by inserting component lead or terminal into base aperture

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CPC
Y10T29/49139

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49139by inserting component lead or terminal into base aperture

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 12,126,147
- Issue date Oct 22, 2024
- Legrand DPC, LLC
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for inspecting insertion states of plurality of pins include...
- Patent number 11,547,033
- Issue date Jan 3, 2023
- Koh Young Technology Inc.
- Dae Sung Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 11,394,179
- Issue date Jul 19, 2022
- Server Technology, Inc.
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component mounting method and method for manufacturing component-mo...
- Patent number 11,013,160
- Issue date May 18, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tetsuya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounter
- Patent number 11,013,161
- Issue date May 18, 2021
- FUJI CORPORATION
- Daisuke Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component-mounted substrate
- Patent number 11,006,560
- Issue date May 11, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 10,798,823
- Issue date Oct 6, 2020
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 10,777,977
- Issue date Sep 15, 2020
- Server Technology, Inc.
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component chuck device and component mounting device
- Patent number 10,687,450
- Issue date Jun 16, 2020
- FUJI CORPORATION
- Junichi Yamamuro
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 10,492,350
- Issue date Nov 26, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Yokoyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 10,348,063
- Issue date Jul 9, 2019
- Server Technology, Inc.
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Filtered feedthrough assembly for implantable medical electronic de...
- Patent number 10,306,748
- Issue date May 28, 2019
- Cardiac Pacemakers, Inc.
- Patrick J. Barry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for mounting electronic component
- Patent number 9,992,918
- Issue date Jun 5, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a microphone unit and a microphone unit
- Patent number 9,980,025
- Issue date May 22, 2018
- Peiker Acustic GmbH & Co. KG
- Michael Klose
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lead wire cut-and-clinch apparatus
- Patent number 9,949,420
- Issue date Apr 17, 2018
- Fuji Machine Mfg. Co., Ltd.
- Kaname Asao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of affixing a group of elastic filaments to an electronic co...
- Patent number 9,907,185
- Issue date Feb 27, 2018
- International Business Machines Corporation
- Phillip V. Mann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction element with at least one electronic component and ass...
- Patent number 9,874,339
- Issue date Jan 23, 2018
- LED IBOND INTERNATIONAL APS
- Lars Frederiksen
- F21 - LIGHTING
Information Patent Grant
Tin fusion joining for robust integration of electrical components...
- Patent number 9,872,396
- Issue date Jan 16, 2018
- GM Global Technology Operations LLC
- Evan J. Dawley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting electronic component
- Patent number 9,867,320
- Issue date Jan 9, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse oximetry devices and systems and methods of making the same
- Patent number 9,814,419
- Issue date Nov 14, 2017
- General Electric Company
- Jason Harris Karp
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Sensor for wear measurement, method for making same, and method for...
- Patent number 9,791,348
- Issue date Oct 17, 2017
- David L. Carnahan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe-based system-in-packages having sidewall-mounted surface...
- Patent number 9,761,569
- Issue date Sep 12, 2017
- NSP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with embedded component and method for manufa...
- Patent number 9,730,328
- Issue date Aug 8, 2017
- Qi Ding Technology Qinhuangdao Co., Ltd.
- Shih-Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Processor loading system
- Patent number 9,705,264
- Issue date Jul 11, 2017
- Dell Products L.P.
- Lawrence Alan Kyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component mounting method which fits and pushes component on substrate
- Patent number 9,699,945
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuyuki Ishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric element-embedded multilayer substrate and method for manuf...
- Patent number 9,699,892
- Issue date Jul 4, 2017
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-terminal capacitor
- Patent number 9,628,052
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Hong Bok We
- G05 - CONTROLLING REGULATING
Information Patent Grant
Heat radiation structure of electric device and method for manufact...
- Patent number 9,622,383
- Issue date Apr 11, 2017
- Denso Corporation
- Takahiro Yamanaka
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE INPUT POWER DISTRIBUTION TO ADJAC...
- Publication number 20230187912
- Publication date Jun 15, 2023
- SERVER TECHNOLOGY, INC.
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE INPUT POWER DISTRIBUTION TO ADJAC...
- Publication number 20210036494
- Publication date Feb 4, 2021
- SERVER TECHNOLOGY, INC.
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20200187358
- Publication date Jun 11, 2020
- IMBERATEK, LLC
- Antti Iihola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE INPUT POWER DISTRIBUTION TO ADJAC...
- Publication number 20190386468
- Publication date Dec 19, 2019
- SERVER TECHNOLOGY, INC.
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FILTERED FEEDTHROUGH ASSEMBLY FOR IMPLANTABLE MEDICAL ELECTRONIC DE...
- Publication number 20180077791
- Publication date Mar 15, 2018
- Cardiac Pacemakers, Inc.
- Patrick J. Barry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
GUARDED PRINTED CIRCUIT BOARD ISLANDS
- Publication number 20140376201
- Publication date Dec 25, 2014
- James A. Niemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140353017
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Kota NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBE CARD
- Publication number 20140347085
- Publication date Nov 27, 2014
- Yung-Hsin KUO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...
- Publication number 20140345124
- Publication date Nov 27, 2014
- ROBERT BOSCH GmbH
- Patrik PATZNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20140321069
- Publication date Oct 30, 2014
- Naoki Gouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THERE...
- Publication number 20140321084
- Publication date Oct 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Interface Module and Dual Interface Card Having a Dual Interfa...
- Publication number 20140307405
- Publication date Oct 16, 2014
- Werner Vogt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM
- Publication number 20140298649
- Publication date Oct 9, 2014
- PANASONIC CORPORATION
- Yasuyuki Ishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
- Publication number 20140298648
- Publication date Oct 9, 2014
- Samsung Electro-mechanics Co., Ltd.
- Hong Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT
- Publication number 20140283381
- Publication date Sep 25, 2014
- Fujitsu Limited
- Yoko MURATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Transmitter for Securement to a Panel
- Publication number 20140285958
- Publication date Sep 25, 2014
- Endress + Hauser Conducta Gesellschaft fur Mess- und Regeltechnik mbH + Co. KG
- Robert Tamegger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140268780
- Publication date Sep 18, 2014
- Power Gold LLC
- James Jen-Ho WANG
- F21 - LIGHTING
Information Patent Application
COMPONENT HOLDING STRUCTURES, SYSTEM, AND METHOD
- Publication number 20140268608
- Publication date Sep 18, 2014
- GENERAL ELECTRIC COMPANY
- Mark Alan Haisler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS EMBEDDED THERE...
- Publication number 20140247570
- Publication date Sep 4, 2014
- Doau-Tzu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extrusion Process for Manufacturing a Z-Directed Component for a Pr...
- Publication number 20140237816
- Publication date Aug 28, 2014
- Lexmark International, Inc.
- Paul Kevin Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140233199
- Publication date Aug 21, 2014
- FUJIKURA LTD.
- Koji Munakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION STRUCTURE OF ELECTRIC DEVICE AND METHOD FOR MANUFACT...
- Publication number 20140218869
- Publication date Aug 7, 2014
- DENSO CORPORATION
- Takahiro YAMANAKA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY
- Publication number 20140218883
- Publication date Aug 7, 2014
- Eagantu Ltd.
- Michael Dakhiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE COMPONENT ASSEMBLY
- Publication number 20140211444
- Publication date Jul 31, 2014
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20140211439
- Publication date Jul 31, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20140202739
- Publication date Jul 24, 2014
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140202741
- Publication date Jul 24, 2014
- FUJIKURA LTD.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFA...
- Publication number 20140185257
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- SHIH-PING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140182916
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yee Na SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD O...
- Publication number 20140182896
- Publication date Jul 3, 2014
- SAMSUNG, ELECTRO-MECHANICS CO., LTD.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS

by inserting component lead or terminal into base aperture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for multiple input power distribution to adjac...

Method for manufacturing an electronic module and electronic module

Method for inspecting insertion states of plurality of pins include...

Method and apparatus for multiple input power distribution to adjac...

Component mounting method and method for manufacturing component-mo...

Electronic component mounter

Method of manufacturing component-mounted substrate

Method for manufacturing an electronic module and electronic module

Method and apparatus for multiple input power distribution to adjac...

Component chuck device and component mounting device

Electronic component mounting method and electronic component mount...

Method and apparatus for multiple input power distribution to adjac...

Filtered feedthrough assembly for implantable medical electronic de...

Method for mounting electronic component

Method for producing a microphone unit and a microphone unit

Lead wire cut-and-clinch apparatus

Method of affixing a group of elastic filaments to an electronic co...

Construction element with at least one electronic component and ass...

Tin fusion joining for robust integration of electrical components...

Apparatus for mounting electronic component

Preparation method of a thin power device

Pulse oximetry devices and systems and methods of making the same

Sensor for wear measurement, method for making same, and method for...

Leadframe-based system-in-packages having sidewall-mounted surface...

Printed circuit board with embedded component and method for manufa...

Processor loading system

Component mounting method which fits and pushes component on substrate

Electric element-embedded multilayer substrate and method for manuf...

Embedded multi-terminal capacitor

Heat radiation structure of electric device and method for manufact...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR MULTIPLE INPUT POWER DISTRIBUTION TO ADJAC...

METHOD AND APPARATUS FOR MULTIPLE INPUT POWER DISTRIBUTION TO ADJAC...

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

METHOD AND APPARATUS FOR MULTIPLE INPUT POWER DISTRIBUTION TO ADJAC...

FILTERED FEEDTHROUGH ASSEMBLY FOR IMPLANTABLE MEDICAL ELECTRONIC DE...

GUARDED PRINTED CIRCUIT BOARD ISLANDS

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

TEST PROBE CARD

METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...

HIGH-FREQUENCY MODULE

PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THERE...

Dual Interface Module and Dual Interface Card Having a Dual Interfa...

COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...

METHOD OF MOUNTING ELECTRONIC COMPONENT

Method and Transmitter for Securement to a Panel

FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

COMPONENT HOLDING STRUCTURES, SYSTEM, AND METHOD

CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS EMBEDDED THERE...

Extrusion Process for Manufacturing a Z-Directed Component for a Pr...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

HEAT RADIATION STRUCTURE OF ELECTRIC DEVICE AND METHOD FOR MANUFACT...

ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

DISCRETE COMPONENT ASSEMBLY

CIRCUIT ASSEMBLY

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFA...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD O...