Claims
- 1. A method for tracking a state of a micro machined element, the micro machined element having at least one magnetic sensor, the method comprising:
a) exposing the magnetic sensor to a magnetic field; b) measuring a value of a property of the at least one magnetic sensor as a state of the micro machined element changes; and c) comparing the measured value of the magnetic sensor property with a predetermined value of the sensor property when the micro machined element is in a known state.
- 2. The method of claim 1 wherein the magnetic sensor senses a magnetic field that is used to actuate the micro machined element.
- 3. The method of claim 1, wherein step c) includes comparing a measured value of the sensor property to a range of values.
- 4. The method of claim 1 further comprising:
compensating for a change in the property of the at least one magnetic sensor with temperature.
- 5. The method of claim 4 wherein the compensating step includes determining a relationship between the property of the magnetic sensor and temperature.
- 6. The method of claim 5 further comprising measuring the temperature of the micro machined element.
- 7. The method of claim 5 wherein the compensating step includes correcting the measured value of the property of the magnetic sensor using the relationship between the property and the measured temperature of the micro machined element.
- 8. The method of claim 5 wherein the relationship between the magnetic sensor property and temperature is stored in a look-up table.
- 9. The method of claim 1, wherein the magnetic field of step a) may also actuate the micro machined element.
- 10. The method of claim 9, wherein the magnetic filed of step a) is applied to test the state of the micro machined element.
- 11. The method of claim 9, wherein the magnetic filed of step a) is applied while the micro machined element switches between a first state and a second state.
- 12. The method of claim 11 wherein step b occurs while the magnetic file of step a) remains on after the micro machined element has switched between the first state and the second state.
- 13. A method for tracking a state of a micro machined element, the micro machined element having at least one magnetic sensor, the method comprising:
a) exposing the magnetic sensor to a magnetic field; b) measuring a property of the magnetic sensor while the micro machined element is in a first state, to provide one or more predetermined values of the property for the first state; c) storing the predetermined value for the first state; d) measuring the property of the magnetic sensor while the micro machined element is in a second state, to provide one or more predetermined values of the property for the second state; e) storing the predetermined value for the second state; f) measuring the property of the magnetic sensor; and g) comparing the value of the property measured in step f to the predetermined values for the first and second states to determine the state of the micro machined element.
- 14. The method of claim 13, further comprising:
comparing the value measured in step f) to a range of values.
- 15. The method of claim 13 further comprising:
compensating for a change in the property of the at least one magnetic sensor with temperature.
- 16. The method of claim 15 wherein the compensating step includes determining a relationship between the property of the magnetic sensor and temperature.
- 17. The method of claim 16 wherein step f) includes measuring the temperature.
- 18. The method of claim 17 wherein the compensating step includes correcting the measured value of the property of the magnetic sensor using the relationship between the property and the measured temperature.
- 19. The method of claim 16 wherein the relationship between the magnetic senspr property and temperature is stored in a look-up table.
- 20. The method of claim 13, wherein the magnetic field of step a) may also actuate the micromachined element.
- 21. The method of claim 20 wherein the magnetic field of step a) is applied to test the state of the micro machined element.
- 22. The method of claim 20 wherein the magnetic field of step a) is applied while the micro machined element switches between the first and second states.
- 23. The method of claim 22 wherein step f) occurs while the magnetic field of step a) remains on after the micro machined element has switched between the first and second states.
- 24. The method of claim 13 wherein the micro machined element is a micro machined optical element.
- 25. The method of claim 24 wherein the micro machined optical element is comprised of a fixed and movable portion.
- 26. A method for tracking a state of each of a plurality of micro machined elements, each micro machined element in the plurality having at least one sensor, the method comprising:
a) measuring a combined value of a property of the sensors in the plurality; and b) comparing the combined value measured in b) with one or more predetermined combined values to determine the state of each element in the plurality, wherein each of the one or more predetermined combined values corresponds to a known combination of states for the micro machined elements in the plurality.
- 27. The method of claim 26 wherein each of the sensors produces a unique value when it is in a given state.
- 28. The method of claim 27 wherein the unique value is a prime value.
- 29. The method of claim 26 wherein the plurality of micro machined elements is a row of micro machined elements in an array.
- 30. The method of claim 30 wherein the plurality of micro machined elements is a column of micro machined elements in an array.
- 31. The method of claim 26 wherein the sensors are magnetic sensors.
- 32. The method of claim 31 further comprising exposing the magnetic sensors to a magnetic field.
CROSS REFERENCE TO RELATED APPLICAITON
[0001] This application is a division of and claims priority from U.S. patent application Ser. No.______ , by Murali Chaparala entitled “MAGNETIC POSITION DETECTION FOR MICRO MACHINED OPTICAL ELEMENTS,” Agent's Docket No. ONX- 117A, filed May 8, 2001, and which is incorporated herein by reference.