Claims
- 1. A method of manufacturing an ink jet print head having a plurality of different members, which comprises the steps of:
- producing a plurality of different members by parallel processing individual plates including a first chamber-carrying member, a center member, and a second chamber-carrying member;
- forming orifices including through openings in the first chamber-carrying member, the center member, and the second-chamber carrying member via masking and etching processes;
- forming chambers in the first chamber-carrying member and the second chamber-carrying member via masking and etching processes;
- forming nozzle openings in at least one of the first chamber-carrying member, the center member and the second chamber carrying member via masking and etching processes;
- connecting the first chamber-carrying member and the second chamber-carrying member to the center member by annealing for forming at least one print head module; and
- applying at least one conductor path and piezo-electrical elements to the at least one print head module and electrically connecting the piezo-electrical elements with the at least one conductor path applied to the at least one print head module for forming an ink jet print head.
- 2. The method according to claim 1, which comprises, prior to the processing step, preparing masks and pretreating the individual plates by removing from the individual plates areas for the chambers including ink chambers and suction chambers, for the nozzle openings, and for the through openings including supply conduits, by exposing the individual plates to ultraviolet radiation and subsequently heat-treating, and then etching areas of the individual plates from which material is to be removed.
- 3. The method according to claim 2, which comprises, in the pretreating step, exposing all areas from which material is to be removed to ultraviolet light of substantially identical wavelength and intensity, applying a first mask to the plate prior to etching photo-sensitized areas of the plate, etching first areas of the plate, subsequently removing the first mask, subsequently applying a second mask and etching second areas of the plate, subsequently removing the second mask and etching third areas of the plate.
- 4. The method according to claim 3, which comprises using etchant of respectively different concentrations in etching the first, second and third areas, for removing material from the areas with respectively different depth accuracy, and choosing a relatively lower depth accuracy for etching the through openings as compared to etching very flat areas for ink channels in the chamber-carrying members, and etching the through openings first, etching the chambers second, and etching the nozzle openings third.
- 5. The method according to claim 2, which comprises, in the pretreating step, applying different masks on the individual plates, exposing given areas of the plate to more frequent and/or more intense ultraviolet radiation of a given wavelength than other areas of the plate for creating areas of different sensitivity to the etchant, applying masks with regard to areas where plate material is to be removed to different depths, and using an etchant of a certain concentration in the etching step.
- 6. The method according to claim 1, which comprises, performing an etching step and continuously observing a thickness of a floor layer of chambers of the chamber-carrying members being etched, and subsequently precision smoothing the chamber-carrying members for obtaining a final thickness of the floor layers of each of the etched-out chambers.
- 7. The method according to claim 1, which comprises, subsequently to the processing step, separating individual components including the first chamber-carrying member, the center member and the second chamber-carrying member from the plate and further processing the individual components separately.
- 8. The method according to claim 7, which comprises, subsequently to etching through openings in all components, separating the components, precision smoothing surfaces of the chamber-carrying members, masking given areas of the surfaces of the chamber-carrying members, and depth etching areas of the surfaces which are not masked, forming recesses and/or ink chambers in the chamber-carrying members, precision smoothing at one surface for obtaining a desired depth of the ink chambers, and precision smoothing at an opposite surface for exactly adjusting a desired thickness of a floor layer of the ink chamber, removing the mask used in the depth etching step by means of precision smoothing, and finally etching the ink nozzles.
- 9. The method according to claim 8, which comprises, in the etching of the ink nozzles, removing essentially only photo-sensitive plate material.
- 10. The method according to claim 8, which comprises applying a third mask prior to the etching of the ink nozzles.
- 11. The method according to claim 1, which comprises photo-sensitizing given areas of the individual plates to respectively different degrees of etching sensitivity, subsequently forming recesses, chambers and through openings concurrently in one step at different etching speeds caused by the different sensitivity of the respective areas, then separating the plate into components after a required depth of the recesses and chambers is obtains, and subsequently etching ink nozzle openings into individual chamber members.
- 12. The method according to claim 11, which includes etching dividing lines into the plate for simplifying the separation of the plate into the components.
- 13. The method according to claim 1, which comprises etching nozzle openings into a chamber-carrying member, arranging individual plate parts including chamber-carrying members and center members into a module, aligning the components, durably affixing the components to one another, cutting an edge face of the module into which the nozzle openings formed and subsequently precision smoothing the edge face for creating an even surface along the edge face with the nozzle openings, applying a hydrophilic inner film on surfaces of cavities formed in the module by flushing the cavities with a first liquid, applying a hydrophobic outer film on even surfaces along the edge face with the nozzle openings, and subsequently hardening the inner and outer films.
