Claims
- 1. A printed wiring board comprising a substrate; a photo imaginable dielectric layer coated onto the substrate, wherein at least a portion of the dielectric layer is cross-linked and wherein the cross-linked portion has a toner adhered thereto, wherein the toner comprises a member selected from the group consisting of silver and silver alloys.
- 2. The printed wiring board of claim 1, further comprising an electrical ground plane layer between the substrate and the dielectric layer, wherein the ground plane layer acts as an anti-static layer.
- 3. The printed wiring board of claim 1 wherein the toner has a layer of copper adhered thereto.
- 4. The printed wiring board of claim 1 wherein the toner layer is between about 0.1 micron and about 100 microns thick.
- 5. The printed wiring board of claim 1 wherein the toner has a layer of copper adhered thereto, and wherein the copper layer is between about 0.1 micron and about 100 microns thick.
- 6. The printed wiring board of claim 1 wherein the substrate is selected from the group consisting of an electrically conductive material, a paper sheet, a metal foil, an ITO-coated polymeric film, and a mica containing laminate material.
- 7. The printed wiring board of claim 1 wherein the dielectric layer comprises a photo-polymeric material.
RELATED U.S. APPLICATION DATA
This application claims the benefit of U.S. Provisional Application 60/172,618, filed Dec. 20, 1999.
US Referenced Citations (13)
Provisional Applications (1)
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Number |
Date |
Country |
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60/172618 |
Dec 1999 |
US |