The invention relates to a method of treating or coating surfaces using a plasma jet. The invention further relates to an apparatus that is suitable for carrying out the method.
In the prior art, a plasma jet denotes a plasma flow having a jet or beam shape and that is projected by a plasma generator onto a surface of a substrate or workpiece situated at a given spacing from the apparatus. In principle, the actual jet-shaped plasma may be generated in two ways: by a dielectrically impeded discharge or by an arc discharge.
A plasma-jet generator that operates by dielectrically impeded discharge, also referred to as atmospheric pressure glow discharge, is known from WO 2005/125286. In this apparatus, two electrodes are separated by an insulated tube acting as a dielectric barrier. In addition, a carrier gas is passed through the apparatus. In this manner a plasma jet is generated when alternating voltage is applied between the electrodes at the free end of the apparatus.
A plasma-jet generator that operates by direct arc discharge is known from EP 0,761,415 [U.S. Pat. No. 5,837,958]. In this apparatus a direct electric arc forms between two spaced electrodes, and a carrier gas is also passed through the apparatus.
For treating or coating surfaces, in all the known apparatuses an attempt is made to mix the generated plasma beam and an additional process gas, used for the treatment or coating, immediately before or just after the plasma jet emerges from the plasma head in order to avoid or at least reduce deposits on the adjacent walls or on the outlet nozzle of the apparatus itself. There are always the disadvantages of the parallel flow direction of the process gas and the plasma beam and the resulting poor activation. In addition, as a result of the plasma beam emerging from the nozzle head the surrounding air is radicalized, leading to termination processes in the process gas that is actually activated.
In the apparatus described in above-referenced WO 2005/125286, which operates by dielectrically impeded discharge, in addition to the plasma-forming carrier gas a process gas is fed in via a tube inside the inner electrode. Only after exiting the outlet nozzle of the apparatus does admixture of plasma and process gas occur, in the space between the substrate and the plasma head. A disadvantage is the previously mentioned insufficient activation of the process gas, since, as described, the plasma jet and the process gas flow essentially in parallel onto the substrate, resulting in inadequate activation of the process gas.
WO 1999/020809 describes a further plasma-jet generator, in this case the process gas being supplied immediately upstream of the outlet nozzle. In this manner the chemical reactions in the region of the electrodes are avoided. In this apparatus, a minimum contact volume is provided between the plasma jet and process gas in order to avoid deposits of the already activated process gas in the plasma head of the apparatus.
A further disadvantage of the known apparatuses is that the plasma jet, which reacts only partially with the process gas, impinges largely unhindered on the surface to be treated or coated. The secondary irradiation of the plasma in the UV range and the direct physical contact of the plasma with the surface results in undesired chemical and physical processes at that location. This may cause splitting of polymers and undesired incorporation of oxygen into the surface.
The object of the present invention is to provide a method of treating or coating a surface in which a plasma beam in the form of a plasma jet and at least one process gas are thoroughly mixed and the maximum possible energy transfer of plasma to the process gas can occur, so that an optimally activated mixture of carrier gas and process gas impinges on the corresponding surface. The aim is to prevent direct contact between the plasma jet and the surface. A further object of the invention is to provide the simplest possible apparatus that is suitable for carrying out such a method according to the invention.
The object is achieved by use of a method having the features of claim 1, and an apparatus having the features of equivalent claim 4. The subclaims concern particularly advantageous refinements of the invention with regard to the method or apparatus.
The invention is based on the general inventive concept of mixing a generated plasma flow in the form of a plasma jet and at least one process gas in a separate space from which ambient air is excluded. To this end, the process gas is introduced into a reaction chamber downstream from the exit nozzle of a known plasma jet, and the most complete mixture possible of the plasma jet and the process gas is achieved in this reaction chamber by suitable jet guidance and corresponding flow geometry. Only after this occurs is the process gas activated in this manner brought into contact, via an exit nozzle, with the surface of the workpiece in order to condition this surface or cut layers on same.
According to one particularly advantageous embodiment of the invention, the flow directions of the plasma jet on the one hand and of the process gas on the other hand are perpendicular or essentially perpendicular upon entering the reaction chamber. This results in particularly intensive mixing of the two media.
