Cleaning for reclaiming

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CPC
H01L21/02079

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02079Cleaning for reclaiming

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Decomposing/cleaning composition, method for cleaning adhesive poly...
- Patent number 12,221,595
- Issue date Feb 11, 2025
- Resonac Corporation
- Susumu Nakazaki
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Epitaxial alkali halide layers for III-V substrate recycling
- Patent number 12,198,924
- Issue date Jan 14, 2025
- Alliance for Sustainable Energy, LLC
- Brelon James May
- B08 - CLEANING
Information Patent Grant
Method for producing a composite structure comprising a thin layer...
- Patent number 12,198,983
- Issue date Jan 14, 2025
- Soitec
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,187,989
- Issue date Jan 7, 2025
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Method for manufacturing a composite structure comprising a thin la...
- Patent number 12,159,781
- Issue date Dec 3, 2024
- Soitec
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,129,455
- Issue date Oct 29, 2024
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Ultrasonic cleaning method
- Patent number 12,115,564
- Issue date Oct 15, 2024
- YAMAHA ROBOTICS HOLDINGS CO., LTD.
- Michael Kirkby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of device wafer
- Patent number 11,646,229
- Issue date May 9, 2023
- Disco Corporation
- Minoru Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metrology method in wafer transportation
- Patent number 11,387,123
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Powen Huang
- B08 - CLEANING
Information Patent Grant
Composition for forming a coating film for removing foreign matters
- Patent number 11,319,514
- Issue date May 3, 2022
- NISSAN CHEMICAL CORPORATION
- Takahiro Kishioka
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Device modified substrate article and methods for making
- Patent number 11,192,340
- Issue date Dec 7, 2021
- Corning Incorporated
- Kaveh Adib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance solar cells, arrays and manufacturing processes th...
- Patent number 10,892,372
- Issue date Jan 12, 2021
- mPower Technology, Inc.
- Murat Okandan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing restored substrate and method for manufact...
- Patent number 10,763,100
- Issue date Sep 1, 2020
- Nichia Corporation
- Takayuki Mitsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metrology method in wafer transportation
- Patent number 10,651,066
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Powen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatuses and substrate processing methods
- Patent number 10,566,181
- Issue date Feb 18, 2020
- ASM IP Holding B.V.
- Yukihiro Mori
- B08 - CLEANING
Information Patent Grant
Systems and methods for anisotropic material breakthrough
- Patent number 10,566,206
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Mandar Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device modified substrate article and methods for making
- Patent number 10,543,662
- Issue date Jan 28, 2020
- Corning Incorporated
- Robert Alan Bellman
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Polysilicon chip reclamation assembly and method of reclaiming poly...
- Patent number 10,431,447
- Issue date Oct 1, 2019
- Hemlock Semiconductor Corporation
- Jason L. Giardina
- B08 - CLEANING
Information Patent Grant
Sapphire substrate recycling method
- Patent number 10,283,346
- Issue date May 7, 2019
- Enraytek Optoelectronics Co., Ltd.
- Houyong Ma
- B08 - CLEANING
Information Patent Grant
Semiconductor structures including carrier wafers and attached devi...
- Patent number 10,128,142
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework and stripping of complex patterning layers using chemical me...
- Patent number 9,934,980
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Jassem A. Abdallah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-bonding and cleaning process and system
- Patent number 9,895,871
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycle photochemical to reduce cost of material and environmental...
- Patent number 9,421,567
- Issue date Aug 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Winston Wu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods of forming a protection layer to protect a metal hard mask...
- Patent number 9,287,109
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron induced chemical etching and deposition for local circuit...
- Patent number 8,821,682
- Issue date Sep 2, 2014
- Micron Technology, Inc.
- Mark J. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for recovering metal copper from coated copper wires
- Patent number 8,747,519
- Issue date Jun 10, 2014
- Institute of National Colleges of Technology, Japan
- Hiroshi Okano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wafer recycling method
- Patent number 8,709,954
- Issue date Apr 29, 2014
- LG Innotek Co., Ltd
- Kyung Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for recycling semiconductor wafers having lo...
- Patent number 8,642,526
- Issue date Feb 4, 2014
- Advanced Technology Materials, Inc.
- Pamela M. Visintin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for fabricating a semiconductor on insulator type substrate
- Patent number 8,216,917
