The present disclosure relates to the subject matter contained in Japanese Patent Application No.2002-373379 filed on Dec. 25, 2002, which is incorporated herein by reference in its entirety.
1. Field of the Invention
The present invention relates to a plasma display panel manufacturing method and a heat treatment apparatus.
2. Description of the Related Art
First, the structure of a common plasma display panel (referred to below as a PDP) will be described below as an example of a plasma display panel.
In
On the other hand, partition walls 9 and phosphor layers 7R, 7G, and 7B of the three primary colors are formed on a back-side back glass panel 5, which is disposed so as to face the front panel 1 via the discharge space 8. The partition walls 9 are aligned in a direction orthogonal to the row electrode pairs 2 (X, Y), are disposed in bands between column electrodes 6 to form a display cell at each intersection portion, and partition a discharge space 8. The phosphor layers 7R, 7G and 7B of the three primary colors are disposed so as to cover the column electrodes 6 and side surfaces of the partition walls 9 with respect to the discharge space 8. A noble gas is charged and sealed inside the discharge space 8.
As shown in
Next, the display operation of the display in the above PDP will be described.
First, ON cells (cells in which a wall charge is formed) and OFF cells (cells in which a wall charge is not formed) are selected by an address operation resulting from selective discharge between the column electrodes 6 and the row electrode pairs 2 (X, Y) shown in
[Patent Document 1]
JP-A-11-149873 (p. 2,
In the process of manufacturing a PDP such as the one described above, a heat treatment step is included in part of a formation step of a structure such as the electrodes, the partition walls, the phosphor layers, the dielectric layer and a black stripe layer. For instance, in the formation step of the dielectric layer, a glass paste including a mixture of glass powder, resin and a solvent is coated on a substrate, and the coated substrate is heat treated using a heat treatment apparatus such as a kiln.
A method of discharging exhaust gas of the heat treatment apparatus used in the heat treatment step will be described using the schematic diagram of
As shown in
Thus, in the heat treatment step during the manufacture of the PDP, although resin components and solvent components are vaporized and removed at the time of the heat treatment, they are included as impurities in the exhaust gas 112 of the heat treatment apparatus 110. There is the potential for them to be diffused to the outside (the atmosphere) when they are discharged from the exhaust pipes 111.
Eliminating the problem occurring in the aforementioned prior art—i.e., preventing the diffusion to the outside (the atmosphere) of impurities generated in a heat treatment step during the manufacture of a PDP-can be given as one example of the problem that the invention attempts to solve.
In order to achieve this object, according to a first aspect of the invention, a plasma display panel manufacturing method includes forming a structure, wherein the forming of the structure includes forming a precursor layer containing at least one of a resin component and a solvent component on a substrate, and heat-treating the substrate on which the precursor layer has been formed; and decomposing impurities included in exhaust gas generated in the heat treatment by action of a catalyst.
Also, according to a second aspect of the invention, a heat treatment apparatus is used in a heat treatment where a substrate on which a precursor layer including at least one of a resin component and a solvent component is formed, is heat-treated. The heat treatment apparatus includes a catalyst unit including a catalyst disposed on an exhaust path where an exhaust gas generated in the heat treatment is discharged.
An embodiment of the invention will be described in detail below with reference to the drawings.
A plasma display panel (PDP) manufacturing method according to the embodiment of the invention includes a heat treatment step, such as drying, calcinating or baking, in part of a formation step of a structure (structure formation step) of electrodes, partition walls, phosphor layers, a dielectric layer or a black stripe layer (outside light reflection prevention layer) of the PDP. The heat treatment step is one in which a paste-like material layer (a precursor layer including a resin component and/or a solvent component) that is formed on a substrate and serves as a structure are heat-treated by a heat treatment apparatus (a drying furnace, a kiln or a baking furnace).
The present embodiment is characterized in that impurities are removed and discharged from exhaust gas including a resin component and a solvent component generated in the heat treatment step. A heat treatment apparatus and a method of discharging the exhaust gas, which are characteristics of the present embodiment, will be described in detail below with reference to the drawings.
As shown in
As shown in
It should be noted that, although there are three systems of exhaust paths in the present embodiment, the number of exhaust paths, the number of disposed exhaust pipes and the number of disposed catalyst units can be made optional.
Also, the first exhaust pipes 11, the catalyst units 13 and the second exhaust pipes 14 in the exhaust paths may be respectively disposed at optional angles as long as the exhaust gas is capable of being discharged.
In the present embodiment, because the exhaust paths of the heat treatment apparatus 10 are configured as described above, a chemical reaction with respect to impurities included in the exhaust gases 12 flowing into each of the first exhaust pipes 11 is accelerated by catalysts of the catalyst units 13. As a result, the impurities included in the exhaust gases 12 are decomposed, become harmless exhaust gases 15 (e.g., water vapor and carbon dioxide) and are discharged to the outside (e.g., the atmosphere) of the heat treatment apparatus 10.
It should be noted that it is preferable to administer a heating/protective countermeasure for preventing condensation at the vicinities (particularly portions disposed substantially horizontally) of the first exhaust pipes 11.
Examples of the structure formation step in the PDP manufacturing method of the present embodiment include a bus electrode formation step, a partition wall formation step, a phosphor layer formation step and a black stripe layer (outside light reflection prevention layer) formation step.
The bus electrode formation step is, for example, a step where a glass paste including a mixture of silver powder, glass powder, resin and a solvent is coated to form a precursor layer having a dielectric layer, the dielectric layer precursor layer is transferred to a substrate, and this is calcinated thereafter.
