using trench refilling with dielectric materials

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CPC
H01L21/76224

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76224using trench refilling with dielectric materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Horizontal hall device and preparation method
- Patent number 12,366,614
- Issue date Jul 22, 2025
- Southeast University
- Long Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming dielectric layers through deposition and anneal...
- Patent number 12,368,044
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Test structure of wafer and method of manufacturing test structure...
- Patent number 12,362,242
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongcheng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated manufacturing method
- Patent number 12,363,972
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of compound-semiconductor-based devices and silicon-bas...
- Patent number 12,362,172
- Issue date Jul 15, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ramsey Hazbun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, fabrication method and three-dimensional m...
- Patent number 12,362,223
- Issue date Jul 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Teng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin fin structure and method of fabricating the same
- Patent number 12,363,958
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sherry Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures of semiconductor devices
- Patent number 12,363,962
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pinyen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky barrier diode with reduced leakage current and method of f...
- Patent number 12,363,925
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 12,363,882
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method of forming the same
- Patent number 12,356,633
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing integrated deep trench optically sensitive defec...
- Patent number 12,354,904
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical device having a protrusion source
- Patent number 12,349,435
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- De-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
- Patent number 12,349,450
- Issue date Jul 1, 2025
- Intel Corporation
- Anthony St. Amour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,341,077
- Issue date Jun 24, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fin structures
- Patent number 12,342,605
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising steps
- Patent number 12,341,112
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,341,076
- Issue date Jun 24, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,342,586
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yanhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure and a self-aligned capping layer formed thereon
- Patent number 12,334,388
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with MFMIS memory cell and CMOS transistor
- Patent number 12,336,230
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Stefan Dünkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,328,903
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,328,963
- Issue date Jun 10, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacture method thereof
- Patent number 12,324,198
- Issue date Jun 3, 2025
- Yangtze Memory Technologies Co., Ltd.
- Teng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating physically unclonable function device
- Patent number 12,322,645
- Issue date Jun 3, 2025
- United Microelectronics Corp.
- Ping-Chia Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating Fin-type field-effect transistor device havin...
- Patent number 12,324,224
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including pillars with partially-circular u...
- Patent number 12,324,154
- Issue date Jun 3, 2025
- Lodestar Licensing Group LLC
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fork sheet device with better electrostatic control
- Patent number 12,324,234
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,315,758
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Shiau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
- Publication number 20250239482
- Publication date Jul 24, 2025
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250240972
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hidenobu NAGASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS
- Publication number 20250241052
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
- Publication number 20250239520
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHOTTKY DIODE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDIN...
- Publication number 20250241020
- Publication date Jul 24, 2025
- DB HITEK CO., LTD.
- Kyu Ok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250241005
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chung-Huai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...
- Publication number 20250241019
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC CHIPS
- Publication number 20250239481
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Gregoire DELACOURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT, AND CORRESPONDING I...
- Publication number 20250240953
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250234633
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- SANGMIN YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250233012
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MEMORY DEVICE
- Publication number 20250234556
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING TECHNIQUES FOR FORMING A DEEP TRENCH ISOLATION ST...
- Publication number 20250233013
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR JUNCTION TRANSISTOR WITH DIELECTRIC ISOLATION STRUCTURES
- Publication number 20250234634
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Shuan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250227979
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GATE SEPARATION REGION
- Publication number 20250227987
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250227910
- Publication date Jul 10, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Daochu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DIFFUSION BREAK
- Publication number 20250227997
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM CELL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226316
- Publication date Jul 10, 2025
- ETRON TECHNOLOGY, INC.
- Ming-Hong KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING
- Publication number 20250220946
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE WITH INTRINSIC EPITAXIAL LAYER
- Publication number 20250221052
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Tian Ping Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250218860
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...
- Publication number 20250218859
- Publication date Jul 3, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...
- Publication number 20250218861
- Publication date Jul 3, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION
- Publication number 20250218900
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...
- Publication number 20250218791
- Publication date Jul 3, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...
- Publication number 20250220984
- Publication date Jul 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
- Publication number 20250212505
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
- Publication number 20250203976
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS

using trench refilling with dielectric materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Horizontal hall device and preparation method

Methods of forming dielectric layers through deposition and anneal...

Test structure of wafer and method of manufacturing test structure...

Semiconductor structure and associated manufacturing method

Integration of compound-semiconductor-based devices and silicon-bas...

Semiconductor structure, fabrication method and three-dimensional m...

Ultra-thin fin structure and method of fabricating the same

Isolation structures of semiconductor devices

Schottky barrier diode with reduced leakage current and method of f...

Method of manufacturing semiconductor structure and semiconductor s...

Semiconductor devices and method of forming the same

Method of reducing integrated deep trench optically sensitive defec...

Vertical device having a protrusion source

Trench plug hardmask for advanced integrated circuit structure fabr...

Semiconductor circuit structure with direct die heat removal structure

Semiconductor device with fin structures

Semiconductor devices comprising steps

Method for forming a semiconductor structure by diffusing manganese...

Semiconductor circuit structure with direct die heat removal structure

Semiconductor structure and manufacturing method thereof

Isolation structure and a self-aligned capping layer formed thereon

IC structure with MFMIS memory cell and CMOS transistor

Semiconductor devices and methods of manufacturing thereof

Semiconductor device and manufacturing method therefor

Semiconductor device and manufacture method thereof

Method for fabricating physically unclonable function device

Method of fabricating Fin-type field-effect transistor device havin...

Microelectronic devices including pillars with partially-circular u...

Fork sheet device with better electrostatic control

Semiconductor device and method

Patents Applicationslast 30 patents

FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES

SEMICONDUCTOR MEMORY DEVICE

METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY

SCHOTTKY DIODE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDIN...

ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...

METHOD OF FABRICATING ELECTRONIC CHIPS

METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT, AND CORRESPONDING I...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

EMBEDDED MEMORY DEVICE

DOUBLE PATTERNING TECHNIQUES FOR FORMING A DEEP TRENCH ISOLATION ST...

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

BIPOLAR JUNCTION TRANSISTOR WITH DIELECTRIC ISOLATION STRUCTURES

SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING GATE SEPARATION REGION

SEMICONDUCTOR STRUCTURE

BACKSIDE DIFFUSION BREAK

DRAM CELL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING

DIODE WITH INTRINSIC EPITAXIAL LAYER

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...

SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...

THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION

SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...

SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...

SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...