Number | Name | Date | Kind |
---|---|---|---|
4789648 | Chow et al. | Dec 1988 | |
4837051 | Farb et al. | Jun 1989 | |
4920070 | Mukai | Apr 1990 | |
4987099 | Flanner | Jan 1991 | |
5026666 | Hills et al. | Jun 1991 | |
5034347 | Kakihana | Jul 1991 | |
5055423 | Smith et al. | Oct 1991 | |
5091339 | Carey | Feb 1992 | |
5093279 | Andreshak et al. | Mar 1992 | |
5106780 | Higuchi | Apr 1992 | |
5114879 | Madan | May 1992 | |
5169802 | Yeh | Dec 1992 | |
5198389 | Andreas et al. | Mar 1993 | |
5204286 | Doan | Apr 1993 | |
5240879 | De Bruin | Aug 1993 | |
5262354 | Cote et al. | Nov 1993 | |
5266446 | Chang et al. | Nov 1993 | |
5312777 | Cronin et al. | May 1994 |
Number | Date | Country |
---|---|---|
61-23322 | Jan 1986 | JPX |
1-302748 | Dec 1989 | JPX |
2-122652 | May 1990 | JPX |
5-234940 | Sep 1993 | JPX |
Entry |
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"Electroless Plating for Low-Cost High-Leverage Wiring", IBM Technical Disclosure Bulletin, vol. 32, No. 3A, Aug. 1989, pp. 344-345. |
"Temporary Contact Protection For A Single Mask, Gate Electrode And Diffusion Borderless Contact Process" IBM Technical Disclosure Bulletin, vol. 32, No. 7, Dec. 1989, pp. 118-119. |