by selective deposition of conductive material in the vias

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H01L21/76879

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76879by selective deposition of conductive material in the vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Simultaneous filling of variable aspect ratio single damascene cont...
- Patent number 12,368,095
- Issue date Jul 22, 2025
- Intel Corporation
- AKM Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 12,362,188
- Issue date Jul 15, 2025
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill-in planarization system and method
- Patent number 12,362,237
- Issue date Jul 15, 2025
- Wolfspeed, Inc.
- Simon Bubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,354,913
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 12,347,725
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming the same
- Patent number 12,347,726
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molybdenum deposition
- Patent number 12,334,351
- Issue date Jun 17, 2025
- Lam Research Corporation
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molybdenum fill
- Patent number 12,327,762
- Issue date Jun 10, 2025
- Lam Research Corporation
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor tool for copper deposition
- Patent number 12,327,715
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Void-free contact trench fill in gate-all-around FET architecture
- Patent number 12,327,761
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 12,322,649
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 12,322,699
- Issue date Jun 3, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,310,043
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,300,601
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure, and semiconductor s...
- Patent number 12,300,502
- Issue date May 13, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chenming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,300,623
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,293,969
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Ta Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 12,266,604
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having at least one via incl...
- Patent number 12,266,593
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising interconnect structures
- Patent number 12,249,518
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 12,237,216
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,218,194
- Issue date Feb 4, 2025
- SK Hynix Inc.
- Hae Jung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked vias with bottom portions formed using selective growth
- Patent number 12,211,786
- Issue date Jan 28, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,205,911
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE FILM DEPOSITION
- Publication number 20250239484
- Publication date Jul 24, 2025
- ASM IP HOLDING B.V.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233071
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-TA LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250234607
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20250226263
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BA...
- Publication number 20250226262
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT FEATURES WITH FLOATING DIELECTRIC STRUCTURE
- Publication number 20250218868
- Publication date Jul 3, 2025
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTOR, ELECTRONIC APPARATUS INCLUDING THE INTERCONNECTOR,...
- Publication number 20250218947
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Youngchul LEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210467
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising Interconnect Structures
- Publication number 20250183056
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SVIA FORMATION USING VFTL SCHEME
- Publication number 20250174549
- Publication date May 29, 2025
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250149383
- Publication date May 8, 2025
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132202
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seokkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES
- Publication number 20250125195
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIAS WITH BOTTOM PORTIONS FORMED USING SELECTIVE GROWTH
- Publication number 20250125255
- Publication date Apr 17, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FILLING METHOD
- Publication number 20250105060
- Publication date Mar 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhiqi YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF VIA FILLING
- Publication number 20250105059
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...
- Publication number 20250096036
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Asish Parbatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS
- Publication number 20250079239
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Jiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-C...
- Publication number 20250069948
- Publication date Feb 27, 2025
- LAM RESEARCH CORPORATION
- David Joseph MANDIA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT
- Publication number 20250062160
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE
- Publication number 20250054767
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...
- Publication number 20250054812
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP
- Publication number 20250054809
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...
- Publication number 20250054810
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Resistance and High Reliability Metallization Module
- Publication number 20250029874
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT LINER IN METAL FILL
- Publication number 20250022751
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Sang-Hyeob LEE
- H01 - BASIC ELECTRIC ELEMENTS

by selective deposition of conductive material in the vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Simultaneous filling of variable aspect ratio single damascene cont...

Partial barrier free vias for cobalt-based interconnects and method...

Method for preventing line bending during metal fill process

Fill-in planarization system and method

Cobalt based interconnects and methods of fabrication thereof

Contact structure for semiconductor device

Semiconductor structure with material modification and low resistan...

Interconnect structures and methods of forming the same

Molybdenum deposition

Semiconductor interconnection structures and methods of forming the...

Molybdenum fill

Semiconductor tool for copper deposition

Void-free contact trench fill in gate-all-around FET architecture

Semiconductor package having composite seed-barrier layer and metho...

Interconnect structure of semiconductor device

Method of forming high density, high shorting margin, and low capac...

Method of fabricating a semiconductor device

Interconnect structure without barrier layer on bottom surface of via

Semiconductor device with self-aligned conductive features

Interconnect structure

Method for fabricating semiconductor structure, and semiconductor s...

Integrated circuit

Semiconductor structure and manufacturing method thereof

Techniques to inhibit delamination from flowable gap-fill dielectric

Method of forming semiconductor device having at least one via incl...

Semiconductor device comprising interconnect structures

Method for filling recessed features in semiconductor devices with...

Semiconductor device and method for fabricating the same

Stacked vias with bottom portions formed using selective growth

Bonding structure and method of forming same

Patents Applicationslast 30 patents

SELECTIVE FILM DEPOSITION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Contact Structure For Semiconductor Device

FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BA...

SELF-ALIGNED INTERCONNECT FEATURES WITH FLOATING DIELECTRIC STRUCTURE

INTERCONNECTOR, ELECTRONIC APPARATUS INCLUDING THE INTERCONNECTOR,...

SEMICONDUCTOR DEVICE

Semiconductor Device Comprising Interconnect Structures

SVIA FORMATION USING VFTL SCHEME

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES

STACKED VIAS WITH BOTTOM PORTIONS FORMED USING SELECTIVE GROWTH

CONTACT FILLING METHOD

METHOD OF VIA FILLING

SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...

SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS

DEPOSITION OF METALS IN RECESSED FEATURES WITH THE USE OF HALOGEN-C...

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT

SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...

FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP

SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...

Low Resistance and High Reliability Metallization Module

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

GRADIENT LINER IN METAL FILL