This application claims priority from European Patent Application No. 09180782.6 filed Dec. 28, 2009, the entire disclosure of which is incorporated herein by reference.
The present invention concerns a method of manufacturing complex electronic cards each including a first electronic unit, at least partially arranged in a window in a solid layer of the card, and a second electronic unit electrically connected to the first electronic unit and incorporated in an internal layer formed by a filler material which covers at least one of the surfaces of said second electronic unit. In particular, the filler material is a resin, provided in a non solid state during the manufacturing process or a resin provided in the form of at least partially melted hot melt sheets, so as form an internal layer of the card. It will be noted that the internal layer formed by the filler material can contain other solid structures or elements, in particular positioning or filler structures for said internal layer.
“Electronic card” means a bank type card and also other devices in various forms, particularly an electronic tag or a portable electronic device.
A method is already known from EP Patent No. 1,559,068 for manufacturing electronic modules which each include two insulating sheets defining the external faces thereof, at least one electronic element having an external surface that substantially touches one of the external surfaces of the electronic module and an electronic circuit arranged between the two insulating sheets and connected to the electronic element. This method provides the following steps:
The manufacturing method described above solves an important problem, namely, preventing the filler material, generally formed by a resin which is in a viscous liquid state when pressure is applied to form the electronic module, from flowing into any slit between the electronic element and the lateral wall of the window in which it is arranged, so as to prevent the resin extending at least partially onto the visible external surface of the electronic element. However, the manufacturing method presents a problem in relation to the sequence of steps, in particular the fact that the electrical connection between the visible electronic element and the internal electronic unit is achieved once the electronic element has been inserted in a window in an external insulating layer of the card being manufactured and the adhesive protective layer is in place. This sequence of steps raises a practical problem given that card manufacturing equipments or facilities are not generally equipped with a device for welding or assembling various electronic units. Indeed, generally, the various electronic circuits and elements are first assembled to form electronic devices and then these electronic devices are taken to a conventional card manufacturing equipment or facility in which the various materials used to form the cards are provided and processed in an appropriate manner to obtain high quality electronic cards into which the electronic devices are respectively incorporated. The aforecited patent of the prior art does not propose temporally separating production of the electronic devices from the manufacture of the cards incorporating these electronic devices. Although the method described in the aforecited document can be implemented and used to obtain complex electronic cards, it has a major drawback for those skilled in the art specialised in manufacturing finished electronic cards or inlets, who prefer to separate the production of the electronic devices from the card forming process.
It is an object of the present invention to overcome the major drawback of the prior art method mentioned above.
The electronic card manufacturing method according to the invention is mainly characterized in that the electronic assembly or device, formed by at least a first electronic unit provided in a window in a solid layer of the card and by a second electronic unit arranged in an inner layer or the body of said card, is manufactured first, prior to production of the electronic cards; i.e. before the solid layers and other materials forming the body of the card are added. Thus, the electronic device incorporated into each card is made in a preliminary step, in accordance with a conventional process. In order to do this, various ways of implementing the card manufacturing method are proposed. In particular, according to the invention the protective film is formed of several parts or a single part with at least one slit.
If the protective film is in several parts, these parts have complementary profiles that can cover the external edge of a rear face of the first electronic unit, while extending into the entire peripheral zone of said first electronic unit and defining a window allowing the electrical connection between the first and second electronic units to pass through. This window thus has smaller dimensions than those of the first electronic unit. Thus, once the electronic device has been taken to the card manufacturing equipment or facility and the first electronic unit has been at least partially inserted into a window in the first solid layer, the protective film can properly cover any slit between the lateral wall of the window and the first electronic unit.
If the protective film is formed of a single part with at least one slit, this slit is either a through slit between a central window in the film and the outer edge thereof, said slit thus being able to be moved aside to allow the electrical connection to pass inside said central window, or, when the slit is not a through slit, it is arranged such that the first or second electronic unit can pass through the central window in the protective film by moving aside the parts of said protective film located at the edge of said window.
The electronic card manufacturing method according to the invention includes three main implementation modes. In a first implementation mode of the invention, as described in claim 1 annexed to this description of the invention, the electronic device, formed of at least first and second pre-assembled electronic units, is first of all brought to the card manufacturing equipment or facility where the first electronic unit is placed in a window in a first solid layer. Next, a protective film of the type described above is provided and arranged so as to cover essentially any slits that may exist between the first electronic unit and the lateral wall of the window.
According to the second implementation mode defined in claim 2 annexed to this description of the invention, the electronic assembly or device is first of all made and then, before the electronic device is provided on a first solid layer and the first electronic unit is arranged in the window in said solid layer, the protective film is assembled to said electronic device so that the electrical connection is located in a window defined by the protective film and so that the latter is thus located between the first and second electronic units. Next, the pre-assembled electronic device and protective film are taken to the card manufacturing equipment or facility where said solid layer is provided, the first electronic unit is conveniently inserted in the aperture provided in the solid layer, and the protective film is applied across a zone peripheral to the window and, if this has not been previously done, at least against the lateral surface and/or the outer edge of a rear face of the first unit. In a variant of this second embodiment, a protective film is first of all assembled to said first unit by applying said film at least against the outer edge of a rear face of said first unit, then an electrical connection is established with the second electronic unit through an aperture in said film before the protective film pre-assembled with the electronic device is taken to a card manufacturing equipment or facility where the first solid layer is added.
