Number | Date | Country | Kind |
---|---|---|---|
9-003541 | Jan 1997 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
5429990 | Liu et al. | Jul 1995 | |
5592024 | Aoyama et al. | Jan 1997 | |
5714418 | Bai et al. | Feb 1998 | |
5744394 | Iguchi et al. | Apr 1998 | |
5817571 | Yu et al. | Oct 1998 | |
6004622 | Yen et al. | Dec 1999 |
Number | Date | Country |
---|---|---|
63-299250 | Dec 1988 | JPX |
3-289156 | Dec 1991 | JPX |
7-176612 | Jul 1995 | JPX |
7-307338 | Nov 1995 | JPX |
Entry |
---|
Miyazaki et al., "The Fabrication of Double-Level Copper Interconnection Using Dry Etching", Electronic Data Communication Academy Electronics Society Conference, pp. 117-118, C-419, (1995). |
T. Takewaki et al., "Cu Interconnect Technology For Sub-quarter-micron ULSIs", Electronic Data Communication Academy Electronics Society Conference, pp. 115-116, C-418, (1995). |