- 14. The method according to claim 13, which comprises providing a plate material for forming the components of amorphous, photo-sensitive glass, annealing the components in the durably affixing step and chosing a temperature in the annealing step which causes a phase transition in the glass from amorphous to crystalline.
- 15. The method according to claim 13, which comprises, subsequently to the applying steps, attaching piezo-electrical elements including piezo electric crystals to at least one of a base of the chambers formed in the module and an outer surface of a bottom layer of the chambers formed in the module, and electrically connecting the piezo-electric crystals.
- 16. The method according to claim 15, which comprises affixing the piezo-electric crystals with an adhesive and hardening the adhesive connection.
- 17. The method according to claim 15, which comprises sputtering conductor tracks on the chamber carrying members in the electrically connecting step.
- 18. The method according to claim 15, which comprises sputtering a piezo-electric layer onto the chamber-carrying members in the attaching step, and structuring the piezo-electric layer.
- 19. The method according to claim 15, which compresses applying electric conductor paths onto the center members for obtaining crossover-free conductor paths.
- 20. The method according to claim 1, which comprises assembling individual modules with at least one spacer member disposed therebetween to form an ink jet print head, mounting the ink jet print head in a casing and providing electrical connections to the ink jet print head.
- 21. The method according to claim 20, which comprises producing the at least one spacer member by applying a layer of piezo-electric material on a surface of the plate, and structuring the layer of piezo-electric material by means of etching.
- 22. The method according to claim 20, which comprises producing the at least one spacer member from the individual plates.
- 23. The method according to claim 22, which comprises producing the at least one spacer member from the individual plates during the parallel processing step and prior to separating the components.
- 24. The method according to claim 1, which comprises assembling an ink jet print head from a plurality of chamber-carrying members and center members, mounting the ink jet print head in a casing and providing electrical connections to the ink jet print head.
- 25. The method according to claim 24, which comprises forming nozzle openings in one of the chamber-carrying members, and cleansing the nozzle openings with compressed air subsequently to assembling the ink jet print head.
- 26. The method according to claim 24, which comprises operatively testing the assembled ink jet print head and separating out defective ink jet print heads.
- 27. The method according to claim 1, which comprises forming nozzle openings in one of the chamber-carrying members, and cleansing the nozzle openings with compressed air subsequently to forming the print head module.
- 28. The method according to claim 1, which comprises performing the processing step with a photo-sensitive ceramic material and providing a second individual plate composed of photo-sensitive, amorphous glass, forming at least one component of the module of the glass material, and assembling the module with adhesive.
- 29. The method according to claim 1, which comprises performing the processing step with a photo-sensitive ceramic material and providing a second individual plate composed of photo-sensitive, amorphous glass, forming at least one component of the module of the ceramic material, and assembling the module with adhesive.
- 30. A method of manufacturing an ink jet print head having a plurality of different members, which comprises the steps of:
- producing a plurality of different members by parallel processing individual plates including a first chamber-carrying member, a center member, and a second chamber-carrying member;
- forming orifices including continuous openings, chambers and recesses in the different members, carrying out the forming step by removing and applying masks at areas where plate material is to be removed to form different depths in the different members, by etching with an etchant of a given concentration;
- connecting the first chamber-carrying member and the second chamber-carrying member to the center member by annealing for forming at least one print head module; and
- applying at least one conductor path and piezo-electrical elements to the at least one print head module and electrically connecting the piezo-electrical elements with the at least one conductor path applied to the at least one print head module forming an ink jet print head.
- 31. A method of manufacturing an ink jet print head having a plurality of different members, which comprises the steps of:
- producing a plurality of different members by parallel processing individual plates including a first chamber-carrying member, a center member, and a second chamber-carrying member;
- removing and applying masks to the different members formed from the individual plates and depth etching those areas of the different members which are not masked using an etchant of a given concentration to remove different layers of plate material to form continuous openings, ink chambers, chambers and recesses in the different members in a single main step;
- separating the individual plates forming the first chamber-carrying member, the center member and the second chamber-carrying member from each other;
- connecting the first chamber-carrying member and the second chamber-carrying member to the center member by annealing forming at least one print head module; and
- applying at least one conductor path and piezo-electrical elements to the at least one module and electrically connecting the piezo-electrical elements with the at least one conductor path applied to the at least one print head module forming an ink jet print head.
- 32. A method of manufacturing an ink jet print head having a plurality of different members, which comprises the steps of:
- producing a plurality of different members by parallel processing individual plates including a first chamber-carrying member, a center member, and a second chamber-carrying member;
- removing and applying masks to the different members formed from the individual plates and depth etching those areas of the different members which are not masked using an etchant of a given concentration to remove different layers of plate material to form continuous openings, chambers and recesses in the different members;
- applying at least one conductor path and piezo-electrical elements to the different members and electrically connecting the piezo-electrical elements with the at least one conductor path;
- separating the individual plates forming the first chamber-carrying member, the center member and the second chamber-carrying member from each other; and
- adhering the first chamber-carrying member and the second chamber-carrying member to the center member by an adhesive forming an ink jet print head.
- 33. A method of manufacturing an ink jet print head having a plurality of different members, which comprises the steps of:
- producing a plurality of different members by parallel processing individual plates including a first chamber-carrying member, a center member, and a second chamber-carrying member;
- forming through openings in the first chamber-carrying member, the center member and the second chamber-carrying member, via masking and etching processes;
- separating and dividing up the individual plates from each other into the first chamber-carrying member, the center member and the second chamber-carrying member;
- forming at least one chamber in the first and second chamber-carrying members, with forming steps which include masking, etching, and precision smoothing processes;
- carrying out the masking step by removing an old mask layer and applying a new mask to the first and second chamber-carrying members which have the structure of the at least one chamber;
- carrying out the etching step by exposing a photo-sensitive plate of amorphous glass to UV radiation and then etching the irradiated glass areas using an etchant of a certain concentration, where plate material is to be removed to different depths;
- carrying out the precision smoothing steps until a final depth is achieved;
- connecting the first chamber-carrying member and the second chamber-carrying member to the center member by annealing forming at least one print head module;
- forming a nozzle tip having a nozzle opening by cutting nozzles in one of the different members, carrying out the cutting step to form the nozzle tips with a straight edge face and performing a final precision smoothing and cleaning of the nozzle tips; and
- applying at least one conductor path and piezo-electrical elements to the at least one print head module and electrically connecting the piezo-electrical elements with the at least one conductor path applied to the at least one print head module forming an ink jet print head.
Priority Claims (1)
Number |
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42 25 799.9 |
Jul 1992 |
DEX |
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CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation of application Ser. No. 08/449,434, filed on May 24, 1995 now abandoned, which was a divisional of application Ser. No. 08/101,449, filed Aug. 2, 1993 now U.S. Pat. No. 5,592,203.
US Referenced Citations (22)
Foreign Referenced Citations (30)
Number |
Date |
Country |
0 013 095 |
Jul 1980 |
EPX |
0 067 889 |
Dec 1982 |
EPX |
0 067 653 |
Dec 1982 |
EPX |
0 090 663 |
Oct 1983 |
EPX |
0 326 804 |
Aug 1989 |
EPX |
0 326 568 |
Aug 1990 |
EPX |
0 486 256 |
May 1992 |
EPX |
0 575 204 |
Dec 1993 |
EPX |
0 581 395 |
Feb 1994 |
EPX |
2 349 555 |
Nov 1974 |
DEX |
26 49 970 |
May 1978 |
DEX |
27 52 378 |
Jun 1978 |
DEX |
29 18 737 |
Nov 1979 |
DEX |
32 22 133 |
Dec 1982 |
DEX |
32 00 388 |
Dec 1982 |
DEX |
32 48 087 |
Jul 1983 |
DEX |
34 45 761 |
Jun 1985 |
DEX |
37 10 654 |
Oct 1988 |
DEX |
38 03 432 |
Aug 1989 |
DEX |
38 05 279 |
Aug 1989 |
DEX |
38 14 720 |
Nov 1989 |
DEX |
33 22 647 |
Mar 1990 |
DEX |
31 50 109 |
Feb 1991 |
DEX |
40 25 193 |
Feb 1992 |
DEX |
42 07 626 |
Sep 1993 |
DEX |
42 25 799 |
Feb 1994 |
DEX |
63-28657 |
Feb 1988 |
JPX |
620 662 |
Dec 1980 |
SEX |
1 416 980 |
Dec 1975 |
GBX |
9209111 |
May 1992 |
WOX |
Non-Patent Literature Citations (5)
Entry |
Patent Abstract of Japan No. JP 59-229347 (Kawamura) Dec. 22, 1984. |
Patent Abstract of Japan No. JP 2-92644 (Narita) Apr. 3, 1990. |
Patent Abstract of Japan No. JP 61-225060 (Yamada), Oct. 6, 1986. |
Print Engine Design Publ., First Annual Ink Printig Workshop, Mar. 25-27, 1992 "Utilizing Impulse Ink . . . ". |
IBM Techn.Discl.Bulletin vol. 20,No. 3,Aug. 1977, pp. 1193-1195, "Wafer Sepration Into Nozzle Plates by . . . ". |
Divisions (1)
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Number |
Date |
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Parent |
101449 |
Aug 1993 |
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Continuations (1)
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449434 |
May 1995 |
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