J.E. Lawrence, H.R. Huff, Silicon Material Properties For VLSI Circuitry, 1982, VLSI Electronics: Microstructure Science, vol. 5, pp. 51-102. |
Correlation of Silicon Material Characteristics and Device Performance, J.E. Lawrence, American Microsystems, Inc., Santa Clara, California 95051, Reprinted from Semiconductor Silicon 1973, pp. 17-34. |
Metallographic Analysis of Gettered Silicon, J.E. Lawrence, vol. 242, Mar. 1968, Transactions of The Metallurigical Society of AIME, pp. 484-489. |
"Crystallographic Imperfections and Their Effect on Micro-Electronic Performance", J.E. Lawrence, pp. 52-57, Proceedings, Advanced Techniques in Failure Analysis Symposium 1976. |
J.E. Lawrence, The Case For Reclaim Wafers, Reprinted from Electronic Packaging and Production, Jan. 1974, pp. 66-78. |
J.E. Lawrence, Silicon Wafer Reclamation: A Processing Service, Reprinted from Electronic Packaging and Production Jul. 1975, p. 123. |
"Test Wafer Manufacture", pp. 89-90. |
Exsil Company Brochure. |