This application claims the benefit of U.S. Provisional Application Ser. No. 60/208,777 filed Jun. 1, 2000,
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Entry |
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Peters, Laura, Senior ed., “Choices and Challenges for Shallow Trench Isolation”, Semiconductors International, Apr. 1999, pp. 68, 70, 72, 74, 76. |
Number | Date | Country | |
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60/208777 | Jun 2000 | US |