Patent Application
20170080618
The present invent on relates to a method for producing a thermoset resin molded article. More particularly, the present invention relates to a method for producing a thermosetting resin molded article, in which emboss or decorative pattern can be formed at the same time of molding a thermosetting resin composition by using a decorative film.
The major method for decorating a thermosetting resin molded article (plastic) is in-mold molding method which is capable of decreasing the lead time after molding and controlling the total yield of the article during the process. In the in-mold molding method, the design of a decorative film is transferred to the thermosetting resin by using molds for an injection molding machine between which the decorative film having the previously-formed design is disposed and by forming a thermosetting resin by injection (injection molding). The method is categorized to in-mold lamination method in Which the decorative film is fully left on the molded article, or in-mold transfer method in which the design surface of the decorative film is only transferred to the article and the base film of the decorative film is peeled. The design surface in in-mold transfer method is formed by gravure printing or painting.
For forming decorative pattern on the surface of the thermosetting resin with the decorative film during injection molding, the decorative film should not be changed at the high molding pressure (about from 300 to 700 kg/cm2) and high temperature of the resin (from 150 to 350° C.) for injection molding. Therefore, as the resin for the base film as a substrate for the decorative film, a polycarbonate (PC), a poly(methyl methacrylate) (PMMA), a poly(ethylene terephthalate) (PET), or a crosslinked olefin thermoplastic elastomer (TPO) is commonly used. The decorative film is generally composed of a base film/a release layer/a protective layer/a decorative layer/an adhesive layer.
Patent Document 1 describes a laminated film for decorative molding, comprising a protective layer, a colored layer, and an adhesive layer in this order, and comprising a film for molding disposed between any two of the layers or on a surface of the protective layer, wherein the protective layer is formed of at least an active hydrogen component (A) and an organic isocyanate component (B) and contains a polyurethane resin (U) having a polycarbonate backbone with an alicyclic group; and wherein at least one of the conditions (1) and (2) is satisfied: the condition (1) is that the polyurethane resin (U) is a polyurethane resin (U1) having an group and/or a silanol group in the molecule, and the condition (2) is that the protective layer contains a compound (X) having a glycidyl ether group and an alkoxysityl group and/or a silanot group, and the polyurethane resin (U) is a polyurethane resin (U2) having an amino group or a carboxyl group and/or the salt thereof.
On the other hand, for decorating the surface during reaction injection molding (RIM) of the thermosetting resin, the decoration is commonly performed by in-mold coating tor painting the surface of the mold, or by painting, printing, or transferring method after forming the molded article of the thermosetting resin by molding. In-mold coating method has a limitation that the only one color can be used and that the removing angle of the article from the mold is limited even if emboss can be formed. In the decorating method after molding, the releasing agent on the surface of the molded article must be removed and emboss cannot be formed. Additionally, there is a concern that the lead time after molding may be increased and the yield may be decreased due to the quality failure of the molded article during the secondary processing.
Patent Document 1: WO 2013/99829 A1
The decorating method such as in-mold transfer method is possible to be applied to reaction injection molding (RIM) of the thermosetting resin composition. However, since the molding pressure of the thermosetting resin composition for RIM is generally from 1 to 10 kg/cm2 and the molding temperature is generally from 40 to 85° C., both of which are low, there is a problem that the decorative film using a PC, a PMMA, a PET, or a crosslinked TPO as the substrate has low conformity with the shape of the mold. On the other hand, if the decorative film is formed at a high temperature under vacuum, the conformity is improved. However, when three-dimensional emboss is formed on the film, there is a problem that emboss are distorted.
Accordingly, an object of the present invention is to provide a method for producing a thermosetting resin molded article, in which emboss or decorative pattern can be formed at the same time of molding a thermosetting resin composition.
The present invention is a method for producing a thermosetting resin molded article, comprising:
disposing a decorative film having a base film and a decorative layer on at least a design forming area in a surface of a shaping mold so that the decorative layer is faced inwardly; and
injecting a thermosetting resin composition into a cavity of the shaping mold and thermally curing the thermosetting resin composition, to obtain a thermosetting resin molded article having the decorative film formed on the surface of the cured material of the thermosetting resin composition;
wherein the based film used is a film which has a tensile elongation at break of more than 500% and a tensile stress at 100% of 0.1 MPa to 2.5 MPa, at the thermal curing temperature for the thermosetting resin composition.
The present invention is a method for producing a thermosetting resin molded article, comprising:
disposing a decorative film having a base film and a decorative layer on at least a design forming area in a surface of a shaping mold so that the decorative layer is faced inwardly; and
injecting a thermosetting resin composition into a cavity of the shaping mold and thermally curing the thermosetting resin composition, to obtain a thermosetting resin molded article having the decorative film formed on the surface of the cured material of the thermosetting resin composition;
wherein the based film used is a film which is formed of a non-crosslinked olefin thermoplastic resin and Which has a tensile elongation at break of 500% or more and a tensile stress at 100% of 0.1 MPa or more, at the thermal curing temperature for the thermosetting resin composition.
