using trench refilling with dielectric materials

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CPC
H01L21/76224

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76224using trench refilling with dielectric materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming air spacers in semiconductor devices
- Patent number 12,243,940
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device having a gate with a tapering bottom portion and a ga...
- Patent number 12,243,748
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having buried word lines and method of manu...
- Patent number 12,245,416
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Min-Chung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure using nitrogen-...
- Patent number 12,243,769
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fin end spacer dummy gate and method of m...
- Patent number 12,243,930
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,329
- Issue date Feb 25, 2025
- United Microelectronics Corp.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having STI region
- Patent number 12,238,924
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for increasing germanium concentration of surfaces of a sil...
- Patent number 12,237,404
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including device isolation layer with multiple...
- Patent number 12,237,208
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing memory device having active area in elongat...
- Patent number 12,237,209
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods for forming the same
- Patent number 12,237,367
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Junchao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation structures having uniform step heights
- Patent number 12,237,229
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with recessed top semiconductor layer in su...
- Patent number 12,230,720
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a MEMS switch having an embedded metal con...
- Patent number 12,230,457
- Issue date Feb 18, 2025
- Robert Bosch GmbH
- Jochen Reinmuth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filler capacitor cell device and corresponding manufactu...
- Patent number 12,230,565
- Issue date Feb 18, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load switch including back-to-back connected transistors
- Patent number 12,224,740
- Issue date Feb 11, 2025
- Nuvolta Technoloiges (Heifei) Co., Ltd.
- Jinbiao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 12,217,999
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gate separation region
- Patent number 12,218,131
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,218,221
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable chemical vapor deposition of metal oxides
- Patent number 12,211,736
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Hurshvardhan Srivastava
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,213,309
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Gongyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of fin-type field effect transistor structure
- Patent number 12,211,843
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,211,844
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250081530
- Publication date Mar 6, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Junjie LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A NON-VOLATILE MEMORY INCLUDING A DEPLETION LAYER...
- Publication number 20250081566
- Publication date Mar 6, 2025
- ATOMERA INCORPORATED
- HIDEKI TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20250081584
- Publication date Mar 6, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
- Publication number 20250079162
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A NON-VOLATILE MEMORY INCLUDING A DEPLETION LAYER...
- Publication number 20250079164
- Publication date Mar 6, 2025
- ATOMERA INCORPORATED
- HIDEKI TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ISOLATION STRUCTURE AND CONTACT ETCH STOP...
- Publication number 20250079316
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ALL AROUND 4F2 DRAM
- Publication number 20250081432
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Zhijun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...
- Publication number 20250081453
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yuya SANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250069893
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECREASED SOURCE AND DRAIN RESISTANCE AND...
- Publication number 20250072061
- Publication date Feb 27, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Zijin YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250071997
- Publication date Feb 27, 2025
- CXMT CORPORATION
- Sijia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMI...
- Publication number 20250062284
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow Trench Isolation using Porous Semiconductor
- Publication number 20250062157
- Publication date Feb 20, 2025
- MURATA MANUFACTURING CO., LTD.
- Kouassi Sebastien Kouassi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION
- Publication number 20250056865
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE/NANOSHEET DEVICE WITH CRYSTAL SPACER AND METHOD OF MANUFAC...
- Publication number 20250056850
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND T...
- Publication number 20250048710
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lo-Heng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250046679
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...
- Publication number 20250046714
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING AN ELECTRONIC COMPONENT...
- Publication number 20250040210
- Publication date Jan 30, 2025
- STMicroelectronics International N.V.
- Riccardo DEPETRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION MODULE FOR BACKSIDE POWER DELIVERY
- Publication number 20250040170
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20250026962
- Publication date Jan 23, 2025
- SOULBRAIN CO., LTD
- Jae-Wan PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ISOLATION STRUCTURE HAVING DIFFERENT LINERS ON UPPER AND LOWER PORT...
- Publication number 20250029869
- Publication date Jan 23, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jianwei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DOUBLE DIFFUSION BREAK STRUCTURES FOR MULTI-STACK SEMICON...
- Publication number 20250031360
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN DEVICE AREAS
- Publication number 20250022746
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS

using trench refilling with dielectric materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming air spacers in semiconductor devices

FinFET device having a gate with a tapering bottom portion and a ga...

Semiconductor structure having buried word lines and method of manu...

Method for preparing semiconductor device structure using nitrogen-...

Semiconductor device with fin end spacer dummy gate and method of m...

Semiconductor device and method for fabricating the same

Semiconductor device having STI region

Methods for increasing germanium concentration of surfaces of a sil...

Semiconductor device including device isolation layer with multiple...

Method of manufacturing memory device having active area in elongat...

Semiconductor structures and methods for forming the same

Shallow trench isolation structures having uniform step heights

Semiconductor structure with recessed top semiconductor layer in su...

Method for manufacturing a MEMS switch having an embedded metal con...

Shield structure for backside through substrate vias (TSVs)

Integrated filler capacitor cell device and corresponding manufactu...

Semiconductor circuit structure with direct die heat removal structure

Dual metal silicide structures for advanced integrated circuit stru...

Load switch including back-to-back connected transistors

Method of manufacturing semiconductor devices with multiple silicid...

FinFET device and method of forming same

Trench isolation process

Semiconductor device including gate separation region

Semiconductor structure cutting process and structures formed thereby

Semiconductor device and method

Hybrid channel semiconductor device and method

Flowable chemical vapor deposition of metal oxides

Semiconductor device and manufacturing method thereof

Manufacturing method of fin-type field effect transistor structure

Semiconductor structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MAKING A NON-VOLATILE MEMORY INCLUDING A DEPLETION LAYER...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL

METHOD FOR MAKING A NON-VOLATILE MEMORY INCLUDING A DEPLETION LAYER...

SEMICONDUCTOR DEVICE AND ISOLATION STRUCTURE AND CONTACT ETCH STOP...

GATE ALL AROUND 4F2 DRAM

THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE WITH DECREASED SOURCE AND DRAIN RESISTANCE AND...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMI...

Shallow Trench Isolation using Porous Semiconductor

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION

CONTROLLING FIN-THINNING THROUGH FEEDBACK

NANOWIRE/NANOSHEET DEVICE WITH CRYSTAL SPACER AND METHOD OF MANUFAC...

METHOD FOR REDUCING WAFER EDGE DEFECTS

SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND T...

THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD...

DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...

SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING AN ELECTRONIC COMPONENT...

ISOLATION MODULE FOR BACKSIDE POWER DELIVERY

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

ISOLATION STRUCTURE HAVING DIFFERENT LINERS ON UPPER AND LOWER PORT...

SELECTIVE DOUBLE DIFFUSION BREAK STRUCTURES FOR MULTI-STACK SEMICON...

ISOLATION BETWEEN DEVICE AREAS

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...