According to a further advantageous embodiment of the invention, the plasma jet is passed into the reaction chamber essentially parallel to the surface of the workpiece to be treated or coated, and the process gas is fed in essentially perpendicular to the surface. In this embodiment both components are optimally mixed without the plasma jet itself being able to pass through the reaction chamber. This allows the reaction chamber to be small.
According to a further advantageous embodiment of the invention, the reaction chamber is also provided with a cooling/heating system to enable control of the chemical and physical processes occurring during mixture of the plasma jet and process gas. It is possible, for example, to pass a liquid heat-exchange medium through passage in the outside walls of the reaction chamber. Temperature control may also be carried out using an electric heating system.
Finally, according to a further advantageous refinement of the invention it is also possible to provide a plurality of plasma jets in the reaction chamber in such a way that a plurality of plasma jets may be mixed with the process gas.
It is also possible to supply different process gases in succession, and to this end to provide a plurality of reaction chambers or a combined two- or multistage reaction chamber.
All of the embodiments of the invention have a number of advantages over the prior art:
The invention is explained in greater detail below with reference to the drawings by way of example wherein:
specific description First, the method schematically illustrated in
As a whole, as described, the supplied carrier gas is activated or a particle beam is generated in this reaction region.
It is also possible to repeat the last two method steps described, i.e. to provide a plurality of consecutive activation zones to which either the same carrier gas or different carrier gases may be supplied. Such a method having a plurality of activation zones is especially suited for achieving a particularly intensive activation of the carrier gas or to produce a mixture containing a plurality of activated gases.
In the discussion below, the carrier gas activated according to the above-described method steps or the particle beam is brought into contact with the workpiece surface to be treated, and the surface is treated or coated in this manner.
One characteristic of the described method according to the invention is that in the separate reaction region or regions the plasma beam transfers the majority of the plasma energy to the gas and/or particle stream, and, of particular importance, there is little or no direct contact of the plasma jet with the surface.
In the method according to the invention, it is also typical that, as a result of excluding ambient from the reaction zone, the previously mentioned undesired side reactions between ambient air, plasma, and process gas are avoided.
It is particularly advantageous when the inlet port 9 and outlet port 13 are situated at opposite ends of the reaction chamber 8, so that turbulence and/or deflection of the plasma jet 7 from a straight line occur as a result of an inlet port 10 provided on the side for the carrier gas 11 to be blown in.
In one advantageous refinement of the invention, the reaction chamber 8 or the reaction chambers 8 and 17 may be heated or cooled by electricity or a liquid system. Condensation of the activated medium may be prevented by heating the respective reaction chamber. In this manner it is also possible by liquid temperature-control system for the liquid medium that is fed into the particular reaction chamber to be evaporated at that location instead of the carrier gas.
By correspondingly forming the outlet port in the apparatus facing the workpiece surface to be treated or coated in as a nozzle it is possible to produce a straight jet of the activated medium on the workpiece surface; likewise, it is possible within the scope of the invention to produce a fan-shaped or tapered jet, for example, by a suitable nozzle design.
It is also possible to adjust or close all or individual inlet and/or outlet ports in the apparatus via a nozzle system, an adjustable diaphragm, or other control possibilities known as such. In this manner the residence time of the plasma, gas, and/or particle streams in the respective reaction chamber may be set and changed by a simple adjustment of the cross section of the respective inlet and/or outlet port.
The apparatus according to the invention may particularly advantageously be composed of two separate modules. The Plasmabrush® apparatus manufactured and marketed by the present applicant, in which the plasma jet is generated by a dielectrically impeded discharge, may be advantageously used as the first module for generating a plasma jet. A second module may include one or more reaction chambers having the respective inlet and outlet ports. It is particularly advantageous to adapt an inlet port 9 in such a way that it has a modular design that directly corresponds to the plasma head 5 of the Plasmabrush® apparatus, thus allowing the plasma head 5 to be directly and sealingly mounted on the inlet port 9.
Number | Date | Country | Kind |
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10 2007 043 291.9 | Sep 2007 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2008/005821 | 7/17/2008 | WO | 00 | 11/12/2009 |