The present invention can provide a method for producing a thermosetting resin molded article, in which emboss or decorative pattern can be formed at the same time of molding a thermosetting resin composition.
In the present invention, as shown in
The decorative film 10 has abuse film 11 and a decorative layer 12, as shown in the configuration example of
On the surface of the base film 11 on which the decorative layer 12 is disposed, three-dimensional emboss such as leather pattern or wood grain pattern is preferably formed. Thus, the structure of the three-dimensional emboss is transferred to the decorative layer 12, and the thermosetting resin molded article having the decorative layer 12 with the three-dimensional emboss formed on the surface of the cured material 22 of the thermosetting resin composition 21 can be obtained, For example, the base film 11 having emboss can be formed by transferring the pattern of an embossing roll to the surface of the base film 11.
In the present invention, a film, which is formed of a non-crosslinked olefin thermoplastic resin and which has a tensile elongation at break of 500% or more and a tensile stress at 100% of 0.1 MPa or more, at the thermal curing temperature for the thermosetting resin composition for RIM, is used as the base film. When the tensile elongation at break is 500% or more, the conformity of the thermosetting resin composition is improved, and thereby the decorative pattern can be formed on the surface of the thermosetting resin molded article without changing the shape of the article. When the tensile stress at 100% is 0.1 MPa or more, even if the three-dimensional emboss is formed on the surface of the base film on which the decorative layer is disposed, and then the decorative pattern is formed with the decorative layer having the emboss, the three-dimensional emboss is not distorted, The tensile elongation at break of the thermosetting resin composition is preferably more than 500% (it is not broken at 500% tensile elongation).
The tensile stress at 100% is preferably 0.5 MPa or more, more preferably 1.0 MPa or more, and further preferably 2.0 MPa or more. The tensile stress at 100% is preferably 5.0 MPa or less, more preferably 3.5 MPa or less, and further preferably 2.5 MPa or less.
The tensile elongation at break and the tensile stress at 100% of the base film are measured by a tensile test at an initial distance between zippers of 60 mm and a tensile speed of 200 mm/min.
The base film 11 is preferably formed of a non-crosslinked olefin thermoplastic resin. Examples of the olefin thermoplastic resin include polyolefins such as polyethylenes and polypropylenes; and olefin thermoplastic copolymers such as ethylene-α-olefin copolymers, ethylene-vinyl acetate copolymers, ethylene-methyl methacrylate copolymers, ethylene-ethyl acrylate copolymers, ethylene-n-butyl acrylate copolymers, and propylene-α-olefin copolymers. Also, olefin thermoplastic elastomers (TPO) can be used.
These are preferably a non-crosslinked resin (a resin without crosslink treatment). Using a non-crosslinked resin, the base film tends to be a film having a tensile elongation at break of 500% or more and a tensile stress at 100% of 0.1 MPa or more, at the thermal curing temperature for the thermosetting resin composition for RIM.
In particular, as the base film in the present invention, (1) a film which has a tensile elongation at break of more than 500% and a tensile stress at 100% of 0.1 MPa to 2.5 MPa is used as the base film, at the thermal curing temperature for the thermosetting resin composition; or (2) a film which is formed of a non-crosslinked olefin thermoplastic resin and which has a tensile elongation at break of 500% or more and a tensile stress at 100% of 0.1 MPa or more, at the thermal curing temperature for the thermosetting resin composition is preferably selected.
For forming decorative pattern on the surface of the thermosetting resin with the decorative film during injection molding, the decorative film should not be changed at the high molding pressure (about from 300 to 700 kg/cm2) and high temperature of the resin (from 150 to 350° C.) for injection molding. Therefore, as the resin for the base film as a substrate for the decorative film, a polycarbonate (PC), a poly(methyl methacrylate) (PMMA), a poly(ethylene terephthalate) (PET), or a crosslinked olefin thermoplastic elastomer (TPO) is commonly used. However, in the case of RIM of the thermosetting resin composition, the pressure is lower than that for injection molding as described below and a non-crosslinked olefin thermoplastic elastomer (TPO) is preferred used. Thus, the conformity of the thermosetting resin composition is improved, and thereby the decorative pattern can be formed on the surface of the thermosetting resin molded article without changing the shape of the article,
The decorative layer 12 can be formed of a paint composition obtained by adding a colorant such as pigment or dye to a resin. More specifically, after a three-dimensional emboss is formed on the surface of the base film 11 as needed, the paint composition can be applied on the film to form the decorative layer 12. In view of the adhesiveness against the thermosetting resin composition for RIM, the base resin of the paint composition for forming the decorative layer 12 is preferably a thermosetting resin, and more preferably an acryl urethane resin. In the case where a three-dimensional emboss is formed on the surface of the base film 11 on which the decorative layer 12 is disposed, the other surface of the base film 11 opposed to the decorative layer 12 may be a flat surface as shown in
The thickness of the decorative film 10 is preferably from 0.025 to 0.8 mm, and more preferably from 0.3 to 0.5 mm. The thickness of the base film 11 is preferably from 0.02 to 0.7 mm, and more preferably from 0.03 to 0.5 mm. The thickness of the decorative layer 12 is preferably from 0.005 to 0.1 mm, and more preferably from 0.02 to 0.06 mm When three-dimensional emboss is formed on the surface of the base film 11 on which the decorative layer 12 is disposed, the thicknesses of the base film 11 and the decorative layer 12 respectively mean the average thereof.
