Claims
- 1. A method of manufacturing a connector for electrically connecting a plurality of printed circuit boards, the connector including an electrically conductive contact embedded in an insulative material, comprising the steps of:
- placing at least the trough portion of a resilient, substantially U-shaped, substantially pre-fabricated contact into a mold;
- injecting substantially molten insulative material into the mold; and
- allowing the insulative material to solidify.
- 2. The method of claim 1 further comprising the step of compressing the U-shaped, resilient contact before injecting the molten insulated material into the mold.
- 3. The method of claim 2 further comprising the step of relieving the compression of the U-shaped contact after the insulative material has solidified.
- 4. The method of claim 3 further comprising the step of manufacturing the U-shaped contact with a carrier strip proximate the ends of each leg of the U-shaped contact.
- 5. The method of claim 4 further comprising the step of detaching the carrier strips from the ends of each leg after the insulative material has solidified.
- 6. The method of claim 1 further comprising the step of skieving off flash that may have accumulated on the legs of the U-shaped contact after the insulative material has solidified.
- 7. The method of claim 1 wherein said contact is metallic.
- 8. The method of claim 7 further comprising the step of manufacturing said contact from a pre-plated material.
- 9. The method of claim 1 further comprising the step of removing the connector from the mold after the insulative material has solidified.
- 10. A method of manufacturing a connector, comprising the steps of:
- a) providing a pre-fabricated, U-shaped metallic contact having a pair of sides connected by a trough and a carrier strip extending from each side of the U-shaped contact;
- b) compressing the sides of the U-shaped contact by depressing the carrier strips;
- c) positioning at least the trough of the U-shaped contact in a mold of the connector using the depressed carrier strips;
- d) injecting molten insulative material into the mold; and
- e) allowing the insulative material to harden.
- 11. The method of claim 10 further comprising the step of skieving off flash that may have accumulated on the sides of the U-shaped contact after the insulative material has solidified.
- 12. The method of claim 10 further comprising the step of detaching the carrier strips from each side of the U-shaped contact after the insulative material has solidified, thereby relieving the compression on the sides of the U-shaped contact.
- 13. The method of claim 12 further comprising the step of removing the connector from the mold after the carrier strips have been detached.
- 14. The method of claim 10 wherein the U-shaped contact is resilient.
Parent Case Info
This is a continuation application of application Ser. No. 08/139,605, filed Oct. 20, 1993 now U.S. Pat. No. 5,479,320, which is a continuation application of application Ser. No. 07/815,399, filed Dec. 31, 1991, now abandoned.
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Continuations (2)
|
Number |
Date |
Country |
Parent |
139605 |
Oct 1993 |
|
Parent |
815399 |
Dec 1991 |
|