Claims
- 1. A method of burnishing a malleable film on a semiconductor substrate to provide a smooth, defect-free surface comprising:
- imparting scratches of a desired depth and spacing into a first major surface of a smooth glass plate;
- contacting the first major surface of the glass plate to the malleable film and establishing relative motion therebetween;
- continuing said motion under a desired pressure until a defect-free film surface is provided.
- 2. The method of claim 1 wherein the malleable film is a bonding pad of gold or an alloy thereof.
- 3. The method of claim 1 wherein a reflective coating is applied to a second major surface of the glass slide opposite the scratches to allow visual observation of the burnishing process.
- 4. The method of claim 1 wherein the scratches are between about 75 and 250 micrometers apart.
- 5. The method of claim 1 wherein the scratches are at least 250 Angstroms in depth but not more than 1000 Angstroms in depth.
- 6. The method of claim 1 wherein between about 55 and 310 kg/cm.sup.2 of pressure is applied to the substrate and bonding pad during burnishing.
- 7. The method of claim 1 wherein the motion is continued to extend the malleable films toward an edge of the substrate.
Government Interests
The Government has rights in this invention pursurant to a government contract.
US Referenced Citations (6)