The decorative film 10 may have another layer except for the base film 11 and the decorative layer 12. Examples of the layer except for the base film 11 and the decorative layer 12 include a release layer, a protective layer, and an adhesive layer, Although the configuration of the decorative film is generally composed of a base film/a release layer/a protective layer/a decorative layer/an adhesive layer, the decorative film used in the present invention may also be composed of a base film/a decorative layer only.
The decorative film 10 may be disposed after forming in conformity with the shape of at least a design forming area in a surface of a shaping mold, or may be formed in conformity with the shape by sucking air from a sucking port (not shown) mounted on the surface of the female mold (lower mold) 2 after disposing the film on the female mold (lower mold) 2 in
After that, in the present invention, as shown in
In
The thermal curing temperature for the thermosetting resin composition is preferably from 30 to 110° C., more preferably from 40 to 85° C., and is, for example, 65° C. The thermal curing can be performed by continuously heating the male mold (upper mold) 2 and the female mold (lower mold) 4 with a heating means not shown in Figures. The temperature of the shaping mold 1 may be the same as the thermal curing temperature for the thermosetting resin composition. The temperature is preferably from 30 to 110° C., more preferably from 40 to 85° C., and is maintained, for example, at 65° C. The thermosetting resin composition is cured by urethane reaction when a urethane resin composition is used as the thermosetting resin composition. When the composition is cured by urethane-urea reaction, the reaction time can be decreased and the heat resistance of the resulting article can be increased.
Furthermore, the base film 11 may be peeled from the resulting thermosetting resin molded article (
As described above, by RIM of the thermosetting resin composition according to the method of the present invention, emboss or pattern is easily formed on the thermosetting resin composition while molding the composition, in particular, the thermosetting resin molded article having emboss or pattern can be obtained. Since emboss is not formed on the shaping mold itself, the present invention has an advantage that any conventional shaping mold Which is used for another molding without embossing or pattern decorating can be used.
Firstly, a decorative film 10 composed of a base film 11 and a decorative layer 12 was disposed on a female mold (lower mold) 2 of a shaping mold so that the decorative layer 12 was faced inwardly. By sucking air from a sucking port (not shown) formed on the female mold (lower mold) 2, the decorative film 10 was formed in conformity with the shape of the design forming area in the surface of the shaping mold, as shown in
As the base film 11, a non-crosslinked olefin thermoplastic elastomer (TPO) having a leather pattern on the surface, which is formed by transferring the pattern of an embossing roll to the surface was used. The decorative layer 12 made of an acryl urethane resin was on the base film 11 (the thickness of the decorative film 10: 0.38 mm, the thickness of the base film 11: 0.35 mm, and the thickness of the decorative layer 12: 0.03 mm). The tensile elongation at break of the base film 11 at 65° C. was more than 500% (it was not broken at 500% elongation) and the tensile stress at 100% at 65° C. was 2.4 MPa.
After that, as shown in
The operations were carried out in the same manner as in Example 1 except that a wood grain pattern was formed on the surface of the base film 11 by transferring the pattern of an embossing roll to the surface. The decorative layer 12 was formed on the surface of the resulting urethane resin molded article without distorting the wood grain pattern.
The operations were carried out in the same manner as in Example 1 except that an olefin thermoplastic elastomer (TPO) with crosslink treatment was used as the base film 11. The tensile elongation at break of the base film 11 at 65° C. was 48.5% and the tensile stress at 100% at 65° C. was 4.0 MPa. The decorative layer 12 of the resulting urethane resin molded article was coming off. The base film 11 could not be formed in conformity with the shape of the shaping mold having a concave R.
The decorative film 10 used in Example 1 was molded at 140° C. with a vacuum molding machine. However, the leather pattern formed on the surface of the base film 11 was distorted. The tensile elongation at break of the base film 11 at 140° C. was more than 500% and the tensile stress at 100% at 140° C. was 0.06 MPa.
| Number | Date | Country | Kind |
|---|---|---|---|
| JP2015-014903 | Jan 2015 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2015/083346 | 11/27/2015 | WO | 00 |
