Chris Lawing, Camelot Systems, Inc., Vacuum Dispensing Of Encapsulants For uBGA Manufacturing, Electronic Packaging & Production, Feb. 1998 (pp. 87-91). |
Mark J. Norris, The Dispensing Process In Advanced Electronic Component Manufacturing Of Ball Grid Arrays, Flip Chip & Chip Scale Packages, Pan Pacific Microelectronics Symposium, Feb. 10-13, 1998 (pp. 179-185). |
New CSP Dispensing Systems Offer Fast, Void-Free Encapsulation and Craig Mitchell, Tessera, Inc., Recent Advances In CSP Encapsulation, Chip Scale Review, Mar. 1998. |
Chris Lawing, Camelot Systems Inc., Preventing Voids In uBGA® Packages, Chip Scale Review, Mar. 1998 (pp. 48-51). |
Ron Iscoff, Pushing The Envelope For the Next Generation of CSPs, Chip Scale Review, Mar. 1998 (pp. 25-29). |
Verfahrenstechnik Hübers GmbH, Vacuum Casting Resin Plants, Verfahrenstechnik Hübers GmbH Sales Brochure, date unknown (6 pages). |
Wilhelm Hedrich Vacuumanlagen GmbH & Co. KG, Vacuum Technology—Worldwide—For Tomorrow's Innovation, Wilhelm Hedrich Vacuumanlagen Sales Brochure, date unknown (6 pages). |
Wilhelm Hedrich Vacuumanlagen GmbH & Co. KG, Hedrich “On-The-Fly” Degassi, Wilhwelm Hedrich Vacuumanlagen Sales Brochure, date unknown (2 pages). |
Wilhelm Hedrich Vacuumanlagen GmbH & Co. KG, Vacuum Shot Dosing Equipment, Wilhelm Hedrich Vacuumanlagen Sales Brochure, date unknown (pp. 1-40). |