This application is the continuing application of the pending Taiwan patent application, Serial No. 091206737, filed May 13, 2002, all of which is hereby incorporated by reference.
The present invention relates generally to a CPU heat dissipating apparatus, more particularly, to a heat dissipating base that has at least one guide slot that is not penetrating inside said base, and an outlet of said guide slot is coupled to a external heat conduction pipe so as to reduce the thermal resistance of the heat dissipating base.
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Therefore, it needs a heat dissipating base and a method for reducing the thermal resistance of the heat dissipating base, wherein the heat dissipating base has at least one guide slot that is not penetrating inside said base, and an outlet of said guide slot is coupled to a external heat conduction pipe so as to reduce the thermal resistance of the heat dissipating base and save the assembly time.
To solve the above problems, it is an object of the present invention to provide a method for reducing the thermal resistance of the heat dissipating base to reduce the thermal resistance of the heat dissipating base and save the assembly time.
To accomplish the above object of the present invention, the method for measuring the temperature of a computer system comprising the following steps: providing a base, having at least one guide slot that is not penetrating inside said base; coupling at least one heat conduction pipe to an outlet of said guide slot; sintering some copper powder on a inner wall of said guide slot and said heat conduction pipe respectively for conducting heat; injecting some liquid into said heat conduction pipe for heat exchanging; extracting the air of said guide slot and said heat conduction pipe to make them to become a vacuum; and sealing another outlet of said heat conduction pipe.
To solve the above problems, it is another object of the present invention to provide a heat dissipating base that has at least one guide slot that is not penetrating inside said base, and an outlet of said guide slot is coupled to a external heat conduction pipe so as to reduce the thermal resistance of the heat dissipating base and save the assembly time.
To accomplish the above object of the present invention, the heat dissipating base comprises: a base, having at least one guide slot that is not penetrating inside said base, and some copper powder sintered on a inner wall of said guide slot for conducting heat; at least one heat conduction pipe, one end of said heat conduction pipe coupled to an outlet of said guide slot, and also some copper powder sintered on a inner wall of said heat conduction pipe for conducting heat, the other end of said heat conduction pipe having a seal; and some liquid, positioned inside said guide slot and said heat conduction pipe, thereby, the heat dissipating base can execute heat dissipating by the heat exchanging of said liquid and said copper powder.
The novel features of the invention are set forth with particularity in the appended claims. The invention will be best understood from the following description when read in conjunction with the accompanying drawings.
Referring to
Wherein, using the molding method to make the base 10 is preferred. The base 10 made by the molding method in addition to save the assembly time, also overcomes the drawback that thermal resistance is increasing due to fill some Tin paste between the guide slot 11 and heat conduction pipe 20. Besides, at least one guide slot 11 that is not penetrating inside said base 10 for purpose to reduce a seal of the guide slot 11, and some copper powder 12 (please refer to
The at least one heat conduction pipe 20, one end is coupled to the outlet of the guide slot 11 and some copper powder 12 is sintered on the inner wall of the heat conduction pipe 20 for conducting heat; another end of the heat conduction pipe 20 has a seal 22 and the number of the seal 22 equals to the number of the guide slot 11. The liquid 30 is positioned inside the guide slot 11 and heat conduction pipe 20 to exhaust out the heat by the liquid 30 flowing inside the guide slot 11 and the heat conduction pipe 20 and completes the heat exchanging by the copper powder 12. Furthermore, some fins 14 can be installed on the top 13 of the base 10 to improve the heat dissipating efficiency.
Referring to
The working situation of the present invention is: due to the inner wall of the guide slot 11 and heat conduction pipe 20 having copper powder 12 sintered and some liquid 30, while heat generated by the CPU is conducted to the guide slot 11 by the fin 14, using the theorem that the water will be evaporated and become vapor when the water meets heat, and the heat vapor will rise to the upper place of the guide slot 11 and heat conduction pipe 20, thus, the hot air will be conducted to the seal 22. Further, an external heat sink (not shown) can be coupled to the seal 22 for conducting the heat, and then using a fan (not shown) pumps the hot air outwardly, thus, the hot air and the cool air executes the heat exchange at the heat sink. Due to the inner wall of the guide slot 11 and heat conduction pipe 20 having copper powder 12 sintered, so the air exchanging speed can be improved, thus, the vapor in the heat conduction pipe 20 can quickly be condensed into water and flow back to lower place of the guide slot 11 and executed heat exchanging with the heat generated by the CPU again. Therefore, the heat generated by the CPU can be exhausted out of the housing (not shown) of the computer system.
Wherein, the number of the guide slot 11 and heat conduction pipe 20 is determined according to the heat generated by the CPU. Generally speaking, every guide slot 11 and heat conduction pipe 20 of the present invention can absorb about 40 W heat. Considering the heat conduction pipe 20 will be slightly bent so as to lockup the heat conduction pipe 20 to the outlet of the guide slot 11 and fasten it on the housing while the heat dissipating base is assembled, therefore, the efficiency of the heat conduction pipe 20 will be slightly reduced to about 30 W.
Furthermore, the present invention also provides a method for reducing the thermal resistance of a heat dissipating base, which comprising the following steps:
Wherein, the base 10 of the step 1 is made by the molding method preferably. The base 10 made by the molding method in addition to save the assembly time, also overcomes the drawback that thermal resistance is increases due to fill some Tin paste between the guide slot 11 and heat conduction pipe 20. Besides, at least one guide slot 11 that is not penetrating inside said base 10 for purpose to reduce a seal of the guide slot 11 so as to reduce the thermal resistance of the base 10. Furthermore, the shape of the base 10 can be square, rectangle, diamond, circular, oval, or other shapes, wherein the square shape (as shown in
The guide slot 11 of the step 2 has some copper powder 12 sintered on the inner wall of the guide slot 11 for conducting heat so that the liquid for example but not limited to water passing the inner wall of said guide slot 11 can form a capillarity effect for conducting heat. Wherein, the base 10 is preferably made of metal material for example but not limited to copper to increase the heat dissipating efficiency and the shape of the guide slot 11 preferably is circular shape.
The liquid 30 of step 3 injected inside the guide slot 11 and heat conduction pipe 20 is for example but not limited to water, so that the liquid 30 passing the inner wall of said guide slot 11 can form a capillarity effect for conducting heat.
The differences between the heat dissipating base of the present invention and the heat dissipating base of prior art is: the heat dissipating base of the present invention has a molded base, thus, in addition to saving the assembly time, also the thermal resistance increased due to fill some Tin paste between the guide slot 11 and heat conduction pipe 20 of the prior art can be reduced. Besides, at least one guide slot 11 that is not penetrating inside said base 10 for purpose to reduce a seal of the guide slot 11 to reduce the thermal of the base 10, thereby, reducing the thermal resistance of the base 10 to improve the heat dissipating efficiency.
While the invention has been described with reference to a preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.
Number | Date | Country | Kind |
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092132435 | Nov 2003 | TW | national |