Smoothing; Planarisation

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CPC
H01L21/7684

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7684Smoothing; Planarisation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming contact metal
- Patent number 12,211,747
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 12,211,745
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,211,740
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,211,905
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,205,911
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianlei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection lines with different li...
- Patent number 12,199,042
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 12,198,981
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 12,199,038
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 12,198,951
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of semiconductor structure having elastic memb...
- Patent number 12,198,977
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnection structure and manufacturing method thereof
- Patent number 12,198,980
- Issue date Jan 14, 2025
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,199,157
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,199,164
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor transducer device with mult...
- Patent number 12,191,402
- Issue date Jan 7, 2025
- Sciosense B.V.
- Alessandro Faes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact metallization process
- Patent number 12,191,199
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity tungsten film and method of manufacture
- Patent number 12,191,198
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDI...
- Publication number 20250038045
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Lorenzo Fratin
- G11 - INFORMATION STORAGE
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...
- Publication number 20250038008
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsiang Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ISOLATION STRUCTURE HAVING DIFFERENT LINERS ON UPPER AND LOWER PORT...
- Publication number 20250029869
- Publication date Jan 23, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jianwei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Resistance and High Reliability Metallization Module
- Publication number 20250029874
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN DEVICE AREAS
- Publication number 20250022746
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT LINER IN METAL FILL
- Publication number 20250022751
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Sang-Hyeob LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20250022750
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Shinjae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250014988
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...
- Publication number 20250014998
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNGHOO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015041
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250014944
- Publication date Jan 9, 2025
- SCREEN Holdings Co., Ltd.
- Kana TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006639
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES
- Publication number 20250006593
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250003067
- Publication date Jan 2, 2025
- Soulbrain Co., LTD
- Jae Sun JUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250006552
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...
- Publication number 20250006628
- Publication date Jan 2, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET HEIGHT CONTROL WITH DENSE OXIDE SHALLOW TRENCH ISOLATION
- Publication number 20250006788
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS
- Publication number 20250006553
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...
- Publication number 20240429156
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR INTERCONNECTS
- Publication number 20240429094
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...
- Publication number 20240429092
- Publication date Dec 26, 2024
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS

Smoothing; Planarisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming contact metal

Selective removal of an etching stop layer for improving overlay sh...

Method of forming a metal liner for interconnect structures

Semiconductor device with redistribution structure

Method of manufacture for embedded IC chip directly connected to PCB

Methods of fabricating semiconductor devices

Integrated circuits and methods for forming thin film crystal layers

Interconnect structure and methods of forming the same

Method for preparing recessed gate structure with protection layer

Method of preparing semiconductor structure having low dielectric c...

TSV as pad

Semiconductor device and method for manufacturing the semiconductor...

Bonding structure and method of forming same

Method for forming semiconductor structure and semiconductor structure

Plasma-damage-resistant interconnect structure and methods for form...

Semiconductor device and a manufacturing method thereof

Semiconductor device having interconnection lines with different li...

Diffusion barrier collar for interconnects

Gate line plug structures for advanced integrated circuit structure...

Semiconductor devices and methods of fabricating the same

High pressure wafer processing systems and related methods

Manufacturing method of semiconductor structure having elastic memb...

Metal interconnection structure and manufacturing method thereof

Semiconductor device structure and methods of forming the same

Semiconductor device and manufacturing method thereof

Plugs for interconnect lines for advanced integrated circuit struct...

Method of manufacturing a semiconductor transducer device with mult...

Contact metallization process

Gate-all-around transistor with reduced source/drain contact resist...

Low resistivity tungsten film and method of manufacture

Patents Applicationslast 30 patents

ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDI...

EMBEDDED METAL LINES

TUNGSTEN MOLYBDENUM STRUCTURES

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...

ISOLATION STRUCTURE HAVING DIFFERENT LINERS ON UPPER AND LOWER PORT...

Low Resistance and High Reliability Metallization Module

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

ISOLATION BETWEEN DEVICE AREAS

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

Conductive Structures Of Integrated Circuits

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

GRADIENT LINER IN METAL FILL

METHODS OF FORMING INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES

CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...

NANOSHEET HEIGHT CONTROL WITH DENSE OXIDE SHALLOW TRENCH ISOLATION

SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS

Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

DIFFUSION BARRIER FOR INTERCONNECTS

NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...