Claims
- 1. A method of manufacturing a chip inductor comprising:
- (a) forming a winding core;
- (b) winding a conducting wire around said winding core;
- (c) coating both said winding core and said conducting wire with an external cover member.
- 2. A method of manufacturing a chip inductor according to claim 1, further comprising the step of cutting the sintered product obtained by step (d) into pieces, each piece having a predetermined length suitable for a chip inductor.
- 3. A method of manufacturing a chip inductor according to claim 1, wherein the external cover member is formed by extruding a kneaded material onto both the winding core and the conducting wire.
- 4. A method of manufacturing a chip inductor according to claim 3, wherein the winding core is formed by extruding, and the conducting wire is wound around the extruded winding core.
- 5. A method of manufacturing a chip inductor according to claim 4, further comprising the step of sintering the combination of the extruded external cover member and the extruded winding core to form a sintered product.
- 6. A method of manufacturing a chip inductor according to claim 1, further comprising the step of baking the electrically conductive paste.
- 7. A method of manufacturing a chip inductor according to claim 1, wherein the electrically conductive paste comprises silver powder and solvent.
- 8. A method of manufacturing a chip inductor comprising:
- (a) forming a winding core;
- (b) winding a conducting wire around said winding core;
- (c) forming an external cover member on both said winding core and said conducting wire such that a clearance is formed between said winding core and said external cover member;
- (d) coating an electrically conductive paste on said combined winding core and external cover member so that said paste enters the clearance and is brought into contact with end portions of the conducting wire.
- 9. A method of manufacturing a chip inductor according to claim 8, wherein the external cover member is sintered, and is formed by placing the sintered external cover member on both said winding core and said conducting wire in step (c).
- 10. A method of manufacturing a chip inductor according to claim 8, wherein the external cover member is formed by extruding a kneaded material onto both the winding core and the conducting wire.
- 11. A method of manufacturing a chip inductor according to claim 10, wherein the winding core is formed by extruding, and the conducting wire is wound around the extruded winding core.
- 12. A method of manufacturing a chip inductor according to claim 11, further comprising the step of sintering the combination of the extruded external cover member and the extruded winding core to form a sintered product.
- 13. A method of manufacturing a chip inductor according to claim 12, further comprising the step of cutting the sintered product into pieces, each piece having a length suitable for a chip inductor.
- 14. A method of manufacturing a chip inductor according to claim 8, further comprising the step of baking the electrically conductive paste.
- 15. A method of manufacturing a chip inductor according to claim 8, wherein the electrically conductive paste comprises silver powder and solvent.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-105927 |
Apr 1995 |
JPX |
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Parent Case Info
This application is a divisional application of U.S. patent application Ser. No. 08/917,339 filed on Aug. 25, 1997, which is a continuation application of U.S. patent application Ser. No. 08/613,626, filed on Mar. 11, 1996, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4696100 |
Yamamoto |
Sep 1987 |
|
4842352 |
Sasaki et al. |
Jun 1989 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
58-48410 |
Mar 1983 |
JPX |
0151407 |
Aug 1984 |
JPX |
6-5427 |
Jan 1994 |
JPX |
7-74024 |
Mar 1995 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
917339 |
Aug 1997 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
613626 |
Mar 1996 |
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