According to the third implementation mode of the invention, as defined in claim 6 annexed to this description of the invention, firstly the electronic assembly or device is manufactured, formed of at least the first and second electrically connected electronic units, and then a structure including a protective film having at least one window, which has smaller dimensions than those of the first electronic unit and has flaps at the periphery thereof, separated by slits, and a first solid layer having at least one window for at least partially receiving the first electronic unit. Said protective film is assembled to the first solid layer with said at least one aperture centred on said at least one window. Next, said structure and said electronic device are taken to a equipment or facility and the first electronic unit is placed opposite said aperture, then said first unit is pushed into said window by folding said flaps towards the lateral wall of the aperture until the flaps are released and then moved back up at least partially in the direction of the general plane of the protective film. Next, the first unit is moved back up in the direction of said aperture and said flaps are at least partially applied against the lateral surface and/or a rear face of said first unit, so as to close any slits between the lateral wall of the window and the first unit, said electrical connection passing through said aperture.
Finally, in the method according to the invention a filler material is provided on the protective film, in particular a resin, which is at least partially in a non solid state when a layer or body of the cards is at least partially formed by the filler material, the latter at least partially covering said electrical connection of said electronic assembly or device.
It will be noted that, in a variant, the protective film has an adhesive surface that holds it in place and also, in a subsequent step of depositing a filler material at least partially covering the electronic connection, prevents said filler material from infiltrating underneath the protective film and thus flowing into the window. Other variants for holding the protective film in place can be envisaged. For example, the solid layer may have an adhesive top surface in the area provided for the protective film. In another variant, the protective film is thermally welded to the solid layer, particularly in several specific areas.
Various variants of the manufacturing method according to the invention form the subject of the dependent claims.
Other features and advantages of the electronic card manufacturing method according to the invention will also appear from the following detailed description of implementation modes of this method, this description being made with reference to the annexed drawings, given by way of non-limiting example and in which:
With reference to
In a preliminary step of this card manufacturing method, a first electronic unit 4 is assembled to a second electronic unit 10 to form electronic assembly or device 40. Electronic unit 10 is formed of a PCB type support 12 at the surface of which various components 14, 15 and 16 are arranged. These electronic circuits can be formed of any type of component and may have various functions. Component 14 can for example be a micro-processor, component 15 a display and component 16 a battery. It will be noted that the second electronic unit 10 can also, in a variant, form a battery or, in another variant, form an antenna. It will also be noted that the first electronic unit can be formed by a single external electric contact pad connected to an internal electronic unit of the card.
PCB 12 can be rigid or flexible. This support 12 is extended by a tongue 18 which is flexible, or at least capable of undergoing elastic deformation. Conductive paths 20 and 21 for establishing electrical connections between unit 10 and unit 4 are arranged on tongue 18. For this purpose, unit 4 has electrical connection pads 22 to which end pads 20a and 21A of paths 20 and 21 are electrically connected, particularly by tin welding or using a conductive adhesive. The tin can be deposited beforehand in the form of a thin film at the surface of contact pads 22. It will be noted that, according to the terminology used for this description of the invention, tongue 18 fitted with conductive paths forms an electrical connection between the first electronic unit 4 and the second electronic unit 10. It will be noted that the electrical connection described here is an advantageous example, but that any type of electrical connection between two electronic units known to those skilled in the art can be envisaged. In particular, more than two conductive paths or electrical connections can be provided between the two units. Tongue 18 can act as a support for a large number of electric connection paths between the two electronic units.
After electronic device 40 has been formed, a protective film in two parts 24 and 26 is provided, the respective profiles of said parts defining, when assembled, a central aperture 32 into which electrical connection 18 passes, said aperture having smaller dimensions than those of first electronic unit 4. The two part protective film is arranged between the first and second electronic units 4 and 10, with electrical connection 18 passing through aperture 32. In the variant shown, the two parts have a general U shape. In another variant, only one of the two parts is U-shaped or both parts are L-shaped. The protective film has a zone peripheral to aperture 32 which is applied against the outer edge 5 of the rear face of first electronic unit 4. Protective film 24, 26 then extends into a zone peripheral to first unit 4 as shown in
Electronic devices 40 fitted with the protective film are then taken to an electronic card production equipment or facility where several cards or inlets are generally manufactured simultaneously in the form of a plate or sheet. In the equipment or facility, a first solid layer is provided, said layer having at least one window 6 provided for each card and intended to receive at least partially the first unit 4 of electronic device 40. Each unit 4 is thus placed in a window 6 in solid layer 8. The protective film is then applied against the peripheral zone of window 6 so as to close any slit 28 between the lateral wall 30 of said window and first unit 4. To ensure that slit 28 is entirely closed by the protective film, the two parts 24 and 26 thereof have a zone 34 where the parts are superposed, part 26 having a region that partially covers part 24. In a variant, it is, however, possible to omit the overlapping zone, but to assembly the two parts properly side by side without leaving any space between them.
