The invention relates to protection devices used with dicing blades which cut semiconductor packages and devices from ball grid array substrates or similar configurations.
One processing step in the fabrication of semiconductor products is the dicing of a substrate upon which a plurality of semiconductor devices is fabricated. Generally, circular saws are used for this dicing process. Known configurations of circular saws used in the semiconductor industry include a plurality of circular blades ganged onto a blade assembly, which dice along a plurality of parallel lines simultaneously and at predetermined spacings.
A problem encountered with the known dicing process is that cut material, or detritus, sprays in many directions. The spray of the detritus exposes workers to safety hazards, and creates a messy work environment. To overcome these problems, covers have been installed over the ganged blade assemblies. With specific reference to
In some instances an additional deflector may also be used, as shown in
Nonetheless, the gang blade assemblies 10, 110 have a disadvantage. The speed of rotation of the blade device 20 creates an air flow which lifts portions of the detritus within the cover 12 where it can contact with the blades 22. Further, the detritus often is deposited in front of the blades, and this loose debris can also contact the blades 22. Such contact may inflict damage on the blades 22, forcing premature replacement or repair of the gang blade assembly 10, 110 or of the blade device 20.
There is therefore a need for a protective assembly which mitigates collection and build up of detritus within the cover 12.
The invention provides a blade assembly that includes a blade device and a cover partially encasing said blade device. The blade device includes a hub and at least one blade on the hub. In addition, a brush is mounted on the cover and extends toward the hub.
One aspect of the invention provides a blade assembly, comprising a blade device that has a hub and at least one blade on the hub, a cover partially encasing the blade device, and first and second brushes mounted on said cover and extending toward said hub.
The invention further provides a cover assembly for use with a gang blade assembly. The cover assembly includes a cover having a leading side and a top side, at least one bracket mounted on the cover, and at least one brush mounted on the at least one bracket. The at least one brush includes bristles bristles which extend under the top side toward the leading side.
The invention additionally provides a method of controlling the trajectory of detritus during a substrate dicing operation. The method includes the steps of placing a protective cover at least partially around the periphery of a blade assembly that includes a hub and at least one blade, rotating the hub and the at least one blade, dicing a ball grid array substrate with the rotating blade, the dicing producing detritus, and disrupting an air flow caused by the rotating.
These and other advantages and features of the invention will be more readily understood from the following detailed description of the invention which is provided in connection with the accompanying drawings.
a is a side view of a known gang blade assembly:
b is a top view of the gang blade assembly of
a is a side view of another known gang blade assembly.
b is a top view of the gang blade assembly of
a is a side view of a gang blade assembly constructed in accordance with a first embodiment of the invention.
b is a top view of the gang blade assembly of
a is a side view of a gang blade assembly constructed in accordance with a second embodiment of the invention.
b is a top view of the gang blade assembly of
Referring now to
The cover 212 differs from the cover 12 in that it lacks a trailing side. Instead, the cover 212 includes only a top side 213 and a flange or leading side 215. At a location at which the trailing side would be located, a bracket 218 is mounted on the cover 212. The bracket 218 serves a dual purpose. The bracket 218 holds a deflector 216 and also holds a brush 219. The brush 219 is held so as to be tangential to the hub 24, thereby allowing bristles 221 to come into contact with the hub 24. The deflector 216 extends upwardly away from the hub 24 and arches outwardly away from the bristles 221.
An environment in which the gang blade assembly 210 may be used is in the semiconductor fabrication industry as a ball grid array substrate dicing apparatus, having substrate dicing blades 22, for dicing a substrate 50 (
Another important function of the brush 219 is that it disrupts the air flow produced by the rotation of the hub 24. As noted above regarding known gang blade assemblies, such as, for example, those illustrated in
a-5b illustrate a gang blade assembly 310, which differs from the gang blade assembly 212 in that the deflector 216 is mounted on the bracket 218 in a different way. Unlike the gang blade assembly 210, the deflector 216 of the gang blade assembly 310 extends downwardly from the cover 212 toward the hub 24 and arches outwardly away from the bristles 221.
Another embodiment is illustrated in FIG. 8. In this embodiment a gang blade assembly 610 differs from the gang blade assembly 410 (
Illustrated in
While the invention has been described in detail in connection with exemplary embodiments known at the time, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. For example, although some of the illustrated gang blade assemblies (
This is a divisional application of U.S. patent application Ser. No. 09/984,434, filed Oct. 30, 2001, which is hereby incorporated in its entirety by reference.
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Number | Date | Country |
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242708 | Jan 1912 | DE |
Number | Date | Country | |
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20040011171 A1 | Jan 2004 | US |
Number | Date | Country | |
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Parent | 09984434 | Oct 2001 | US |
Child | 10437252 | US |