Claims
- 1. A method of forming a first conversion layer for use in a proximity type, radiation sensitive image intensifier comprising the steps of:
- a. etching a glass plate to form an array of through holes with straight angular walls;
- b. vacuum depositing a conductive coating onto said walls;
- c. vacuum evaporating a scintillator material onto said walls; and
- d. annealing said scintillator material.
- 2. The method of claim 1 wherein the etching step forms through holes which are hexagonal.
- 3. The method of claim 1 wherein the vacuum evaporating step fills the holes with scintillation material.
- 4. The method of claim 1 wherein the annealing step is performed between 200.degree. and 300.degree. C.
- 5. The method of claim 1 additionally comprising the step of depositing a photocathode layer to one side of the first conversion layer.
- 6. The method of claim 1 wherein the etching step results in through holes having a length substantially greater than the width.
- 7. A method of forming a second conversion layer for use in a proximity type, radiation sensitive image intensifier comprising the steps of:
- a. etching a glass plate to form an array of through holes with straight angular walls;
- b. vacuum depositing a conductive coating onto said walls;
- c. sealing off one end of said plate with a light transparent support layer;
- d. depositing a phosphor layer to the light transparent support layer on a side adjacent said plate; and
- e. depositing a photocathode layer to the light transparent support layer on a side opposite said plate.
- 8. The method of claim 7 wherein the etching step forms through holes which are hexagonal.
- 9. The method of claim 7 wherein the phosphor layer depositing step deposits a phosphor to a thickness of 5 to 50 microns.
- 10. The method of claim 7 wherein the etching step results in through holes having a length substantially greater than the width.
- 11. A method of forming a third conversion layer for use in a proximity type, radiation sensitive image intensifier comprising the steps of:
- a. etching a glass plate to form an array of through holes with straight angular walls;
- b. vacuum depositing a conductive coating into said walls;
- c. sealing off one end of said plate with a layer of transparent sealing glass; and
- d. depositing a phosphor layer to the layer of sealing glass on a side adjacent said plate.
- 12. The method of claim 11 wherein the etching step forms through holes which are hexagonal.
- 13. The method of claim 11 wherein the etching step results in through holes having a length substantially greater than the width.
Parent Case Info
This application is a divisional of copending application Ser. No. 838,100 filed Mar. 10, 1986 entitled Improved Panel Type Radiation Image Intensifier which issued as U.S. Pat. No. 4,730,103 on Mar. 8, 1988.
US Referenced Citations (26)
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Nov 1984 |
EPX |
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FRX |
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FRX |
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Non-Patent Literature Citations (1)
Entry |
Corning Product Brochure No. FPG-4, "Fotoform" and Fotoceram Precision Photosensitive Glass Materials (not dated). |
Divisions (1)
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Number |
Date |
Country |
Parent |
838100 |
Mar 1986 |
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