by selective deposition of conductive material in the vias

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H01L21/76879

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76879by selective deposition of conductive material in the vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,916
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Won Keun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing selective low resistivity Ru atomic layer dep...
- Patent number 12,154,787
- Issue date Nov 26, 2024
- The Regents of the University of California
- Michael Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,154,850
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor device having the same
- Patent number 12,142,521
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and substrate process...
- Patent number 12,131,947
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Yutaka Motoyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques for void-free material depositions
- Patent number 12,131,948
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- M. Arif Zeeshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 12,131,994
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method
- Patent number 12,119,228
- Issue date Oct 15, 2024
- ASM IP Holding B.V.
- Chiyu Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,120,871
- Issue date Oct 15, 2024
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,036
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for low resistivity and stress tungsten gap fill
- Patent number 12,094,773
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio via fill process employing selective metal deposi...
- Patent number 12,087,628
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection structure and method of...
- Patent number 12,080,591
- Issue date Sep 3, 2024
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 12,074,058
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of metal barrier in damascene processes
- Patent number 12,068,194
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming gate line-end of semiconductor structures with improved met...
- Patent number 12,068,196
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Liang Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 12,051,646
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional MIM capacitor having a comb structure and methods...
- Patent number 12,046,550
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Paul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a structure with a hole
- Patent number 12,040,229
- Issue date Jul 16, 2024
- ASM IP Holding B.V.
- Dieter Pierreux
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for selectively depositing a metallic film on a substrate
- Patent number 12,033,861
- Issue date Jul 9, 2024
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semi-damascene structure with dielectric hardmask layer
- Patent number 12,014,951
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Hoonseok Seo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...
- Publication number 20240420999
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Myung Ok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS
- Publication number 20240413082
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METH...
- Publication number 20240404882
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Tsung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BUILD-UP PROCESSING
- Publication number 20240404828
- Publication date Dec 5, 2024
- Geminatio, Inc.
- Brennan Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO REDUCE LAYOUT DIMENSIONS USING NON-PERPENDICUL...
- Publication number 20240395708
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Tien SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components For Increased Power Handling
- Publication number 20240395656
- Publication date Nov 28, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20240395700
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming the Same
- Publication number 20240387253
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379417
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240379598
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING
- Publication number 20240376598
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- Jasmine LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT
- Publication number 20240371750
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371801
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS
- Publication number 20240371771
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES
- Publication number 20240363403
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE CMOS INVERTER HAVING REDUCED SIZE AND REDUCED SHOR...
- Publication number 20240363525
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20240355675
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE CMOS INVERTER HAVING TWIN CHANNELS AND ONE GATE EL...
- Publication number 20240355726
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...
- Publication number 20240339359
- Publication date Oct 10, 2024
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYER FOR INTERCONNECT STRUCTURES
- Publication number 20240332070
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VIA STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240334847
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS...
- Publication number 20240332163
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRES WITH EXPANDED SIDEWALLS
- Publication number 20240332074
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240321750
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Ryuji UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240321733
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AND METHOD FOR MANUFACTURING TRANSISTOR
- Publication number 20240321634
- Publication date Sep 26, 2024
- Sumitomo Electric Industries, Ltd.
- Yukihiro TSUJI
- H01 - BASIC ELECTRIC ELEMENTS

by selective deposition of conductive material in the vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High-throughput additively manufactured power delivery vias and traces

Semiconductor device

Methods of performing selective low resistivity Ru atomic layer dep...

Semiconductor wafer and method of wafer thinning

Semiconductor interconnection structures and methods of forming the...

Low resistance and high reliability metallization module

Interconnect structure and semiconductor device having the same

Method for manufacturing semiconductor device and substrate process...

Techniques for void-free material depositions

Bottom-up formation of contact plugs

Metallization lines on integrated circuit products

Bottom-up formation of contact plugs

Deposition method

Semiconductor device and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Method for fabricating semiconductor device with redistribution plugs

Methods for forming a metallic film on a substrate by cyclical depo...

Methods for low resistivity and stress tungsten gap fill

High aspect ratio via fill process employing selective metal deposi...

Semiconductor device having interconnection structure and method of...

Barrier-less structures

Patterning methods for semiconductor devices

Selective deposition of metal barrier in damascene processes

Methods for forming contact plugs with reduced corrosion

Forming gate line-end of semiconductor structures with improved met...

Metal line structure and method

Three dimensional MIM capacitor having a comb structure and methods...

Method for forming a structure with a hole

Method for selectively depositing a metallic film on a substrate

Semi-damascene structure with dielectric hardmask layer

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METH...

SELF-ALIGNED BUILD-UP PROCESSING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SYSTEM AND METHOD TO REDUCE LAYOUT DIMENSIONS USING NON-PERPENDICUL...

Components For Increased Power Handling

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

Interconnect Structures and Methods of Forming the Same

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

BONDING STRUCTURE AND METHOD OF FORMING SAME

PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING

SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS

BOTTOM-UP FORMATION OF CONTACT PLUGS

SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

BACK-END-OF-LINE CMOS INVERTER HAVING REDUCED SIZE AND REDUCED SHOR...

METHODS OF FORMING INTERCONNECT STRUCTURES

BACK-END-OF-LINE CMOS INVERTER HAVING TWIN CHANNELS AND ONE GATE EL...

METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...

ETCH STOP LAYER FOR INTERCONNECT STRUCTURES

VIA STRUCTURE AND METHODS OF FORMING THE SAME

THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS...

METAL WIRES WITH EXPANDED SIDEWALLS

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

TRANSISTOR AND METHOD FOR MANUFACTURING TRANSISTOR