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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49171Fan-out arrangements

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 12,094,835
- Issue date Sep 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 12,062,833
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,961,807
- Issue date Apr 16, 2024
- Silicon Works Co., Ltd.
- Myoung Su Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic components, corresponding electronic...
- Patent number 11,935,818
- Issue date Mar 19, 2024
- STMicroelectronics S.r.l.
- Fabio Marchisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,881,398
- Issue date Jan 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency module with multi-mode stacked...
- Patent number 11,864,295
- Issue date Jan 2, 2024
- Skyworks Solutions, Inc.
- Yasser Khairat Soliman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,848,284
- Issue date Dec 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 11,837,556
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device including the same having pads wit...
- Patent number 11,818,839
- Issue date Nov 14, 2023
- Samsung Display Co., Ltd.
- Yun-mo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,478
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,783,879
- Issue date Oct 10, 2023
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,735,561
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 11,677,135
- Issue date Jun 13, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 11,658,243
- Issue date May 23, 2023
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor integrated circuits
- Patent number 11,644,485
- Issue date May 9, 2023
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow sensor, method for manufacturing flow sensor and flow sensor m...
- Patent number 11,629,988
- Issue date Apr 18, 2023
- Hitachi Astemo, Ltd.
- Tsutomu Kono
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,605,577
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379512
- Publication date Nov 14, 2024
- Mitsubishi Electric Corporation
- Tomokazu KANNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312950
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takaya HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...
- Publication number 20240203834
- Publication date Jun 20, 2024
- STMicroelectronics S.r.l.
- Fabio MARCHISI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...
- Publication number 20240162162
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND IGNITION DEVICE
- Publication number 20240153852
- Publication date May 9, 2024
- ROHM CO., LTD.
- Yoshiaki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRIPS
- Publication number 20240128094
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20240096387
- Publication date Mar 21, 2024
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20240096823
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240079384
- Publication date Mar 7, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420428
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT
- Publication number 20230402352
- Publication date Dec 14, 2023
- TDK Corporation
- Kazuma YAMAWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
- Publication number 20230387808
- Publication date Nov 30, 2023
- Power Integrations, Inc.
- Balu Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING...
- Publication number 20230369410
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Elias Pree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369278
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343744
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20230335883
- Publication date Oct 19, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan MANGRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20230317567
- Publication date Oct 5, 2023
- Li-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298990
- Publication date Sep 21, 2023
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...
- Publication number 20230210023
- Publication date Jun 29, 2023
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS

Fan-out arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Memory device comprising programmable command-and-address and/or da...

Wire bonding method and apparatus for electromagnetic interference...

Packaged electronic device having integrated antenna and locking st...

Semiconductor package

Method of producing electronic components, corresponding electronic...

Semiconductor device including a bidirectional switch

Semiconductor package and production method thereof, and semiconduc...

Semiconductor device and method for supporting ultra-thin semicondu...

Selectively shielded radio frequency module with multi-mode stacked...

Semiconductor device and measurement device

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor device with sealed semiconductor chip

Protective elements for bonded structures

Wire bonding method and apparatus for electromagnetic interference...

Package-on-package assembly with wire bonds to encapsulation surface

Stacked semiconductor die assemblies with die support members and a...

Display panel and display device including the same having pads wit...

Semiconductor device

Semiconductor device

Memory device comprising programmable command-and-address and/or da...

Semiconductor device and method for manufacturing semiconductor device

Package-on-package assembly with wire bond vias

Semiconductor device

Packaged electronic device having integrated antenna and locking st...

Inverted leads for packaged isolation devices

Current sensor integrated circuits

Flow sensor, method for manufacturing flow sensor and flow sensor m...

Semiconductor device including a bidirectional switch

Multichip package manufacturing process

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND IGNITION DEVICE

INTERCONNECT STRIPS

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

SEMICONDUCTOR PACKAGE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

SEMICONDUCTOR DEVICE

LEAD FRAME AND ELECTRONIC COMPONENT

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...

SEMICONDUCTOR DEVICE

TRANSISTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

LEADFRAME

SEMICONDUCTOR DEVICE

TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...