Also, the partition wall formation step is, for example, a step where a glass paste including a mixture of glass powder, resin and a solvent is coated as a thick film on a substrate and dried, sandblasted via a predetermined mask, and this is calcinated thereafter.
Also, the phosphor layer formation step is, for example, a step where a phosphor paste including a mixture of phosphor powder, resin and a solvent is filled and coated between partition walls, and this is calcinated thereafter.
Also, the black stripe layer (outside light reflection prevention layer) formation step is, for example, a step where black paste including a mixture of an inorganic black pigment, resin and a solvent is coated between bus electrodes forming non-display lines, and this is calcinated thereafter.
As shown in
In the case of this example configuration, the untreated exhaust gas 12 flowing in from the pipe connector 17a connected to the first exhaust pipe 11 is first warmed by the exhaust heating heater 18 to a suitable temperature so that it easily reacts due to the action of the catalyst. Next, impurities whose volume is large, such as mist, are removed by the filter 19. Finally, in the catalyst 20, the impurities chemically react due to the action of the catalyst 20, are changed to harmless substances, and discharged from the second exhaust pipe 14 to the outside as the purified exhaust gas 15.
It should be noted that the exhaust heating heater 18 and the filter 19 do not always have to be used and may be used as needed.
Next, a table in which the properties of various catalysts are structurally/compositionally-distinguished and compared will be shown in
As shown in
Examples of the metal honeycomb catalyst include a catalyst in which a catalyst-active substance such as a platinum group is added to a honeycomb structure of a metal (Fe—Cr—Al) that is a catalyst base material.
Other examples include a ceramic honeycomb structure of SiO2—Al2O3—MgO and a pellet structure of r-Al2O3.
The structure of the catalyst of the honeycomb structure will be described using
Additionally, as shown in
Next, a Graph (a) of purified properties (degree of purification with respect to catalyst inlet gas temperature) when the various substances included in the untreated exhaust gas 12 have been purified using the metal honeycomb catalyst and a Table (b) of the concentration and space velocity of the various substances are shown in
It should be noted that the numbers added to Graph (a) in
Next, the degrees to which the various impurities (gas components) were purified by the catalyst unit 13 of the present embodiment are shown in Table 1 in accordance with the treatment conditions thereof in regard to examples where the exhaust gas components (toluene, n-hexane, ethyl oxide, styrene monomer, formalin) were measured.
Catalyst used: KT301; degree of purification measured by gas-chromatography; catalyst layer about 15 ml.
With respect to the measurements of Table 1, KT301 (Pt pellet catalyst in which the diameters of the pellets were 2 to 4 mm) was used as the catalyst, and the degree of purification was measured by gas-chromatography under a condition in which the amount of the catalyst was about 15 ml.
Also, a platinum (Pt) group is preferable for the catalyst-active substance used for the catalyst, and examples thereof include Pt, Pd, Ru, Rh, Ir and Os.
As shown in
Moreover, the effectiveness according to the various reactions relating to the platinum (Pt) group catalysts is shown in Table 2.
In
Next, results where manufacture was conducted by the PDP manufacturing method according to the present embodiment and the amounts of various gases (impurities) discharged to the outside (the atmosphere) from the second exhaust pipe 14 were measured before and after introducing the catalyst 20 to the catalyst unit 13 of the heat treatment apparatus 10 are shown in Table 3 (before introducing the catalyst) and Table 4 (after introducing the catalyst).
It should be noted that GV-100S+NO. 340 (gas sampler and hot probe manufactured by GASTEC Corporation) was used for the measurements of Table 3 and Table 4 and that a detector tube manufactured by GASTEC Corporation was used for the gas detector tube.
As shown in the measurement results of Table 3, impurities (higher hydrocarbons, acetone, ethyl oxide and styrene) included in the exhaust gas were detected before the introduction of the catalyst. However, as shown in the measurement results of Table 4, when the catalyst was used, impurities (higher hydrocarbons, acetone, ethyl oxide and styrene) included in the exhaust gas were not detected.
As described in detail above, in the present embodiment, the PDP manufacturing method includes forming a structure, wherein the forming of the structure includes forming a precursor layer containing at least one of a resin component and a solvent component on a substrate, and heat-treating the substrate on which the precursor layer has been formed; and decomposing impurities included in exhaust gas generated in the heat treatment by action of a catalyst. Thus, for example, impurities generated in the heat treatment when a structure such as, for example, an electrode, a partition wall, a phosphor layer, a dielectric layer and an outside light reflection prevention layer of a PDP are formed can be purified and discharged to the outside (the atmosphere).
Also, according to the heat treatment apparatus 10 of the present embodiment, the heat treatment apparatus 10 is used in a heat treatment where a substrate, on which is formed a precursor layer including at least one of a resin component and a solvent component, is heat-treated. The catalyst units 13 including the catalyst 20 are disposed on exhaust paths where exhaust gases generated in the heat treatment step are discharged. Thus, by using the heat treatment apparatus 10 in the heat treatment when a structure such as, for example, an electrode, a partition wall, a phosphor layer, a dielectric layer and an outside light reflection prevention layer of a PDP are formed, impurities generated in the heat treatment of these can be purified and discharged to the outside (the atmosphere).
Number | Date | Country | Kind |
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P. 2002-373379 | Dec 2002 | JP | national |
Number | Name | Date | Kind |
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20050118810 | Harada et al. | Jun 2005 | A1 |
Number | Date | Country |
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11-149873 | Jun 1999 | JP |
2004316987 | Nov 2004 | JP |
2005228682 | Aug 2005 | JP |
Number | Date | Country | |
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20040180601 A1 | Sep 2004 | US |