schematic cross section to illustrate a fourth embodiment of a microfluidic device according to the invention.
a shows that, within method step a), a thermoplastic elastomer film 1 is arranged in a sandwich-like manner between a base substrate 2 and a cover substrate 3.
b illustrates that, within method step b), the arrangement shown in
c shows that, within method step b), two welds, in particular weld seams, which connect the thermoplastic elastomer film 1, the base substrate 2 and the cover substrate 3, have been formed by laser welding.
d shows a second embodiment of a microfluidic device according to the invention, which differs from the first embodiment, shown in
a shows a third embodiment of a microfluidic device according to invention, which differs from the first embodiment, shown in
b shows a fourth embodiment of a microfluidic device according to the invention, which differs from the third embodiment, shown in
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2010 002 991.2 | Mar 2010 | DE | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/EP2011/050811 | 1/21/2011 | WO | 00 | 11/27/2012 |