Smoothing; Planarisation

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CPC
H01L21/7684

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7684Smoothing; Planarisation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including interconnect structures including dielectric...
- Patent number 12,368,101
- Issue date Jul 22, 2025
- Battelle Energy Alliance, LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact for ion through-substrate via
- Patent number 12,364,048
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate oxide formation for fin field-effect transistor
- Patent number 12,363,934
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Bingwu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier free interface between BEOL interconnects
- Patent number 12,362,235
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a uniform and thin silicide layer on an...
- Patent number 12,362,187
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method for preparing semiconductor device using t...
- Patent number 12,362,232
- Issue date Jul 15, 2025
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-doped trenches for memory
- Patent number 12,354,912
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,354,910
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with different metal materials
- Patent number 12,354,957
- Issue date Jul 8, 2025
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 12,354,907
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of formation
- Patent number 12,354,958
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor deposition of films comprising molybdenum
- Patent number 12,354,877
- Issue date Jul 8, 2025
- ASM IP Holding B.V.
- Bhushan Zope
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 12,347,725
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,347,728
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 12,347,729
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium-containing diffusion barrier for CMP removal rate enhancem...
- Patent number 12,342,600
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING INTERCONNECT STRUCTURES
- Publication number 20250233015
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20250233068
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...
- Publication number 20250233069
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-Min Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...
- Publication number 20250226307
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF CAPPING LAYER
- Publication number 20250218867
- Publication date Jul 3, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20250218792
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA REVEAL PROCESSING AND STRUCTURES
- Publication number 20250218903
- Publication date Jul 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ALIGNED WITH ADJACENT INTERCONNECT LAYERS
- Publication number 20250218942
- Publication date Jul 3, 2025
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...
- Publication number 20250218949
- Publication date Jul 3, 2025
- Intel Corporation
- Sriharsha Karumuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250218950
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Manufacture
- Publication number 20250218877
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT SPACER STRUCTURE
- Publication number 20250210510
- Publication date Jun 26, 2025
- Intel Corporation
- Rohan BAMBERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS
- Publication number 20250201697
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH A NITRIDED CAPPING LAYER
- Publication number 20250201630
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201709
- Publication date Jun 19, 2025
- Fujian Jinhua Integrated Circuit Co, Ltd.
- Xiaoqin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250201627
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES
- Publication number 20250191972
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20250191973
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192038
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE INTERCONNECT STRUCTURE
- Publication number 20250192028
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS

Smoothing; Planarisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Methods of forming semiconductor device

Apparatuses including interconnect structures including dielectric...

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor device and method of manufacturing the same

Conductive contact for ion through-substrate via

Semiconductor device structures

MIM structure

Conductive structures and methods of fabrication thereof

Gate oxide formation for fin field-effect transistor

Self-forming embedded diffusion barriers

Contact structure for semiconductor device

Barrier free interface between BEOL interconnects

Semiconductor device having a uniform and thin silicide layer on an...

Polishing pad and method for preparing semiconductor device using t...

Methods of performing chemical-mechanical polishing process in semi...

Plasma-doped trenches for memory

Cobalt based interconnects and methods of fabrication thereof

Bi-layer alloy liner for interconnect metallization and methods of...

Interconnect structures with different metal materials

Electron migration control in interconnect structures

Semiconductor devices and methods of formation

Vapor deposition of films comprising molybdenum

Treatment of spin on organic material to improve wet resistance

Semiconductor structure with material modification and low resistan...

Bi-layer alloy liner for interconnect metallization and methods of...

Metal gates of transistors having reduced resistivity

Titanium-containing diffusion barrier for CMP removal rate enhancem...

Method and structure for barrier-less plug

Method for forming a semiconductor structure by diffusing manganese...

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING INTERCONNECT STRUCTURES

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...

SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...

SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...

INTERCONNECT LINES WITH LINE WIDTH PROFILE

SELECTIVE DEPOSITION OF CAPPING LAYER

SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION

VIA REVEAL PROCESSING AND STRUCTURES

VIA ALIGNED WITH ADJACENT INTERCONNECT LAYERS

TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor Structure and Method of Manufacture

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT SPACER STRUCTURE

TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS

SEMICONDUCTOR DEVICES WITH A NITRIDED CAPPING LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

BACK END OF LINE INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...