Number | Name | Date | Kind |
---|---|---|---|
3663384 | Lescure | May 1972 | |
3915757 | Engel | Oct 1975 | |
3956123 | Rosenberg et al. | May 1976 | |
3966564 | Hyner et al. | Jun 1976 | |
4016305 | Wakabayashi et al. | Apr 1977 | |
4029556 | Monaco et al. | Jun 1977 | |
4049508 | Morrissey | Sep 1977 | |
4093466 | Davis | Jun 1978 | |
4162205 | Wilson et al. | Jul 1979 | |
4168223 | Igarashi et al. | Sep 1979 | |
4194913 | Davis | Mar 1980 | |
4207148 | Hsu | Jun 1980 | |
4252618 | Grenda | Feb 1981 | |
4263106 | Kohl | Apr 1981 | |
4331518 | Wilson | May 1982 | |
4347107 | Teichmann et al. | Aug 1982 | |
4459185 | Obata et al. | Jul 1984 | |
4511403 | Orio et al. | Apr 1985 | |
4530875 | Denomoto et al. | Jul 1985 | |
4645115 | Kamigaito et al. | Feb 1987 | |
4683149 | Suzuki et al. | Jul 1987 | |
4715894 | Holtzman et al. | Dec 1987 | |
4749626 | Kadija et al. | Jun 1988 |
Number | Date | Country |
---|---|---|
54-12894 | Jul 1979 | JPX |
55-11389 | Apr 1980 | JPX |
56-6599 | Mar 1981 | JPX |
1167138 | Oct 1969 | GBX |
18774 | Jun 1965 | SUX |
Entry |
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"Repressing the Growing of Tin Whiskers," Plating, Jan. 1966, pp. 96-99. |
"Tin-Lead Electrodeposits: The Effect of Impurities in the Solution," Plating, Apr. 1970, pp. 369-371. |
"Spontaneous Growth of Tin Whiskers on Tin Coatings: 20 Years of Observation," Transactions of the Institute of Metal Finishings, vol. 52, 1974, pp. 95-102. |