In a subsequent step, a filler material 42 is provided on first solid layer 8 and on the protective film, and pressure is for example applied to the filler material which is then in a non solid state, to form a layer of the electronic cards being manufactured, with the filler material surrounding electrical connection 18.
In the variant shown in
It will be noted that the electronic device can include more than two units, in particular at least two units at least partially arranged in respective windows in one or two solid layer(s) so as to be visible.
Protective film 54 of the variant shown in
The filler material provided to form the core of the card or an internal layer of said card is preferably formed by a resin deposited in viscous liquid state or in the form of a hot melt solid which is then at least partially melted so as to coat second electronic unit 10. According to a preferred implementation of the step of forming the core or internal layer of the card, firstly the second units 10 are rotated by elastically folding electrical connection 18, units 10 then being turned onto their top side on the other side of aperture 6 relative to the side provided for these units in the centre of the finished card. In a variant, units 10 are simply raised by suitable means and placed for example momentarily in a substantially vertical position. Next, a first part of the filler material is placed on bottom solid sheet 8, so that this first resin part at least partly covers the areas of said layer 8 where units 10 will eventually be arranged. Then, electronic units 10 are folded down or rotated again onto the bottom side thereof and placed on the first part of the filler material deposited beforehand. A second part of the filler material is then placed on units 10 so that the filler material completely coats the units and most of electrical connection 18. This method ensures that the filler material is present underneath components 14 to 16 of unit 10. This thus avoids some parts of bottom layer 8 not being coated with resin; which could then cause subsequent surface deformation problems for the finished card.
According to an alternative implementation of the method of the invention, in particular in the situation described with reference to
According to another alternative implementation of the method according to the invention, in the aforementioned case where support 12 of the second electronic unit 10A is provided underneath the electronic components of the second unit, a resin film 60 is deposited beforehand underneath support 12. This resin film may be similar in nature to a resin film 62 deposited underneath protective film 50 (
According to the embodiment of the electronic device 40A of
It will also be noted that resin film 60 located between layer 8A and support 12 can be identical to resin 42 forming the internal layer of the card. Adhesive film 60 can be made to adhere to the bottom layer by applying heat through said layer.
With reference to
Then, as in the first implementation mode of the invention, a filler material, particularly a resin, is deposited on the first solid layer 8 and protective film 50, and the filler material is spread out in a non solid state to form a layer of the electronic cards, said filler material then covering the second electronic unit 10B.
The card variant shown in
It will be noted that, in the various card embodiments described above, the dimensions of the protective film are limited such that it does not extend underneath the whole of the second electronic unit incorporated in the resin layer. In particular, the protective film has reduced dimensions and is not superposed on the second internal unit incorporated in the resin layer. This thus avoids having a film covering most of the bottom solid layer and thus forming an interface between the resin layer and the bottom solid layer. Even if the protective film has adhesive or heat-reactivatable surfaces, the adherence of the film to the bottom solid layer may be reduced. A protective film passing through the card could thus cause peeling problems for the bottom solid layer.
With reference to
Protective film 76 is made for several batch manufactured cards, in the form of a plate from which the cards are then cut out. This film 76 has apertures 32A for the electrical connections 64, of electronic assemblies or devices 40C incorporated in the cards, to pass through, and preferably apertures 78 in the zones provided for the second electronic units 10C. Each aperture 32A has four flaps 80a to 80d defined by four slits 82 provided in the corners of said aperture 32A. It will be noted that the protective film is very thin here.
In a first step of the card production method, film 76 is assembled by lamination, preferably hot lamination, with a solid layer 8 having apertures 6 for receiving respectively the first units 4 of the prefabricated electronic assemblies or devices 40C. This solid layer and the protective film thus adhere securely to each other. Apertures 32A are centred on apertures 6. Flaps 80a-80d are then located along the perimeter of each aperture 6 in the general plane of protective film 76. It will be noted that the slits can be made after the lamination step, particular in the case of hot lamination.
Next, the electronic devices 40C are placed on the structure formed of bottom layer 8 and protective film 76 (
In a variant that is not shown, the first electronic unit has a narrowed portion in the internal part thereof, this narrowed portion defining, on the top internal surface of solid layer 8, a horizontal peripheral surface of said first unit substantially in the plane of said top internal surface while the height of the first first unit can be considerably greater than the thickness of the solid layer. When the first unit is moved up into its final position, the flaps of the protective film are then located on said peripheral surface of said first unit in a horizontal position. The slits in the corners of the aperture can thus be properly closed since the flaps are located in the general plane of the protective film; which guarantees a high level of sealing when the filler material passes in its non solid state, in particular a resin in a viscous liquid state.
It will be noted that, in the variant shown in
Number | Date | Country | Kind |
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09180782.6 | Dec 2009 | EP | regional |