- Issue date Jul 10, 2012
- Soitec
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC CLEANING METHOD
- Publication number 20240269716
- Publication date Aug 15, 2024
- Yamaha Robotics Holdings Co., Ltd.
- Michael KIRKBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...
- Publication number 20230260841
- Publication date Aug 17, 2023
- SOITEC
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE
- Publication number 20230230851
- Publication date Jul 20, 2023
- University of South Carolina
- ASIF KHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
- Publication number 20230197435
- Publication date Jun 22, 2023
- SOITEC
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EPITAXIAL ALKALI HALIDE LAYERS FOR III-V SUBSTRATE RECYCLING
- Publication number 20230197436
- Publication date Jun 22, 2023
- ALLIANCE FOR SUSTAINABLE ENERGY, LLC
- Brelon James MAY
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230187255
- Publication date Jun 15, 2023
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DELAMINATION DEVICE AND CONTROL METHOD THEREFOR
- Publication number 20230162997
- Publication date May 25, 2023
- ENGION CO., LTD.
- Jae Won CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SU...
- Publication number 20230151308
- Publication date May 18, 2023
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- B08 - CLEANING
Information Patent Application
METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING P...
- Publication number 20230125907
- Publication date Apr 27, 2023
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- B08 - CLEANING
Information Patent Application
CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...
- Publication number 20220195352
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20220139699
- Publication date May 5, 2022
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- B08 - CLEANING
Information Patent Application
DECOMPOSING/CLEANING COMPOSITION, METHOD FOR CLEANING ADHESIVE POLY...
- Publication number 20220119739
- Publication date Apr 21, 2022
- SHOWA DENKO K.K.
- Susumu NAKAZAKI
- B08 - CLEANING
Information Patent Application
PROCESSING METHOD OF DEVICE WAFER
- Publication number 20210265211
- Publication date Aug 26, 2021
- Disco Corporation
- Minoru Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20210242043
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY METHOD IN WAFER TRANSPORTATION
- Publication number 20200251365
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Powen HUANG
- G01 - MEASURING TESTING
Information Patent Application
COMPOSITION FOR FORMING A COATING FILM FOR REMOVING FOREIGN MATTERS
- Publication number 20200140792
- Publication date May 7, 2020
- NISSAN CHEMICAL CORPORATION
- Takahiro KISHIOKA
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUSES AND SUBSTRATE PROCESSING METHODS
- Publication number 20200043719
- Publication date Feb 6, 2020
- ASM IP HOLDING B.V.
- Yukihiro Mori
- B08 - CLEANING
Information Patent Application
METROLOGY METHOD IN WAFER TRANSPORTATION
- Publication number 20190164792
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Powen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Transferring a Graphene Monolayer via a Stacked Structur...
- Publication number 20190051553
- Publication date Feb 14, 2019
- United States of America as represented by Secretary of the Navy
- Nackieb M. Kamin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYSILICON CHIP RECLAMATION ASSEMBLY AND METHOD OF RECLAIMING POLY...
- Publication number 20180226243
- Publication date Aug 9, 2018
- HEMLOCK SEMICONDUCTOR CORPORATION
- Jason L. Giardina
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MANUFACTURING RESTORED SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20180182617
- Publication date Jun 28, 2018
- Nichia Corporation.
- Takayuki MITSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAPPHIRE SUBSTRATE RECYCLING METHOD
- Publication number 20170263446
- Publication date Sep 14, 2017
- Enraytek Optoelectronics Co., Ltd.
- Houyong MA
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE,...
- Publication number 20160225613
- Publication date Aug 4, 2016
- SHIBAURA MECHATRONICS CORPORATION
- Takahiro Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECYCLE PHOTOCHEMICAL TO REDUCE COST OF MATERIAL AND ENVIRONMENTAL...
- Publication number 20160067729
- Publication date Mar 10, 2016
- Winston Wu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS OF FORMING A PROTECTION LAYER TO PROTECT A METAL HARD MASK...
- Publication number 20140264758
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECOVERING METAL COPPER FROM COATED COPPER WIRES
- Publication number 20130081515
- Publication date Apr 4, 2013
- POLYTECH KAGAWA CO., LTD.
- Hiroshi Okano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LO...
- Publication number 20110275164
- Publication date Nov 10, 2011
- Advanced Technology Materials, Inc.
- Pamela M. Visintin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONTROL WAFER RECLAMATION PROCESS
- Publication number 20110223767
- Publication date Sep 15, 2011
- Taiwan Semiconductor Manufacturing Co., LTD
- Jin-Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REWORKING SILICON-CONTAINING ARC LAYERS ON A SUBSTRATE
- Publication number 20110076623
- Publication date Mar 31, 2011
- TOKYO ELECTRON LIMITED
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Cleaning for reclaiming

