Claims
- 1. A method of forming a lead attached to a body of a semiconductor device, said lead having a surface attached to said body, a distal end away from said body, and a proximal area interposed between said attached surface and said distal end, consisting of the following lead bend steps:
- a) rounding said distal end of said lead in a single bend step to form an arc in said distal end, said are terminating toward said proximal area of said leads in a substantially straight lead portion;
- b) in a single bend step, bending said proximal area of said lead close to said attached surface;
- c) in a single bend step, increasing said arc in said distal end to encroach on said proximal area thereby resulting in at least a portion of said proximal area forming a portion of said increased arc.
- 2. The method of claim 1 wherein said arc resulting from said step a) has a radius of between 0.030" and 0.040".
- 3. The method of claim 2 wherein step b) results in the formation of an angle of between 60.degree. and 90.degree. as defined by said attached surface and said proximal area.
- 4. The method of claim 1 wherein said step b) results in the formation of an angle of about 70.degree. as defined by said attached surface and said proximal area.
- 5. The method of claim 3 wherein said step c) results in said lead having an arc with a radius of between 0.035" and 0.045".
- 6. The method of claim 1 wherein said surface attached to said body is not clamped during said lead forming.
- 7. A method of forming a lead attached to a body of a semiconductor device, said lead having a surface attached to said body, a distal end away from said body, and a proximal area interposed between said attached surface and said distal end, consisting of the following lead bend steps:
- a) rounding said distal end of said lead in a single bend step to form an arc in said distal end having a radius of between 0.030" and 0.040", said are terminating toward said proximal area of said leads in a substantially straight lead portion;
- b) in a single bend step, bending said proximal area of said lead close to said attached surface such that said proximal area of said lead forms an angle of between about 60.degree. and 90.degree. with said attached surface of said lead;
- c) in a single bend step, increasing said arc in said distal end to a radius of between about 0.035" and 0.045".
- 8. The method of claim 7 wherein said step b) results in the formation of an angle of about 70.degree. as defined by said attached surface and said proximal area.
- 9. The method of claim 7 wherein said surface attached to said body is not clamped during said lead forming.
Parent Case Info
This application is a division of U.S. patent application Ser. No. 07/744,602, filed Aug. 13, 1991, now abandoned.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
744602 |
Aug 1991 |
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