Claims
- 1. A method of fabricating a channel member for a PALC panel, comprising:
- (a) providing a substrate of hard transparent material having upper and lower surfaces,
- (b) forming a layer of conductive material over the upper surface of the substrate,
- (c) forming a layer of insulating material over the layer of conductive material,
- (d) removing the layer of insulating material in accordance with a predetermined spatial pattern so as to expose predetermined portions of the layer of conductive material, and
- (e) removing exposed portions of the layer of conductive material by erosion until parts of the upper surface of the substrate are exposed.
- 2. A method according to claim 1, further comprising, between steps (c) and (d):
- depositing a layer of erosion resistant material over the layer of insulating material, and
- partially removing said layer of erosion resistant material in order to define said predetermined pattern.
- 3. A method according to claim 1, wherein step (b) comprises depositing a layer of metal frit over the upper surface of the substrate, step (c) comprises depositing a layer of glass frit over the layer of metal frit, and the method further comprises fusing the layer of metal frit and the layer of glass frit.
- 4. A method according to claim 3, further comprising, between steps (c) and (d):
- depositing a layer of erosion resistant material over the layer of glass frit, and
- partially removing said layer of erosion resistant material in order to define said predetermined pattern.
- 5. A method according to claim 4, wherein the erosion resistant material is a metal.
- 6. A method according to claim 4, wherein the erosion resistant material is a photoresist and the step of fusing the layer of metal frit and the layer of glass frit is performed before depositing the layer of photoresist.
- 7. A method of fabricating a channel subassembly for a PALC panel, comprising:
- (a) providing a substrate of hard transparent material having upper and lower surfaces,
- (b) forming a layer of conductive material over the upper surface of the substrate,
- (c) forming a layer of insulating material over the layer of conductive material,
- (d) removing the layer of insulating material in accordance with a predetermined spatial pattern so as to expose predetermined portions of the layer of conductive material,
- (e) removing exposed portions of the layer of conductive material by erosion until parts of the upper surface of the substrate are exposed, and
- (f) attaching a cover sheet to the upper surface of the channel member.
CROSS REFERENCED TO RELATED APPLICATIONS
This application claims the benefit of U.S. Provisional Application Ser. No. 60/035,827, filed Jan. 10, 1997.
US Referenced Citations (3)