J. Intrater, “Review of Some Processes For Ceramic-To-Metal Joining”, Materials & Manufacturing Processes, 8(3), 353-373 (1993). |
“Sputtering Target Bonding”, ATI Materials. “A New Direction In Surface Analysis”, TTS 100 Oryx Technology Corporation. |
“Electromagnet Systems”, ATI Magnetics. “SurgX™ ESD Protection On Board”, Oryx Technology Corporation, Feb. 1995. |
James Intrater, “Intragene™ Metallization On 96% A1203 And A1N: Solder Pull Strength Data”, pp 1-3, Oryx Technology Corporation. |
James Intrater, “Intragene™ Metallization On CVD-Diamond Coated Si3N4”, pp 1-3, Oryx Technology Corporation. |
James Intrater. “The Challenge of Bonding Metals to Ceramics”, Technical Bulletin, Ceramic/Metal Bonding, Advanced Technology, Inc., Reprinted from Machine Design Nov. 23, 1989. |
James Intrater, “How to Select the Right Metallization/Joining Method”, Advanced Technology, Inc., Reprinted from Ceramic Industry Feb. 1991, Business News Publishing Company. |