formation of thin insulating films on the sidewalls or on top of conductors

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H01L21/76834

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76834formation of thin insulating films on the sidewalls or on top of conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and formation method thereof
- Patent number 12,293,971
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongdi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface oxidation control of metal gates using capping layer
- Patent number 12,293,916
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a workpiece including low resistance interconne...
- Patent number 12,278,143
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact structure over active gate and method to fabricate same
- Patent number 12,278,144
- Issue date Apr 15, 2025
- Intel Corporation
- Abhijit Jayant Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect structure and method for integrated circuits
- Patent number RE50384
- Issue date Apr 15, 2025
- Tessera Advanced Technologies, Inc.
- Ryoung-Han Kim
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 12,272,547
- Issue date Apr 8, 2025
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects with line wiggling prevention
- Patent number 12,266,605
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,261,117
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textile patterning for subtractively-patterned self-aligned interco...
- Patent number 12,261,057
- Issue date Mar 25, 2025
- Tahoe Research, LTD.
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical fuse (e-fuse) one-time programmable (OTP) device and man...
- Patent number 12,255,133
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of back end of line via to metal line margin improvement
- Patent number 12,255,134
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning approach by direct metal etch
- Patent number 12,243,775
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,243,777
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Woojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including insulation patterns with different...
- Patent number 12,237,385
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Bongkwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,211,845
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 12,211,741
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect structure for semiconductor device
- Patent number 12,199,036
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jason Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...
- Publication number 20250149328
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Bhadri N. VARADARAJAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20250140611
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20250132199
- Publication date Apr 24, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA
- Publication number 20250125192
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT
- Publication number 20250125193
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20250118597
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF ORGANIC FILMS
- Publication number 20250118562
- Publication date Apr 10, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118656
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112169
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112171
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250105154
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Giyoung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20250105056
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20250105148
- Publication date Mar 27, 2025
- Intel Corporation
- Marvin PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250105147
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jason HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250087532
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES
- Publication number 20250087533
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsing Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250087531
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250038048
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20250022750
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Shinjae Hwang
- H01 - BASIC ELECTRIC ELEMENTS

formation of thin insulating films on the sidewalls or on top of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and formation method thereof

Surface oxidation control of metal gates using capping layer

Method of providing a workpiece including low resistance interconne...

Gate contact structure over active gate and method to fabricate same

Multilayer interconnect structure and method for integrated circuits

Conformal deposition of silicon carbide films

Removing polymer through treatment

Integrated chip with an etch-stop layer forming a cavity

Top via interconnects with line wiggling prevention

Info structure with copper pillar having reversed profile

Semiconductor device and method of manufacturing the same

Textile patterning for subtractively-patterned self-aligned interco...

Multi-layer line structure

Trench contact structures for advanced integrated circuit structure...

Electrical fuse (e-fuse) one-time programmable (OTP) device and man...

Method of back end of line via to metal line margin improvement

Single-mask alternating line deposition

Double patterning approach by direct metal etch

Semiconductor device and method of manufacturing the same

Hard mask removal without damaging top epitaxial layer

Semiconductor devices including insulation patterns with different...

Semiconductor device and method of manufacturing the same

Semiconductor device and method

Method of forming an integrated circuit device having an etch-stop...

Integrated chip with graphene based interconnect

Semiconductor device and a method for fabricating the same

Multi-wafer capping layer for metal arcing protection

Deposition of organic films

Gate line plug structures for advanced integrated circuit structure...

Low resistance interconnect structure for semiconductor device

Patents Applicationslast 30 patents

REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...

SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DEPOSITION OF ORGANIC FILMS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

LOW RESISTANCE INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES

SEMICONDUCTOR CHIP STRUCTURE

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SUBSTRATE PROCESSING METHOD

Conductive Structures Of Integrated Circuits

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

METHODS OF FORMING INTERCONNECT STRUCTURES