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Decomposing/cleaning composition, method for cleaning adhesive poly...

Epitaxial alkali halide layers for III-V substrate recycling

Method for producing a composite structure comprising a thin layer...

Cleaning solution for temporary adhesive for substrates, substrate...

Method for manufacturing a composite structure comprising a thin la...

Cleaning solution for temporary adhesive for substrates, substrate...

Ultrasonic cleaning method

Fully automated wafer debonding system and method thereof

Processing method of device wafer

Metrology method in wafer transportation

Composition for forming a coating film for removing foreign matters

Device modified substrate article and methods for making

High performance solar cells, arrays and manufacturing processes th...

Method for manufacturing restored substrate and method for manufact...

Metrology method in wafer transportation

Substrate processing apparatuses and substrate processing methods

Systems and methods for anisotropic material breakthrough

Device modified substrate article and methods for making

Polysilicon chip reclamation assembly and method of reclaiming poly...

Sapphire substrate recycling method

Semiconductor structures including carrier wafers and attached devi...

Rework and stripping of complex patterning layers using chemical me...

De-bonding and cleaning process and system

Recycle photochemical to reduce cost of material and environmental...

Methods of forming a protection layer to protect a metal hard mask...

Electron induced chemical etching and deposition for local circuit...

Method for recovering metal copper from coated copper wires

Wafer recycling method

Composition and method for recycling semiconductor wafers having lo...

Method for fabricating a semiconductor on insulator type substrate

Patents Applicationslast 30 patents

ULTRASONIC CLEANING METHOD

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...

TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...

EPITAXIAL ALKALI HALIDE LAYERS FOR III-V SUBSTRATE RECYCLING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP DELAMINATION DEVICE AND CONTROL METHOD THEREFOR

SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SU...

METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING P...

CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

DECOMPOSING/CLEANING COMPOSITION, METHOD FOR CLEANING ADHESIVE POLY...

PROCESSING METHOD OF DEVICE WAFER

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

METROLOGY METHOD IN WAFER TRANSPORTATION

COMPOSITION FOR FORMING A COATING FILM FOR REMOVING FOREIGN MATTERS

SUBSTRATE PROCESSING APPARATUSES AND SUBSTRATE PROCESSING METHODS

METROLOGY METHOD IN WAFER TRANSPORTATION

Methods of Transferring a Graphene Monolayer via a Stacked Structur...

POLYSILICON CHIP RECLAMATION ASSEMBLY AND METHOD OF RECLAIMING POLY...

METHOD FOR MANUFACTURING RESTORED SUBSTRATE AND METHOD FOR MANUFACT...

SAPPHIRE SUBSTRATE RECYCLING METHOD

SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE,...

RECYCLE PHOTOCHEMICAL TO REDUCE COST OF MATERIAL AND ENVIRONMENTAL...

METHODS OF FORMING A PROTECTION LAYER TO PROTECT A METAL HARD MASK...

METHOD FOR RECOVERING METAL COPPER FROM COATED COPPER WIRES

COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LO...

CONTROL WAFER RECLAMATION PROCESS

METHOD FOR REWORKING SILICON-CONTAINING ARC LAYERS ON A SUBSTRATE