Claims
- 1. A method of producing an Nb—Sn compound superconducting wire precursor comprising:forming a plurality of composite filament materials, each filament comprising a niobium material of an Nb-based metal and a titanium material of pure Ti enveloped in said niobium material; forming a composite rod in which said plurality of composite filament materials are arranged in a matrix of a Cu-based metal but not in contact with one another, wherein said matrix contains Sn diffused by heat treatment to combine with said niobium material to form a compound; and drawing said composite rod.
- 2. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 1, wherein forming the plurality of composite filament materials includes forming a plurality of composite filament materials each having 0.01 to 5.0% by weight of the titanium material.
- 3. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 1, wherein forming the plurality of composite filament materials includes forming a plurality of composite filament materials each comprising a niobium material containing 0.01 to 5.0% by weight of at least one element selected from the group consisting of Ta, Hf, Mo, Zr, V, and W.
- 4. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 1, wherein forming the composite rod includes arranging the plurality of the composite filament materials in a matrix of pure copper, and said Sn to be combined with said niobium material to form a compound comprises a tin-base core material of an Sn-based metal and is arranged in said matrix so as not to be in contact with said composite filament materials.
- 5. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 4, wherein each of said composite filament materials is shaped like a roll so that said tin-based core material of said Sn-based metal is enclosed by said composite filament materials.
- 6. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 4, wherein said tin-based material contains 0.01 to 10% by weight of at least one element selected from the group consisting of In, Ga, Bi, Mg, Al, Ge, and Si.
- 7. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 1, wherein forming the composite rod includes arranging the plurality of the composite filament materials in a matrix of Cu—Sn bronze, and said Sn to be combined with said niobium material to form a compound is Sn of said Cu—Sn bronze.
- 8. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 4, wherein forming the composite rod includes arranging the plurality of the composite filament materials in a matrix containing 0.01 to 5% by weight of at least one element selected from the group consisting of Mn, Ge, Si, Ni, Sn, Ga, and Zn.
- 9. The method of producing an Nb—Sn compound superconducting wire precursor according to claim 7, wherein forming the composite rod includes arranging the plurality of the composite filament materials in a matrix containing 0.01 to 5% by weight of at least one element selected from the group consisting of Mn, Ge, Si, Ni, Sn, Ga, and Zn.
- 10. A method of producing an Nb—Sn compound superconducting wire, comprising heat-treating an Nb—Sn compound superconducting wire precursor comprising:a matrix of a Cu-based metal; a plurality of composite filaments, each filament comprising a niobium layer of an Nb-based metal and a titanium layer of pure Ti enveloped in said niobium material; and Sn which forms a compound by being combined with said niobium layer, when the Nb—Sn compound superconducting wire precursor is subjected to heat treatment so that the Sn is diffused into said matrix, wherein said plurality of composite filaments are embedded in said matrix so as not to be in contact with one another, to form an Nb—Sn compound superconducting wire.
Parent Case Info
This is a divisional of application Ser. No. 09/141,561 filed Aug. 28, 1998, now U.S. Pat. No. 6,251,529.
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