using trench refilling with dielectric materials

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H01L21/76224

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76224using trench refilling with dielectric materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 12,217,999
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gate separation region
- Patent number 12,218,131
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,218,221
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,213,309
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Gongyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable chemical vapor deposition of metal oxides
- Patent number 12,211,736
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Hurshvardhan Srivastava
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of fin-type field effect transistor structure
- Patent number 12,211,843
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,211,844
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for semiconductor device
- Patent number 12,211,917
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,206,010
- Issue date Jan 21, 2025
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET semiconductor device
- Patent number 12,206,001
- Issue date Jan 21, 2025
- QUALCOMM Incorporated
- Bin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wrap around silicide and hybrid fin
- Patent number 12,205,998
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam free isolation structures and method for making the same
- Patent number 12,199,097
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Ruei Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 12,198,936
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising trenches formed in a substrate
- Patent number 12,198,973
- Issue date Jan 14, 2025
- STMicroelectronics (Rousset) SAS
- Franck Julien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gap-filling process for semiconductor device
- Patent number 12,198,974
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-I Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual channel gate all around transistor device and fabrication meth...
- Patent number 12,198,986
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Sheng Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and method for manufacturing the same
- Patent number 12,191,155
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thicker corner of a gate dielectric structure around a recessed gat...
- Patent number 12,191,365
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked field-effect transistors
- Patent number 12,183,740
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with metal-semico...
- Patent number 12,183,793
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including an isolation insulating pattern on...
- Patent number 12,183,732
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Inwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,183,734
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Sang Min Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND T...
- Publication number 20250048710
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lo-Heng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250046679
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...
- Publication number 20250046714
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION MODULE FOR BACKSIDE POWER DELIVERY
- Publication number 20250040170
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING AN ELECTRONIC COMPONENT...
- Publication number 20250040210
- Publication date Jan 30, 2025
- STMicroelectronics International N.V.
- Riccardo DEPETRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE HAVING DIFFERENT LINERS ON UPPER AND LOWER PORT...
- Publication number 20250029869
- Publication date Jan 23, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jianwei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20250026962
- Publication date Jan 23, 2025
- SOULBRAIN CO., LTD
- Jae-Wan PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVE DOUBLE DIFFUSION BREAK STRUCTURES FOR MULTI-STACK SEMICON...
- Publication number 20250031360
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN DEVICE AREAS
- Publication number 20250022746
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...
- Publication number 20250014940
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250014948
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250006504
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Jason MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING A SEMICONDUC...
- Publication number 20250008722
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Gyeyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250006586
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN
- Publication number 20250006547
- Publication date Jan 2, 2025
- Intel Corporation
- Mohammad HASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429118
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Keisuke TOKUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421166
- Publication date Dec 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Makoto KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACKSIDE ISOLATION FEATURE FOR MERGED EPITAXY
- Publication number 20240420990
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240413006
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Min-Chung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240413005
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Jen-I LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH A CURRENT GAIN LAYOUT
- Publication number 20240413195
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Takashi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR REDUCING RANDOM DOPAN...
- Publication number 20240413004
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu Jie JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240413202
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Heng TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ESD PROTECTION STRUCTURE AND METHOD OF MA...
- Publication number 20240405015
- Publication date Dec 5, 2024
- HeFeChip Corporation Limited
- Geeng-Chuan Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404870
- Publication date Dec 5, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsung-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT N/P LOCAL INTERCONNECT
- Publication number 20240404872
- Publication date Dec 5, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRESSORS IN EPITAXY SOURCE/DRAIN REGIONS
- Publication number 20240404885
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404918
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Joong Suk OH
- H01 - BASIC ELECTRIC ELEMENTS

using trench refilling with dielectric materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor devices with multiple silicid...

FinFET device and method of forming same

Trench isolation process

Semiconductor device including gate separation region

Semiconductor structure cutting process and structures formed thereby

Semiconductor device and method

Hybrid channel semiconductor device and method

Semiconductor device and manufacturing method thereof

Flowable chemical vapor deposition of metal oxides

Manufacturing method of fin-type field effect transistor structure

Semiconductor structure

Seal ring for semiconductor device

Method for forming a semiconductor structure

FinFET semiconductor device

Semiconductor device with wrap around silicide and hybrid fin

Seam free isolation structures and method for making the same

Defect free germanium oxide gap fill

Gate line plug structures for advanced integrated circuit structure...

Integrated circuit comprising trenches formed in a substrate

Dielectric gap-filling process for semiconductor device

Dual channel gate all around transistor device and fabrication meth...

Plugs for interconnect lines for advanced integrated circuit struct...

Etch method for opening a source line in flash memory

Semiconductor device and manufacturing method thereof

Semiconductor structures and method for manufacturing the same

Thicker corner of a gate dielectric structure around a recessed gat...

Stacked field-effect transistors

Method for forming semiconductor device structure with metal-semico...

Semiconductor devices including an isolation insulating pattern on...

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND T...

THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD...

DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...

ISOLATION MODULE FOR BACKSIDE POWER DELIVERY

SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING AN ELECTRONIC COMPONENT...

ISOLATION STRUCTURE HAVING DIFFERENT LINERS ON UPPER AND LOWER PORT...

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

SELECTIVE DOUBLE DIFFUSION BREAK STRUCTURES FOR MULTI-STACK SEMICON...

ISOLATION BETWEEN DEVICE AREAS

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING A SEMICONDUC...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR BACKSIDE ISOLATION FEATURE FOR MERGED EPITAXY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES WITH A CURRENT GAIN LAYOUT

SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR REDUCING RANDOM DOPAN...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE WITH ESD PROTECTION STRUCTURE AND METHOD OF MA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIRECT N/P LOCAL INTERCONNECT

EMBEDDED STRESSORS IN EPITAXY SOURCE/DRAIN REGIONS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME