Method of forming a corona electrode substantially of chemical vapor deposition silicon carbide and a method of ionizing gas using the same

Information

  • Patent Grant
  • 8067892
  • Patent Number
    8,067,892
  • Date Filed
    Thursday, February 26, 2009
    15 years ago
  • Date Issued
    Tuesday, November 29, 2011
    13 years ago
Abstract
A method is provided for forming a corona-producing emitter electrode by depositing substantially pure silicon carbide by CVD and forming a corona-producing emitter electrode with the deposited silicon carbide. In addition, a method of forming a corona-producing gas ionizer is provided by providing a corona electrode formed from CVD silicon carbide, electrically coupling the corona electrode to a high voltage power supply, and providing an AC or DC voltage from the high voltage power supply to the corona electrode. Furthermore, a method of ionizing gas in an environment is provided by providing a corona-producing ionizer emitter electrode formed substantially of CVD silicon carbide, electrically coupling the electrode to a high voltage power supply, and providing an AC or DC voltage from the high voltage power supply to the electrode.
Description
BACKGROUND OF THE INVENTION

The present invention is directed to emitter electrodes for gas ionizers and, more specifically, to a gas ionizer emitter electrode formed of or coated with a carbide material such as silicon carbide.


Ion generators are related generally to the field of devices that neutralize static charges in workspaces to minimize the potential for electrostatic discharge. Static elimination is an important activity in the production of technologies such as large scale integrated circuits, magnetoresistive recording heads, and the like. The generation of particulate matter by corona-producing electrodes in static eliminators competes with the equally important need to establish environments that are free from particles and impurities. Metallic impurities can cause fatal damage to such technologies, so it is desirable to suppress those contaminants to the lowest possible level.


It is known in the art that when metallic ion emitters are subjected to corona discharges in room air, they show signs of deterioration and/or oxidation within a few hours and the generation of fine particles. This problem is prevalent with needle electrodes formed of copper, stainless steel, aluminum, and titanium. Corrosion is found in areas under the discharge or subjected to the active gaseous species NOx. NO3 ions are found on all the above materials, whether the emitters had positive or negative polarity. Also, ozone-related corrosion is dependent on relative humidity and on the condensation nuclei density. Purging the emitter electrodes with dry air can reduce NH4 NO3 as either an airborne contaminant or deposit on the emitters.


Surface reactions lead to the formation of compounds that change the mechanical structure of the emitters. At the same time, those reactions lead to the generation of particles from the electrodes or contribute to the formation of particles in the gas phase.


Silicon and silicon dioxide emitter electrodes experience significantly lower corrosion than metals in the presence of corona discharges. Silicon is known to undergo thermal oxidation, plasma oxidation, oxidation by ion bombardment and implantation, and similar forms of nitridation. Some have tried to improve silicon emitters by using 99.99% pure silicon that contains a dopant such as phosphorus, boron, antimony and the like. For example, U.S. Pat. No. 5,650,203 (Gehlke) discloses silicon emitters containing a dopant material. However, even such high purity doped silicon emitters suffer from corrosion and degradation.


Another approach is to form emitter electrodes from nearly pure germanium or from germanium with a dopant material. For example, U.S. Pat. No. 6,215,248 (Noll), the contents of which are incorporated by reference herein, discloses germanium needles or emitter electrodes for use in low particle generating gas ionizers and static eliminators. While such germanium emitter electrodes have proven to be less susceptible to corrosion and degradation than metallic emitter electrodes and silicon emitter electrodes with a dopant, there is a need for an emitter electrode that produces or causes even less metallic and/or non-metallic contamination with enhanced resistance to erosion.


BRIEF SUMMARY OF THE INVENTION

Briefly stated, in one embodiment, the present invention comprises an ionizer emitter electrode formed of or coated with a carbide material, wherein the carbide material is selected from the group consisting of germanium carbide, boron carbide, silicon carbide and silicon-germanium carbide. The present invention also comprises a corona-producing ionizer emitter electrode substantially formed of silicon carbide. In another aspect, the present invention is a corona-producing ionizer emitter electrode formed of an electrically conductive metal base, the metal base being coated at least partially with silicon carbide. In yet another aspect, the present invention is a corona-producing ionizer emitter electrode that ionizes gas when high voltage is applied thereto, and the emitter electrode is formed substantially of silicon carbide with the necessary dopant to achieve a resistivity of less than or equal to about one hundred ohms-centimeter (100 Ω-cm).





BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The foregoing summary, as well as the following detailed description of preferred embodiments of the invention, will be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there are shown in the drawings embodiments which are presently preferred. It should be understood, however, that the invention and its applications are not limited to the precise arrangements and instrumentalities shown.


In the drawings:



FIG. 1 is a side elevational view of an emitter electrode formed or coated with a carbide material in accordance with some preferred embodiments of the present invention;



FIG. 2A is a schematic view of a point-to-plane corona producing apparatus in accordance with a first preferred embodiment of the present invention;



FIG. 2B is a schematic view of a point-to-point corona producing apparatus in accordance with a second preferred embodiment of the present invention;



FIG. 2C is a schematic view of a wire-to-plane corona producing apparatus in accordance with a third preferred embodiment of the present invention;



FIG. 2D is a schematic view of a wire to cylinder corona producing apparatus in accordance with a fourth preferred embodiment of the present invention;



FIG. 2E is a schematic view of a point-to-room corona producing apparatus in accordance with a fifth preferred embodiment of the present invention; and



FIG. 3 is a schematic diagram of a gas ionizer which utilizes the preferred embodiments of the present invention.





DETAILED DESCRIPTION OF THE INVENTION

Certain terminology is used in the following detailed description for convenience only and is not limiting. The words “right,” “left,” “lower” and “upper” designate directions in the drawings to which reference is made. The words “inwardly” and “outwardly” refer to directions toward and away from, respectively, the geometric center of the described device and designated parts thereof. The terminology includes the words above specifically mentioned, derivatives thereof and words of similar import. Additionally, the word “a,” as used in the claims and in the corresponding portions of the specification means “one” or “at least one.”


Referring to the drawings in detail, wherein like numerals represent like elements throughout, there is shown in FIG. 1 an emitter electrode 12 formed or coated with a carbide material, such as silicon carbide (SiC), in accordance with some preferred embodiments of the present invention. The emitter electrode has a generally cylindrically-shaped body and a generally conically-shaped tip 18 ending with a rounded end 17. Alternatively, the rounded end 17 is sharply tapered or pointed. The rear end has a chamfer 19. The shape of the emitter electrode 12 of FIG. 1 is merely exemplary and should not be construed as limiting to this invention. Other shapes, sizes or proportions may be utilized without departing from the present invention.


Pure and ultra-pure SiC has been found, by experimentation, to outlast other electrode materials such as metallic, doped silicon and even pure germanium electrodes. SiC has been found to have superior chemical, plasma and erosion resistance with phenomenal thermal properties as compared to the other mentioned electrode materials. Chemical vapor deposition (CVD) manufacturing produces chemical vapor deposition (CVD) SiC that is highly pure and is commercially available. For example, purities of about 99.9995% CVD SiC can be obtained by CVD manufacturing. Because of the high purity of CVD SiC, the potential for unwanted metallic and non-metallic contamination is drastically reduced and nearly eliminated in gas ionization applications. CVD SiC emitter electrodes 12 also exhibit greater mechanical strength and reduced breakage as compared to similarly designed semiconductive counterparts. Experimentation has demonstrated that SiC, particularly CVD SiC, emitter electrodes are cleaner—with respect to fine particulates—than polycrystalline germanium emitters and single crystal silicon emitter electrodes. Other carbide materials exhibiting physical properties may be utilized such as germanium carbide, boron carbide, silicon carbide, silicon-germanium carbide and the like.


Preferably, the emitter electrode 12 is formed of at least 99.99% pure silicon carbide. Preferably, the silicon carbide is chemical vapor deposition (CVD) silicon carbide. Preferably, the emitter electrode 12 is a corona-producing ionizer emitter electrode 12 that is substantially formed of silicon carbide.


Doping of the carbide material may be necessary to achieve the desired conductivity. For example, in the case of silicon carbide, nitrogen is typically introduced to control the conductivity (resistivity). Preferably, the carbide material is doped to achieve predetermined conductivity characteristics.


Alternatively, the emitter electrode 12 is a corona-producing ionizer emitter electrode 12 formed of an electrically conductive metal base that is at least partially coated with silicon carbide. The metal base may be formed of copper, stainless steel, aluminum, titanium and the like, so long as silicon carbide material coats at least a substantial portion or all of the tip 18. Preferably, silicon carbide material coats all of exposed surfaces of the metal base to reduce the potential for corrosion and degradation.


Referring to FIG. 3, a typical gas ionizer 100 is schematically shown which utilizes the preferred embodiments of the present invention. Gas ionizers 100 typically deliver ionized gas to a clean room, such as a Class 10 clean room or other high cleanliness mini-environment. A high-voltage power supply 22 is electrically coupled to the emitter electrode 12. A corona is produced by application of high voltage to the electrode 12. The gas ionizer 100 may comprise a plurality of emitter electrodes 12 all connected to an AC voltage for generating both positive and negative ions (not shown). Alternatively, the gas ionizer 100 comprises two separately connected sets of electrical emitter electrodes 12 used in conjunction with bipolar DC voltage that allows one set of emitter electrodes 12 to be operated at a positive voltage and a second set of emitter electrodes 12 to be operated at a negative voltage for generating positive and negative ions (not shown).


The high-voltage power supply 22 is typically supplied with electrical power conditioned at between about seventy (70 V) and about two hundred forty (240 V) volts AC at between about fifty (50 Hz) and about sixty (60 Hz) hertz. The high-voltage power supply 22 can include a circuit (not shown in detail), such as a transformer, capable of stepping up the voltage to between about three thousand (3 KV) and ten thousand (10 KV) volts AC at between about fifty (50 Hz) and about sixty (60 Hz) hertz. Alternatively, high-voltage power supply 22 can include a circuit, such as a rectifier that includes a diode and capacitor arrangement, capable of increasing the voltage to between about five thousand (5 KV) and ten thousand (10 KV) volts DC of both positive and negative polarities. Alternatively, the high-voltage power supply 22 is supplied with electrical power conditioned at about twenty-four (24 V) volts DC. The high-voltage power supply 22 can include a circuit, such as a free standing oscillator or switching type arrangement that is used to drive a transformer whose output is rectified, capable of conditioning the voltage to between about three thousand (3 KV) and ten thousand (10 KV) volts DC of both positive and negative polarities. Other power supplies using other voltages may be utilized without departing from the present invention.



FIG. 2A is a schematic view of a point-to-plane corona producing apparatus in accordance with a first preferred embodiment of the present invention. The emitter electrode 12 is arranged in a point geometry and a counter-electrode 20 is arranged in a plane geometry. The power supply 22 is electrically coupled to the emitter electrode 12 to generate a corona. The counter-electrode 20 may be connected to ground (i.e., Earth ground) in the case of high voltage AC or to an opposite polarity of the power supply 22 than the emitter electrode 12 in the case of high-voltage DC.



FIG. 2B is a schematic view of a point-to-point corona producing apparatus in accordance with a second preferred embodiment of the present invention. Two or more emitter electrodes 12 are arranged in a point geometry where the electrodes have opposite voltage polarity. The power supply 22 is electrically coupled to each emitter electrode 12 to generate a corona.



FIG. 2C is a schematic view of a wire-to-plane corona producing apparatus in accordance with a third preferred embodiment of the present invention. A wire electrode 23 formed of SiC is arranged in a thin-wire geometry and a counter-electrode 20 is arranged in a plane geometry. The power supply 22 is electrically coupled to the emitter electrode 12 to generate a corona. The power supply 22 is electrically coupled to the emitter electrode 12 to generate a corona. The counter-electrode 20 may be connected to ground in the case of high voltage AC or to an opposite polarity of the power supply 22 than the emitter electrode 12 in the case of high-voltage DC.



FIG. 2D is a schematic view of a wire to cylinder corona producing apparatus in accordance with a fourth preferred embodiment of the present invention. The wire electrode 23 formed of SiC is arranged in a thin-wire geometry and the counter-electrode 21 is arranged in a plane geometry. The power supply 22 is electrically coupled to the emitter electrode 12 to generate a corona. The power supply 22 is electrically coupled to the emitter electrode 12 to generate a corona. The counter-electrode 21 may be connected to ground in the case of high voltage AC or to an opposite polarity of the power supply 22 than the emitter electrode 12 in the case of high-voltage DC.



FIG. 2E is a schematic view of a point-to-room corona producing apparatus in accordance with a fifth preferred embodiment of the present invention. The emitter electrode 12 is arranged in a point geometry and there is no counter-electrode 20, 21. The power supply 22 is electrically coupled to the emitter electrode 12 to generate a corona. The power supply 22 is also connected to ground (i.e., Earth ground).


From the foregoing, it can be seen that the present invention comprises an emitter electrode formed or coated with silicon carbide (SiC) or CVD SiC for use with gas ionizers. It will be appreciated by those skilled in the art that changes could be made to the embodiments described above without departing from the broad inventive concept thereof. It is understood, therefore, that this invention is not limited to the particular embodiments disclosed, but it is intended to cover modifications within the spirit and scope of the present invention as defined by the appended claims.

Claims
  • 1. A method of forming a corona-producing emitter electrode comprising: (a) depositing substantially pure silicon carbide by chemical vapor deposition; and(b) forming a corona-producing emitter electrode entirely with the deposited substantially pure silicon carbide.
  • 2. The method of claim 1, further comprising: (c) doping the substantially pure silicon carbide to achieve predetermined conductivity characteristics.
  • 3. The method of claim 1, further comprising: (c) doping the substantially pure silicon carbide with nitrogen.
  • 4. The method of claim 1, wherein the depositing step includes the step of chemically vapor depositing 99.99% pure silicon carbide.
  • 5. A method of forming a corona-producing gas ionizer comprising: (a) providing at least one corona electrode formed entirely of substantially pure chemical vapor deposition silicon carbide;(b) electrically coupling the corona electrode to a high voltage power supply; and(c) providing an AC or DC voltage from the high voltage power supply to the corona electrode.
  • 6. The method of claim 5, further comprising: (d) forming a first and second set of corona electrodes from the provided at least one corona electrode;(e) connecting the first set of corona electrodes to the high voltage power supply to form a positive voltage for generating positive ions; and(f) connecting the second set of corona electrodes to the high voltage power supply to form a negative voltage for generating negative ions.
  • 7. The method of claim 5, wherein the step of providing at least one corona electrode includes the step of chemically vapor depositing at least 99.99% pure silicon carbide.
  • 8. A method of ionizing gas in an environment comprising: (a) providing a corona-producing ionizer emitter electrode formed entirely of substantially pure chemical vapor deposition silicon carbide;(b) electrically coupling the corona-producing ionizer emitter electrode to a high voltage power supply; and(c) providing an AC or DC voltage from the high voltage power supply to the corona-producing ionizer emitter electrode.
  • 9. The method of claim 8, wherein the step of providing the corona-producing ionizer emitter electrode includes the step of forming the corona-producing ionizer emitter electrode substantially of about 99.99% pure chemical vapor deposition silicon carbide.
  • 10. The method of claim 8, wherein the step of providing the corona-producing ionizer emitter electrode includes the step of forming the corona-producing ionizer emitter electrode to have a generally cylindrical-shaped body and a generally conically-shaped tip.
  • 11. The method of claim 8, wherein the step of providing the corona-producing ionizer emitter electrode includes the step of forming the corona-producing ionizer emitter electrode with a resistivity of less than or equal to about one hundred ohms-centimeter.
  • 12. The method of claim 8, wherein the step of providing an AC voltage includes the step of providing an AC voltage from about 70 V to about 240 V.
  • 13. The method of claim 8, wherein the step of providing an AC voltage includes the step of providing an AC step-up voltage of about 3 KV to about 10 KV.
  • 14. The method of claim 8, wherein the step of providing a DC voltage includes the step of providing a DC voltage from about 5 KV to about 10 KV.
  • 15. The method of claim 8, further comprising: (d) configuring the corona-producing ionizer emitter electrode into a point-to-plane, point-to-point, wire-to-plane, wire-to-cylinder, or point-to-room corona producing apparatus.
  • 16. A method of forming a corona-producing emitter electrode comprising: (a) depositing 99.99% pure silicon carbide by chemical vapor deposition; and(b) forming a corona-producing emitter electrode with the deposited substantially pure silicon carbide.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of copending U.S. application Ser. No. 10/956,316 filed Oct. 1, 2004, the entire disclosure of which is incorporated herein by reference.

US Referenced Citations (11)
Number Name Date Kind
4677638 Beaupere et al. Jun 1987 A
5008594 Swanson et al. Apr 1991 A
5229625 Suzuki et al. Jul 1993 A
5447763 Gehlke Sep 1995 A
5650203 Gehlke Jul 1997 A
5938823 Condit et al. Aug 1999 A
6215248 Noll Apr 2001 B1
6451157 Hubacek Sep 2002 B1
7018947 Goela et al. Mar 2006 B2
20020127853 Hubacek et al. Sep 2002 A1
20040189176 Koga et al. Sep 2004 A1
Foreign Referenced Citations (6)
Number Date Country
63130149 Jun 1988 JP
3188699 Aug 1991 JP
5152054 Jun 1993 JP
6036857 Feb 1994 JP
6084581 Mar 1994 JP
10208848 Aug 1998 JP
Related Publications (1)
Number Date Country
20090176431 A1 Jul 2009 US
Continuations (1)
Number Date Country
Parent 10956316 Oct 2004 US
Child 12393760 US