Claims
- 1. A method of forming a single level interconnection, said method comprising the steps of:
- forming first and second windows in an electrically isolating film; and thereafter
- forming a plurality of electrically conductive strips on said film, said strips being formed with first end portions thereof cantilevered over said first windows and second end portions thereof cantilevered over said second windows.
- 2. Method as claimed in claim 1 further comprising the step of:
- forming, along the edges of said film, a sprocket pattern, said sprocket pattern including rows of regularly spaced openings.
- 3. Method as claimed in claim 1 wherein said strip forming step includes:
- disposing a layer of conductive material on said film having said first and second windows therein; and thereafter
- defining said plurality of conductive strips.
Parent Case Info
This application is a division of application Ser. No. 07/198,719, filed May 24, 1988, now U.S. Pat. No. 4,866,504, which is a continuation of application Ser. No. 06/859,940, filed May 05, 1986, now abandoned.
US Referenced Citations (5)
Divisions (1)
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198719 |
May 1988 |
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Continuations (1)
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859940 |
May 1986 |
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