Claims
- 1. A method for producing a plate or sheet useful in oil base ink planographic printing which comprises providing a substrate of an oleophilic resin having in the molecules thereof carbon-carbon double bonds and/or carbon atoms bonded with a single hydrogen atom in a total amount of not less than 0.05 mol/kg and having a contact angle with pure water above 40 degrees, non-mixingly contacting the substrate with hydrophilic radical polymerizable compound, wherein said hydrophilic radical polymerizable compound is a monomer capable of being dissolved in water or hydrophilic organic solvents or swollen by absorbing the water or the solvents in an amount of above 10% by weight at room temperature when converted to a homopolymer, and exposing the substrate contacted with the compound to actinic ray of 250 nm to 700 nm wavelength to form a hydrophilic thin layer chemically combined with the substrate, said thin layer having a contact angle with pure water of 20 degrees or less.
- 2. A method as claimed in claim 1, wherein said oleophilic resin is a member selected from the group consisting of diene homopolymers, diene copolymers, homo-or copolymers of 1-substituted olefins, copolymers of 1-substituted olefins with 1,2-di-substituted olefins, copolymers of 1-substituted olefins and/or 1,2-di-substituted olefins with 1,1-di-substituted olefins, unsaturated polyesters, unsaturated polyepoxides, unsaturated polyamides, unsaturated polyacryls epoxy resins, phenolic resins etherized with glycidyl ether, phenolic resins, polyurethanes, amino resins, polycarbonates, polyethers, furan resins, and polysulfons.
- 3. A method as claimed in claim 1, wherein and substrate contains conductive or semiconductive powder uniformly dispersed in said oleophilic resin to have a volume resistivity of from 10.sup.-3 to 10.sup.8 ohm.cm.
- 4. A method as claimed in claim 3, wherein said conductive or semiconductive powder is a member selected from the group consisting of carbonaceous materials, metals and semiconductive metal compounds doped with impurity element.
- 5. A method as claimed in claim 1, wherein said hydrophilic radical polymerizable compound is a member selected from the group consisting of acrylic acid, methacrylic acid, acrylic esters, methacrylic esters, vinyl compounds, styrene sulfonic acids, maleic acids, maleimides, acrylamides, and methacrylamides.
- 6. A method as claimed in claim 1, wherein said hydrophilic radical polymerizable compound is contacted with said substrate in the form of a composition which comprises at least 4% by weight of said compound, up to 10% by weight of a photosensitizer, up to 50% by weight of other radical polymerizable compound and up to 90% by weight of a solvent.
- 7. A method as claimed in claim 1, wherein said substrate further includes a support.
- 8. A method as claimed in claim 7, wherein said support is a member selected from the group consisting of paper, plastic and metal.
- 9. A method as claimed in claim 7, wherein said support includes a conductive layer in contact with said substrate to ensure passage of electric current to said substrate through said conductive layer.
- 10. A method as claimed in claim 1, further comprising treating said substrate obtained after completion of the irradiation with a non-solvent incapable of dissolving said substrate to remove the hydrophilic radical polymerizable compound remaining unreacted and a polymer formed from said compound but remaining chemically uncombined with said substrate.
- 11. A method as claimed in claim 1, wherein said substrate has carbon-carbon double bonds and/or carbon atoms bonded with a single hydrogen atom in a total amount of not less than 0.1 mol/kg and a contact angle with pure water above 50 degrees.
- 12. A method as claimed in claim 4, wherein said substrate further includes an aluminum sheet support, said oleophilic resin is polybutadiene containing carbon black and wherein said hydrophilic radical polymerizable compound is acrylamide.
Priority Claims (3)
Number |
Date |
Country |
Kind |
51-91464 |
Jul 1976 |
JPX |
|
52-70197 |
Jun 1977 |
JPX |
|
52-70198 |
Jun 1977 |
JPX |
|
Parent Case Info
This is a continuation of application Ser. No. 819,768, filed July 28, 1977 now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (3)
Number |
Date |
Country |
1496152 |
Jul 1973 |
DEX |
2450535 |
Apr 1976 |
DEX |
5073703 |
Jun 1975 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
819768 |
Jul 1977 |
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