Claims
- 1. A method of manufacturing an ultrasonic transducer, comprising:
- a single conductive pattern formation step which comprises forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second electrode and a second lead conductor integral with a second flexible substrate on a surface thereof, said second lead conductor extending along the surface of said second flexible substrate starting from a side edge of said second electrode;
- a bonding step of bonding said first and second electrodes to opposing first and second main surfaces of a piezoelectric member, which is formed from a piezoelectric polymer material or a piezoelectric polymer composite, by applying an adhesive to a surface of said first electrode and to a surface of said second electrode;
- said second flexible substrate being formed as a part of said first flexible substrate, and said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween; and
- a polarizing step of polarizing said piezoelectric member at least by applying a voltage across said first and second electrodes. PG,32
- 2. A method of manufacturing an ultrasonic transducer, comprising:
- a conductive pattern formation step of forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second lead conductor having an electrode contact portion at one end thereof on a second flexible substrate;
- a second electrode formation step of depositing a second electrode on a first main surface of a piezoelectric member formed from a piezoelectric polymer material or a piezoelectric polymer composite;
- a bonding step of bonding said first electrode to a second main surface of said piezoelectric member by applying an adhesive to a surface of said first electrode, and bonding said electrode contact portion to an edge portion of said second electrode by applying an adhesive to a surface of said second flexible substrate adjacent said electrode contact portion;
- said second flexible substrate being formed as a part of said first flexible substrate, and said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween; and
- a polarizing step of polarizing said piezoelectric member at least by applying a voltage across said first and second electrodes.
- 3. A method of manufacturing an ultrasonic transducer, comprising:
- a polarizing step of arranging first and second conductive plates so as to cover opposing first and second main surfaces of a piezoelectric member formed from a piezoelectric polymer material or a piezoelectric polymer composite, and polarizing said piezoelectric member at least by applying a predetermined voltage across said first and second conductor plates;
- a single conductive pattern formation step which comprises forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second electrode and a second lead conductor integral with a second flexible substrate on a surface thereof, said second lead conductor extending along the surface of said second flexible substrate starting from a side edge of said second electrode;
- said second flexible substrate being formed as a part of said first flexible substrate, and said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween; and
- a bonding step of bonding said first and second electrodes to the opposing first and second main surfaces of said piezoelectric member by applying an adhesive to a surface of said first electrode and to a surface of said second electrode.
- 4. A method of manufacturing an ultrasonic transducer, comprising:
- a conductive pattern formation step of forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second lead conductor having an electrode contact portion at one end thereof on a second flexible substrate;
- a second electrode formation step of depositing a second electrode on a first main surface of a piezoelectric member formed from a piezoelectric polymer material or a piezoelectric polymer composite;
- a polarizing step of arranging a conductive plate so as to cover a second main surface of said piezoelectric member, and polarizing said piezoelectric member at least by applying a predetermined voltage across said conductor plate and said second electrode;
- said second flexible substrate being formed as a part of said first flexible substrate, said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween; and
- a bonding step of bonding said first electrode to a second main surface of said piezoelectric member by applying an adhesive to a surface of said first electrode, and bonding said electrode contact portion to an edge portion of said second electrode by applying an adhesive to a surface of said second flexible substrate adjacent and electrode contact portion.
Priority Claims (2)
Number |
Date |
Country |
Kind |
59-199685 |
Sep 1984 |
JPX |
|
59-225126 |
Oct 1984 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 777,284 filed Sept. 18, 1985 now U.S. Pat. No. 4,701,659 filed Oct. 20, 1987.
US Referenced Citations (14)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1530783 |
Nov 1978 |
GBX |
2052918 |
Jan 1981 |
GBX |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 9, No. 193 Aug. 9, 1985. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
777284 |
Sep 1985 |
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