Smoothing; Planarisation

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CPC
H01L21/7684

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7684Smoothing; Planarisation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 12,322,680
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 12,322,649
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier for interconnects
- Patent number 12,322,650
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods
- Patent number 12,322,647
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching to reduce line wiggling
- Patent number 12,322,651
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
- Patent number 12,322,654
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 12,315,763
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Younghoon Goo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having graphene-containing-structures
- Patent number 12,315,810
- Issue date May 27, 2025
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lines and methods for fabricating the same
- Patent number 12,315,762
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device and method
- Patent number 12,315,809
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,317,501
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Sejie Takaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,795
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing copper line resistance
- Patent number 12,315,807
- Issue date May 27, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures with barriers and liners of varying thicknesses
- Patent number 12,315,764
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor interconnection structure against...
- Patent number 12,308,310
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with fluorine-c...
- Patent number 12,308,290
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device structures
- Patent number 12,308,292
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing fine metal lines with high aspect ratio
- Patent number 12,308,285
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with barrier po...
- Patent number 12,308,291
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with barrier portion
- Patent number 12,308,318
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 12,308,320
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Sung Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module with outer electrode e...
- Patent number 12,310,041
- Issue date May 20, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer on interconnection vias for magnetic tunnel...
- Patent number 12,310,248
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,308,288
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20250183161
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY
- Publication number 20250183177
- Publication date Jun 5, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE VIA STRUCTURE
- Publication number 20250167103
- Publication date May 22, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
- Publication number 20250167002
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20250163602
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING CONTACT STRUCTURE
- Publication number 20250167045
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167105
- Publication date May 22, 2025
- Chun-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250169090
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contact Metal
- Publication number 20250167047
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER INCLUDING METAL SILICIDE AND TITANIUM SILICON NIT...
- Publication number 20250167044
- Publication date May 22, 2025
- EUGENUS, INC.
- Ajit Dhamdhere
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE BLOCKING OF METAL SURFACES USING N-HETEROCYCLIC CARBENES...
- Publication number 20250157855
- Publication date May 15, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...
- Publication number 20250157916
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157963
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20250159916
- Publication date May 15, 2025
- UNITED MICROELECTRONICS CORP.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPE...
- Publication number 20250157927
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMI...
- Publication number 20250149482
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS
- Publication number 20250142901
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140687
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20250140611
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL CIRCUIT WITH SEMICONDUCTOR PILLAR CONTAINING LOCAL INTER...
- Publication number 20250142913
- Publication date May 1, 2025
- Western Digital Technologies, Inc.
- Hokuto KODATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140646
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140696
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140651
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE
- Publication number 20250140607
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250132246
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH ETCH STOP LAYER
- Publication number 20250132252
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-En CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Smoothing; Planarisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having backside interconnect structure on thro...

Interconnect structure of semiconductor device

Diffusion barrier for interconnects

Semiconductor devices and methods

Etching to reduce line wiggling

Passivation layers with rounded corners

Semiconductor structure, method for forming same, and wafer on wafe...

Three-dimensional memory device and method of making thereof using...

Integrated assemblies having graphene-containing-structures

Graphene barrier layer for reduced contact resistance

Self-aligned lines and methods for fabricating the same

Semiconductor device with liner structure

Interconnection structure and manufacturing method thereof

Via for semiconductor device and method

Semiconductor device

Semiconductor structure and manufacturing method thereof

Reducing copper line resistance

Conductive structures with barriers and liners of varying thicknesses

Method for forming semiconductor interconnection structure against...

Method for preparing semiconductor device structure with fluorine-c...

Methods of forming semiconductor device structures

Interconnect structure without barrier layer on bottom surface of via

Method for preparing fine metal lines with high aspect ratio

Method for preparing semiconductor device structure with barrier po...

Semiconductor device structure with barrier portion

Semiconductor device and method for fabricating semiconductor device

Metal-insulator-metal (MIM) capacitor module with outer electrode e...

Diffusion barrier layer on interconnection vias for magnetic tunnel...

Semiconductor device with composite conductive features and method...

Method for manufacturing an electronic device

Patents Applicationslast 30 patents

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

LOW RESISTANCE VIA STRUCTURE

Selective Removal of an Etching Stop Layer for Improving Overlay Sh...

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

METHOD OF FABRICATING CONTACT STRUCTURE

VIAS WITH SELECTED GRAIN DISTRIBUTION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of Forming Contact Metal

DIFFUSION BARRIER INCLUDING METAL SILICIDE AND TITANIUM SILICON NIT...

SELECTIVE BLOCKING OF METAL SURFACES USING N-HETEROCYCLIC CARBENES...

INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME

LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPE...

SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMI...

SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

PERIPHERAL CIRCUIT WITH SEMICONDUCTOR PILLAR CONTAINING LOCAL INTER...

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURES WITH BACKSIDE POWER DELIVERY NETWORK

CHIP STRUCTURE WITH ETCH STOP LAYER